500 MILLION PARTS FROM 12000 MANUFACTURERS

Datasheet Archive - Datasheet Search Engine

 

Direct from the Manufacturer

Part Manufacturer Description PDF Samples Ordering
AMBIENTLIGHTADAPTIVELED-REF Texas Instruments Ambient Light Adaptive LED Driver pdf Buy

Thermal Resistance to ambient SMB Case

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Figure 6. impedance junction to case versus pulse duration (SMB) Relative variation of thermal , . Thermal resistance, junction to Figure 14. ambient, versus copper surface under each lead - SMA (Epoxy , resistance, junction to ambient, versus copper surface under each lead - SMB (Epoxy FR4, copper thickness , 5 Figure 15. Thermal resistance, junction to ambient, versus copper surface under each lead - , 4.5 5.0 Figure 16. Thermal resistance, junction to ambient, versus copper surface under each ... STMicroelectronics
Original
datasheet

10 pages,
113.07 Kb

Thermal Resistance to ambient SMB Case STTH1R02 TEXT
datasheet frame
Abstract: variation of thermal Figure 6. impedance junction to case versus pulse duration (SMB) Relative variation of thermal impedance junction to case versus pulse duration (DO-41 DO-41) Zth(j-a) /Rth(j-a) Zth , . Figure 13. Thermal resistance, junction to ambient, versus copper surface under each lead - SMA (Epoxy , Figure 15. Thermal resistance, junction to ambient, versus copper surface under each lead - DO 15 , 5.0 Figure 16. Thermal resistance, junction to ambient, versus copper surface under each lead - ... STMicroelectronics
Original
datasheet

10 pages,
151.91 Kb

STTH1R02U smb marking stmicroelectronics st smb package marking STTH STTH1R02 STTH1R02Q STTH1R02QRL STTH1R02RL STTH1R02A do-41 footprint do-15 footprint TEXT
datasheet frame
Abstract: thermal Figure 6. impedance junction to case versus pulse duration (SMB) 1.0 Relative variation of , ) Tj(°C) 0.0 25 50 75 100 125 150 1000 Figure 13. Thermal resistance, junction to ambient, versus , resistance, junction to ambient, versus copper surface under each lead - SMB (Epoxy FR4, ecu = 35 um) Rth , ²) DO-15 DO-15 Figure 16. Thermal resistance, junction to ambient, versus copper surface under each lead - , . Relative variation of thermal impedance junction to case versus pulse duration (SMA) IFM(A) 50 1.0 0.9 ... STMicroelectronics
Original
datasheet

10 pages,
153.68 Kb

Thermal Resistance to ambient SMB Case STTH1R02 TEXT
datasheet frame
Abstract: 10 100 Figure 17. Thermal resistance junction to ambient versus copper surface under each , 0.7 0.8 0.9 1.0 Figure 18. Thermal resistance junction to ambient versus copper surface , ) condition to avoid thermal runaway for a diode on its own heatsink Thermal resistance Symbol Parameter Value SMB Rth(j-c) Table 3. Symbol IR(1) SMB flat Junction to case 20 5.5 , . Relative variation of thermal impedance junction to ambient versus pulse duration (DPAK) Zth(j-a)/Rth ... STMicroelectronics
Original
datasheet

11 pages,
124.39 Kb

marking code u34 s34 diode S340 smb marking stmicroelectronics st e u34 st s34 schottky diode ST S340 STPS340 STPS340UF STPS340B STPS340B-TR STPS340S STPS340U u34 diode Thermal Resistance to ambient SMB Case U34 marking stps340 smb package code diode marking u34 s34 schottky diode u34 schottky diode ST TEXT
datasheet frame
Abstract: variation of thermal impedance junction to ambient versus pulse duration (SMB) δ=tp/T 0.0 1 , values) VR(V) VFM(V) 0 10 1 10 100 Figure 17. Thermal resistance junction to ambient , STPS340 STPS340 Figure 19. Thermal resistance junction to ambient versus copper surface under each lead , ) condition to avoid thermal runaway for a diode on its own heatsink Thermal resistance Symbol Parameter Value SMB Rth(j-c) Table 3. Symbol IR(1) SMB flat Junction to case 20 5.5 ... STMicroelectronics
Original
datasheet

11 pages,
125.46 Kb

STPS340 TEXT
datasheet frame
Abstract: : Relative variation of thermal impedance junction to case versus pulse duration (SMB) 1.E-01 1 , reverse voltage applied (typical values) Figure 14: Thermal resistance junction to ambient versus , 8 9 10 Figure 15: Thermal resistance junction to ambient versus copper surface under each , Resistance Symbol Rth(j-a) Note 1: L = 10mm L = 10mm Junction to ambient (1) Unit DO , variation of thermal impedance junction to case versus pulse duration (DO-41 DO-41) 0 1 2 3 4 ... STMicroelectronics
Original
datasheet

9 pages,
80.01 Kb

STTH1R06U STTH1R06B STTH1R06A STTH1R06 Part Marking STMicroelectronics hr6 STTH1R06RL TEXT
datasheet frame
Abstract: thermal impedance, junction to ambient, versus pulse duration (SMB) Zth(j-a) /Rth(j-a) 1.0 1.0 , ) Figure 16. Thermal resistance, junction to ambient, versus copper surface under tab - SMC (Epoxy , -220FPAC -220FPAC 6.5 20 SMC Junction to case 20 DO-201AB DO-201AB Rth(j-c) 3.5 SMB 20 Unit °C/W , variation of thermal impedance, junction to case, versus pulse duration (T0-220AC T0-220AC, DPAK) Zth(j-c)/Rth , 3.0 3.5 Relative variation of thermal impedance, junction to case, versus pulse duration (TO ... STMicroelectronics
Original
datasheet

13 pages,
129.23 Kb

STTH4R02U STTH STTH4R02 STTH4R02B STTH4R02B-TR STTH4R02D STTH4R02RL STTH4R02FP STTH4R02S do-201 footprint 4R2S TEXT
datasheet frame
Abstract: voltage applied (Typical values). C(pF) Fig. 8-1: Thermal resistance junction to ambient versus , (j-a) (°C /W ) Fig. 8-2: Thermal resistance junction to ambient versus copper surface under each , Fig. 8-3: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed , CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE EXTREMELY , suited for Switch Mode Power Supplies and high frequency DC to DC converters. SMB (JEDEC DO ... OCR Scan
datasheet

7 pages,
92.46 Kb

STPS340U/S/B TEXT
datasheet frame
Abstract: thermal impedance junction to ambient versus pulse duration (SMB) Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 , 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 17. Thermal resistance junction to ambient , 90 80 70 60 50 DPAK Figure 18. Thermal resistance junction to ambient versus copper surface under , Figure 19. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed , thermal runaway for a diode on its own heatsink Table 2. Symbol Thermal resistance Parameter SMB ... STMicroelectronics
Original
datasheet

12 pages,
195.12 Kb

ST S340 s340 diode u34 st st u34 st e u34 marking U34 s34 schottky diode u34 diode ST st s34 schottky diode u34 schottky diode ST STPS340 TEXT
datasheet frame
Abstract: : Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, eCU=35um) (DO , Junction to ambient (1) Unit DO-41 DO-41 45 °C/W 30 SMB Junction to lead Value (max). , variation of thermal impedance junction to case versus pulse duration (SMA) Zth(j-c)/Rth(j-c) Zth , impedance junction to case versus pulse duration (SMB) 1.E-01 1.E+00 1.E+01 1.E+02 1 , Low reverse recovery current Low thermal resistance Reduces switching & conduction losses ... STMicroelectronics
Original
datasheet

9 pages,
82.19 Kb

STTH1R06U STTH1R06A STTH1R06 smb marking stmicroelectronics BR6 st Part Marking STMicroelectronics hr6 STTH1R06B STMicroelectronics BR6 STTH1R06RL TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
leads SMC 20 5 C/W SMB 25 R th (j-c) Junction to case DPAK 5.5 5C/W THERMAL RESISTANCES STPS340U/S/B STPS340U/S/B 2 : Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4 : Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4 ) Fig. 8-3 : Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed : Relative variation of thermal transient impedance junction to lead versus pulse duration (SMB). 1E-3 1E-2
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/3624-v2.htm
STMicroelectronics 14/06/1999 8.38 Kb HTM 3624-v2.htm
: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board ambient temperature (d =0.5) . Symbol Parameter Value Unit R th (j-l) Junction to leads SMC 20 5 C/W SMB 25 R th (j-c) Junction to case DPAK 5.5 5C/W THERMAL RESISTANCES STPS340U/S/B STPS340U/S/B 2/7 1E-3 1E-2 1E-1 1E+0 4 5 0 20 40 60 80 100 120 S(Cu) (cm ) Rth(j-a) (5C/W) Fig. 8-1 : Thermal resistance junction to ) (SMB). 0 1 2 3 4 5 0 20 40 60 80 100 Rth(j-a) (5C/W) S(Cu) (cm ) Fig. 8-2 : Thermal resistance junction
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/3624.htm
STMicroelectronics 20/10/2000 10.84 Kb HTM 3624.htm
leads SMC 20 5 C/W SMB 25 R th (j-c) Junction to case DPAK 5.5 5C/W THERMAL RESISTANCES STPS340U/S/B STPS340U/S/B 2 : Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4 : Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4 ) Fig. 8-3 : Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed : Relative variation of thermal transient impedance junction to lead versus pulse duration (SMB). 1E-3 1E-2
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/3624-v1.htm
STMicroelectronics 02/04/1999 8.42 Kb HTM 3624-v1.htm
) Fig. 8-1 : Thermal resistance junction to ambient versus copper surface under each lead (Epoxy (j-a) (5C/W) S(Cu) (cm ) Fig. 8-2 : Thermal resistance junction to ambient versus copper surface (j-l) Junction to leads SMC 20 5 C/W SMB 25 R th (j-c) Junction to case DPAK 5.5 5C/W Switch Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, SMC and DPAK this VOLTAGE DROP LOW THERMAL RESISTANCE EXTREMELY FAST SWITCHING SURFACE MOUNTED DEVICE Symbol
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/3624-v3.htm
STMicroelectronics 25/05/2000 10.23 Kb HTM 3624-v3.htm
1E+1 1E+2 5E+2 1 10 100 Zth(j-a)(5CW) tp(s) Fig 4 : Variation of thermal impedance junction to ambient ensuring protection n Board space saving BENEFITS SMB SMP100LC-xxx 2 /8 Symbol Parameter Value Unit R th(j-I) Junction to leads 20 5C/W R th(j-a) Junction to ambient on printed circuit (with standard footprint dimensions) 100 5C/W THERMAL RESISTANCES Symbol Parameter Value Unit I pp Repetitive peak pulse resistance to insert on the module line to withstand the standard. SMP100LC-xxx 3 /8 Type I RM @ V RM max. I
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/7050.htm
STMicroelectronics 20/10/2000 11.23 Kb HTM 7050.htm
downstream. II.4 - BEHAVIOUR IN CASE OF CURRENT SURGES The ability of semiconductor components to withstand j : instant temperature at the junction level T a : ambient temperature Z th : transient thermal Transient Currents for a Transil and a Trisil in the Same Case (SMB). The maximum junction temperature taken that of the avalanche mechanism and the continuous thermal resistance replacing the transient thermal functions in transient operation : to limit the voltage and to deviate the surge current. If the first
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5649-v2.htm
STMicroelectronics 14/06/1999 13.55 Kb HTM 5649-v2.htm
downstream. II.4 - BEHAVIOUR IN CASE OF CURRENT SURGES The ability of semiconductor components to withstand j : instant temperature at the junction level T a : ambient temperature Z th : transient thermal Transient Currents for a Transil and a Trisil in the Same Case (SMB). The maximum junction temperature taken that of the avalanche mechanism and the continuous thermal resistance replacing the transient thermal functions in transient operation : to limit the voltage and to deviate the surge current. If the first
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5649-v1.htm
STMicroelectronics 02/04/1999 13.59 Kb HTM 5649-v1.htm
the junction level T a : ambient temperature Z th : transient thermal impedance (as a function of the and a Trisil in the Same Case (SMB). The maximum junction temperature taken into account in transient corresponds, with a certain safety margin, to the second breakdown due to thermal causes, i.e. about 350 - 400 the avalanche mechanism and the continuous thermal resistance replacing the transient thermal : to limit the voltage and to deviate the surge current. If the first function is perfectly carried out
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5649.htm
STMicroelectronics 20/10/2000 16.02 Kb HTM 5649.htm
CASE OF CURRENT SURGES The ability of semiconductor components to withstand high currents in : instant temperature at the junction level T a : ambient temperature Z th : transient thermal : Comparison of the Limit Transient Currents for a Transil and a Trisil in the Same Case (SMB). The maximum second breakdown due to thermal causes, i.e. about 350 - 400 5C. This high current capacity can be voltage which is that of the avalanche mechanism and the continuous thermal resistance replacing the
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5649-v3.htm
STMicroelectronics 25/05/2000 15.39 Kb HTM 5649-v3.htm
worries about mounting temperature sensors to IC packages, thermal time constants, and having to do thermal resistance calculations. This circuit (and others shown later , the temperature sensor is used to measure ambient temperature by mounting the sensor at the short. In the case of open-loop temperature control, the system has no way to indication of problems, it may take a while before these problems are noticed due to slow thermal
/datasheets/files/maxim/0012/view_036.htm
Maxim 04/04/2001 46.32 Kb HTM view_036.htm