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Thermal Resistance to ambient SMB Case

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Abstract: Figure 6. impedance junction to case versus pulse duration (SMB) Relative variation of thermal , . Thermal resistance, junction to Figure 14. ambient, versus copper surface under each lead - SMA (Epoxy , resistance, junction to ambient, versus copper surface under each lead - SMB (Epoxy FR4, copper thickness , 5 Figure 15. Thermal resistance, junction to ambient, versus copper surface under each lead - , 4.5 5.0 Figure 16. Thermal resistance, junction to ambient, versus copper surface under each STMicroelectronics
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STTH1R02 DO-15 STTH1R02Q DO-41 STTH1R02A STTH1R02U
Abstract: variation of thermal Figure 6. impedance junction to case versus pulse duration (SMB) Relative variation of thermal impedance junction to case versus pulse duration (DO-41) Zth(j-a) /Rth(j-a) Zth , . Figure 13. Thermal resistance, junction to ambient, versus copper surface under each lead - SMA (Epoxy , Figure 15. Thermal resistance, junction to ambient, versus copper surface under each lead - DO 15 , 5.0 Figure 16. Thermal resistance, junction to ambient, versus copper surface under each lead - STMicroelectronics
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STTH1R02RL STTH1R02QRL do-15 footprint do-41 footprint STTH st smb package marking
Abstract: thermal Figure 6. impedance junction to case versus pulse duration (SMB) 1.0 Relative variation of , ) Tj(°C) 0.0 25 50 75 100 125 150 1000 Figure 13. Thermal resistance, junction to ambient, versus , resistance, junction to ambient, versus copper surface under each lead - SMB (Epoxy FR4, ecu = 35 um) Rth , ²) DO-15 Figure 16. Thermal resistance, junction to ambient, versus copper surface under each lead - , . Relative variation of thermal impedance junction to case versus pulse duration (SMA) IFM(A) 50 1.0 0.9 STMicroelectronics
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Abstract: 10 100 Figure 17. Thermal resistance junction to ambient versus copper surface under each , 0.7 0.8 0.9 1.0 Figure 18. Thermal resistance junction to ambient versus copper surface , ) condition to avoid thermal runaway for a diode on its own heatsink Thermal resistance Symbol Parameter Value SMB Rth(j-c) Table 3. Symbol IR(1) SMB flat Junction to case 20 5.5 , . Relative variation of thermal impedance junction to ambient versus pulse duration (DPAK) Zth(j-a)/Rth STMicroelectronics
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STPS340 STPS340B STPS340U STPS340S STPS340UF STPS340B-TR u34 schottky diode ST s34 schottky diode diode marking u34 stps340 smb package code U34 marking u34 diode
Abstract: variation of thermal impedance junction to ambient versus pulse duration (SMB) δ=tp/T 0.0 1 , values) VR(V) VFM(V) 0 10 1 10 100 Figure 17. Thermal resistance junction to ambient , STPS340 Figure 19. Thermal resistance junction to ambient versus copper surface under each lead , ) condition to avoid thermal runaway for a diode on its own heatsink Thermal resistance Symbol Parameter Value SMB Rth(j-c) Table 3. Symbol IR(1) SMB flat Junction to case 20 5.5 STMicroelectronics
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Abstract: : Relative variation of thermal impedance junction to case versus pulse duration (SMB) 1.E-01 1 , reverse voltage applied (typical values) Figure 14: Thermal resistance junction to ambient versus , 8 9 10 Figure 15: Thermal resistance junction to ambient versus copper surface under each , Resistance Symbol Rth(j-a) Note 1: L = 10mm L = 10mm Junction to ambient (1) Unit DO , variation of thermal impedance junction to case versus pulse duration (DO-41) 0 1 2 3 4 STMicroelectronics
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STTH1R06 STTH1R06A STTH1R06U STTH1R06RL Part Marking STMicroelectronics hr6 STTH1R06B
Abstract: thermal impedance, junction to ambient, versus pulse duration (SMB) Zth(j-a) /Rth(j-a) 1.0 1.0 , ) Figure 16. Thermal resistance, junction to ambient, versus copper surface under tab - SMC (Epoxy , -220FPAC 6.5 20 SMC Junction to case 20 DO-201AB Rth(j-c) 3.5 SMB 20 Unit °C/W , variation of thermal impedance, junction to case, versus pulse duration (T0-220AC, DPAK) Zth(j-c)/Rth , 3.0 3.5 Relative variation of thermal impedance, junction to case, versus pulse duration (TO STMicroelectronics
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STTH4R02 STTH4R02FP STTH4R02D STTH4R02B STTH4R02U STTH4R02S 4R2S do-201 footprint STTH4R02RL
Abstract: voltage applied (Typical values). C(pF) Fig. 8-1: Thermal resistance junction to ambient versus , (j-a) (°C /W ) Fig. 8-2: Thermal resistance junction to ambient versus copper surface under each , Fig. 8-3: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed , CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE EXTREMELY , suited for Switch Mode Power Supplies and high frequency DC to DC converters. SMB (JEDEC DO -
OCR Scan
STPS340U/S/B DO-214AA DO-214AB
Abstract: thermal impedance junction to ambient versus pulse duration (SMB) Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 , 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 17. Thermal resistance junction to ambient , 90 80 70 60 50 DPAK Figure 18. Thermal resistance junction to ambient versus copper surface under , Figure 19. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed , thermal runaway for a diode on its own heatsink Table 2. Symbol Thermal resistance Parameter SMB STMicroelectronics
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st s34 schottky diode u34 diode ST marking U34 st e u34 st u34 u34 st
Abstract: : Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, eCU=35um) (DO , Junction to ambient (1) Unit DO-41 45 °C/W 30 SMB Junction to lead Value (max). , variation of thermal impedance junction to case versus pulse duration (SMA) Zth(j-c)/Rth(j-c) Zth , impedance junction to case versus pulse duration (SMB) 1.E-01 1.E+00 1.E+01 1.E+02 1 , Low reverse recovery current Low thermal resistance Reduces switching & conduction losses STMicroelectronics
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STMicroelectronics BR6 BR6 st smb marking stmicroelectronics
Abstract: 3. Thermal resistance Symbol Parameter Value SMB Rth(j-c) SMBflat Junction to case , resistance junction to Figure 18. Thermal resistance junction to ambient versus copper surface under each , 2.5 3.0 3.5 4.0 4.5 5.0 Figure 19. Thermal resistance junction to ambient versus , 10. Relative variation of thermal impedance junction to ambient versus pulse duration (DPAK) Zth , . Relative variation of thermal impedance junction to ambient versus pulse duration (SMC) Zth(j-a)/Rth STMicroelectronics
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ID3624
Abstract: voltage of 4.0VDC. 2. Thermal Resistance junction to ambient, 10.0*10.0 mm2 copper pads to each terminal. 2 Thermal Resistance junction to case, 10.0*10.0 mm copper pads to each terminal. SYMBOLS FM301B , .086(2.20) .075(1.91) .115(3.94) .130(3.30) Case: Molded Plastic, SMB(DO214AA) Epoxy: UL 94V-0 , DC Reverse Current at Rated DC Blocking Voltage Typical Thermal Resistance (Note 2 ) Typical Junction , 3.0 Amp Glass Passivated Silicon Rectifiers - 50~1000Volts SMB Package FM301% THRU FM307 Willas Electronic
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MARKING CODE 3B3 1000V MIL-STD-202
Abstract: 10 20 50 Fig. 8-1: Thermal resistance junction to ambient versus copper surface under each , 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Fig. 8-2: Thermal resistance junction to ambient versus copper , ²) 0 0 1 2 3 4 5 Fig. 8-3: Thermal resistance junction to ambient versus copper , STPS340U/S/B THERMAL RESISTANCES Symbol Rth (j-l) SMC Junction to case 25 DPAK Junction , thermal transient impedance junction to lead versus pulse duration (SMB). Zth(j-a)/Rth(j-a) 1.0 0.9 STMicroelectronics
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S340 u34 schottky
Abstract: 0.0 25 50 75 100 125 Tj(°C) 150 Figure 13. Thermal resistance, junction to ambient, versus , 80 70 60 50 DPAK Figure 14. Thermal resistance, junction to ambient, versus copper surface under , -220AC / DPAK SMB Value 3.5 20 °C/W TO-220FPAC DO201AB 6.5 20 Unit Rth(j-c) Junction to case 2/12 , (maximum values) Figure 4. Relative variation of thermal impedance, junction to case, versus pulse , .E-01 1.E+00 Figure 5. Relative variation of thermal impedance, junction to case, versus pulse STMicroelectronics
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STTH4R02B-TR
Abstract: resistance junction to ambient versus copper surface under tab (Epoxy printed circuitboard FR4, copper , NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE EXTREMELY FAST SWITCHING , Switch Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, SMC and DPAK this , RESISTANCES Symbol Rth (j-l) Rth (j-c) Parameter Junction to leads Value 20 25 5.5 SMC SMB Junction to case Unit °C/W °C/W DPAK STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions STMicroelectronics
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ST S340 SMC marking ED s34 schottky DPak Packaged dimensions
Abstract: 10 1 2 5 10 20 50 Fig. 10-1: Thermal resistance junction to ambient versus , THERMAL RESISTANCES Symbol Rth (j-l) SMC Junction to case 25 DPAK Junction to leads , . 6-1: Relative variation of thermal transient impedance junction to lead versus pulse duration (SMB). , THERMAL RESISTANCE EXTREMELY FAST SWITCHING SURFACE MOUNTED DEVICE AVALANCHE CAPABILITY SPECIFIED , and high frequency DC to DC converters. Packaged in SMB, SMC and DPAK this device is intended for STMicroelectronics
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Abstract: SMC SMB Junction to case Unit °C/W °C/W DPAK STATIC ELECTRICAL CHARACTERISTICS Symbol , resistance junction to ambient versus coppersurface undereachlead(Epoxyprinted circuit boardFR4 , NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE EXTREMELY FAST SWITCHING , Switch Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, SMC and DPAK this , SMB / SMC tp = 10 ms Sinusoidal 75 A tp = 2 us F = 1kHz square 1 A - 65 to + 150 STMicroelectronics
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Abstract: Resistance, Junction to Terminal RqJT 20 °C/W Typical Thermal Resistance, Junction to Ambient , ) Operating and Storage Temperature Range Notes: 1. Thermal Resistance: Junction to terminal, unit mounted , Mechanical Data Case: SMA/SMB 5.00 5.59 0.20 0.10 0.20 0.76 1.52 0.76 1.52 , 0.10 H J 4.80 G D · · SMB A Surge Overload Rating to 50A Peak · · SMA Polarity: Cathode Band or Cathode Notch J G E H Case Material: Molded Plastic. UL Diodes
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B220A B230A B240A B250A B260A B2X0 B220 B260 B220/A
Abstract: 200 pF Typical Thermal Resistance, Junction to Terminal RqJT 20 °C/W Typical Thermal Resistance, Junction to Ambient (Note 1) RqJA 25 °C/W Tj, TSTG -65 to +150 °C Typical Total Capacitance (Note 2) Operating and Storage Temperature Range Notes: 1. Thermal Resistance , Protection Application A C E Mechanical Data · · Case: SMA/SMB · · 5.00 5.59 , Device type, e.g. B260A-13-F (SMA package); B240-13-F (SMB package). 4. For Packaging Details, go to our Diodes
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B230 B240 DS13 B260/A J-STD-020C DS13004 B220/A-B260/A
Abstract: junction to ambient versus copper surface under each lead (SMA) 140 Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (SMB) Rth(j-a)(°C/W) 120 120 Rth , . Thermal resistance junction to ambient versus copper surface under tab (STmite flat) 250 Rth(j-a)(°C , Symbol VF (1) 25 STmite flat Junction to case 30 SMB Junction to lead Doc ID 5507 , .E+03 Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration (STmite STMicroelectronics
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STPS1L40 DO-214AC STPS1L40A STPS1L40U STPS1L40MF
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