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Part Manufacturer Description PDF & SAMPLES
CDBWM8782-1 Cirrus Logic WM8782-6125-SSOP20-EV1
CS5351-KSZ Cirrus Logic ADC, Delta-Sigma, 24-Bit, 1 Func, 2 Channel, Serial Access, PDSO24, 300 MIL, LEAD FREE, SOIC-24
CS5361-KSZ Cirrus Logic ADC, Delta-Sigma, 24-Bit, 1 Func, 2 Channel, Serial Access, PDSO24, 300 MIL WIDTH, LEAD FREE, SOIC-24
CS5381-KSZR Cirrus Logic ADC, Delta-Sigma, 24-Bit, 1 Func, 2 Channel, Serial Access, CMOS, PDSO24, 300 MIL, LEAD FREE, SOIC-24
CS5381-KSZ Cirrus Logic ADC, Delta-Sigma, 24-Bit, 1 Func, 2 Channel, Serial Access, CMOS, PDSO24, 300 MIL, LEAD FREE, SOIC-24
CY3675-TSSOP20B Cypress Semiconductor Clock Socket Adapter

SSOP20 300 mil

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: power (8/20us). SSOP20 PIN-OUT CONFIGURATION I1 O1 ESD protection of 25 kV, according to MIL STD- Method 3015-6. High integration. Four points structure, avoiding all ESD effects at the , 15kV (air discharge) 8kV (contactdischarge) - MIL STD 883C - Method 3015-6 C = 100 pF R = 1500 , discharge in following measurement conditions: MIL STD 883C - METHOD 3015-6 IEC1000-4-2 - air discharge , values). Ipp(A) C(pF) 200 30.0 F=1MHz Vosc=30mV tp=2.5us 10.0 180 160 1.0 STMicroelectronics
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ESDA6V1FU6 fast diode ifm if 40 A transil fast diode ifm if 60 A transil SO20
Abstract: DESCRIPTION plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body , , space-saving S 0 1 6 or SSOP20 package. maximum PCF8574 es fSj is GENERAL DESCRIPTION The PCF8574 , n.c. n.c. n.c. n.c. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 - PCF8574 SSOP20 6 7 9 10 11 12 14 , Fig. 2 Pin configuration (DIP16; S016). Fig.3 Pin configuration (SSOP20). September 1994 315 -
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PCF8574A PCF8574P PCF8574AP PCF8574T MBD980 F8574
Abstract: *8 bit OTP ROM OTP 2.0-5.5V SOP20(300mil)/SSOP20(200mil)/SOP16(150mil) 3 SOP20/SSOP20 , Shanghai Belling Co., Ltd. 7 SOP20300mil Symbol Dimensions in mil Dimensions in milimeter , - 300 7.37 - 7.62 C 14 - 20 0.36 - 0.51 C' 495 - 512 , Dimensions in mil Dimensions in milimeter A Max. 299 Nom. 307 Min. 315 Max. 7.60 Nom , Belling Co., Ltd. SOP16150mil Symbol Dimensions in mil Dimensions in milimeter A Max Shanghai Belling
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bl35p02 SOP16-150mil HC05 BL35P02 325K-8MH SSOP20200
Abstract: plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 7.5 , DIP16, space-saving S 0 1 6 or SSOP20 package. PCF8574 B l The device consists of an 8 , 15 16 - PCF8574 DESCRIPTION SSOP20 6 7 9 10 11 12 14 15 16 17 19 20 1 2 4 5 3 8 13 18 address , .2 Pin configuration (DIP16; S016). Fig.3 Pin configuration (SSOP20). September 1994 440 -
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PCF857 M8D980
Abstract: -27FUxdeviceallows immediateandeasyimplementationon high densityboard. SSOP20 PIN-OUT CONFIGURATION FEATURES 9-line undershootor overshoot , IEC1000-4-2 15kV level4 8kV - MIL STD 883C Method 3015-6 25kV class 3 (human body test , 16 9 Maximum electrostatic discharge in following measurement conditions: MIL STD 883C - METHOD , : Input capacitance versus reverse applied voltage (typical values). Ipp(A) 30.0 1 C(pF , rejection at the 900MHz GSM frequency is measured at about -21dBm (SO20) and -26dBm (SSOP20), while the STMicroelectronics
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A13B transistor std A13B S020 ESDR6V1-27FU ESDR6V1-27FU3 ESDR6V1-27 ESDR6V1-27FU3RL ESDR6V1-27FU6 ESDR6V1-27FU6RL
Abstract: . The APX9270 is available in SSOP-20 and TSSOP-20P packages (see Pin Configurations). · · · · , Assembly Material Handling Code Temperature Range Package Code APX9270 XXXXX Package Code N : SSOP-20 R , OUT2 2 VM 3 VCC 4 OSCH 5 OSCL 6 SET 7 MIN 8 PWM 9 OSC10 SSOP-20 20 PGND 19 PGND 18 OUT1 17 SGND 16 , Input Voltage (CT to SGND) Power Dissipation SSOP-20 TSSOP-20P Maximum Junction Temperature Storage , Symbol RTH,JA Parameter Thermal Resistance-Junction to Ambient SSOP-20 TSSOP-20P Note 2: Mounted on a ANPEC Electronics
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Abstract: NUMBER NAME PCF8574P; PCF8574AP PCF8574T; PCF8574AT PCF8574TS; PCF8574ATS DIP16 SO16 SSOP20 DESCRIPTION plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 7.5 , : plastic dual in-line package; 16 leads (300 mil) PCF8574 SOT38-4 D seating plane ME A2 A , DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING DIP16 and SO16 packages SSOP20 package CHARACTERISTICS , DIP16, or space-saving SO16 or SSOP20 packages. 2 GENERAL DESCRIPTION The device consists of an 8 Philips Semiconductors
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PCF8574ATD-T PCF8574TD diode smd marking BUF diode smd marking "BUF" SSOP20 300 mil Footprint PCF8574P philips PCF8574ATD PCF8574AT/3 PCF8574TD-T PCF8574T/3
Abstract: (300 mil) SOT146-1 74HC240D -40 °C to +125 °C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 74HC240DB -40 °C to +125 °C SSOP20 plastic shrink , 74HC240 74HCT240 74HCT240N plastic dual in-line package; 20 leads (300 mil) SOT146-1 74HC240 , in-line package; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e , 750 mW SO20, SSOP20, TSSOP20 and DHVQFN20 packages - 500 mW [1] Conditions -
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74HC244 74HCT244 74HC240N 74HC240PW 74HC-HCT240 JESD22-A114-D JESD22-A115-A DIP20
Abstract: 300 MIL Wide SOIC (Small Outline IC) 300 MIL Wide SOIC (Small Outline IC) 300 MIL Wide SOIC (Small Outline IC) 300 MIL Wide SOIC (Small Outline IC) so so so so G 300 MIL SOJ (Small Outline J-Bend) G 300 MIL SOJ (Small Outline J-Bend) Q Q Q Q B B B 150 MIL QSOP (Quarter Size Outline Pkg) 150 , Leaded Chip Carrier) PLCC (Plastic Leaded Chip Carrier) 300 MIL PDIP (Plastic Dual In-Line Pkg) 300 MIL PDIP (Plastic Dual In-Line Pkg) 300 MIL PDIP (Plastic Dual In-Line Pkg) 300 MIL PDIP (Plastic Dual -
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TSSOP-48/56 BQSOP-48 SOJ-24 SSOP-14/16 SSOP-20/24/28 PLCC-20
Abstract: Outline 14 mm Sq. 1.4 mm Hiqh, Gull W inq, 0.5 mm Ditch 300 mil Wide, J-Bend. 50 mil Ditch 5.3 mm Wide , Ditch 4.4 mm W ide, 1.1 mm Hiqh, Gull Winq, 0,65 mm Ditch 14 x 20 mm, Gull Winq, 0.65 mm Ditch 300 mil Wide, Dual In-Line. 100 mil Ditch 300 mil Wide, Dual In-Line, 100 mil Ditch 300 mil W ide, Dual In-Line, 100 mil Ditch 300 mil W ide, Dual In-Line, 100 mil Ditch 300 mil W ide, Dual In-Line, 100 mil Ditch 300 mil Wide, Dual In-Line, 100 mil Ditch 300 mil Wide, Dual In-Line. 100 mil Ditch 300 mil W ide -
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QSOP16 package SA SOT23-5 TSSOP-48 TSSOP-56 BQSOP-40 BQSOP-80 LQFP-100 SSOP-14
Abstract: in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 7.5 mm plastic , DIP16, or space-saving S016 or SSOP20 packages. PCF8574 K The device consists of an 8 , P4 P5 P6 P7 INT SCL SDA V dd n.c. n.c. n.c. n.c. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 SSOP20 6 7 9 -
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PGF8574 MB0973 BD979
Abstract: pitch 300 mil Wide, Dual In-Line, 100 mil pitch 300 mil Wide, Dual In-Line, 100 mil pitch 300 mil Wide, Dual In-Line, 100 mil pitch 300 mil Wide, Dual In-Line, 100 mil pitch 300 mil Wide, Dual In-Line, 100 mil pitch 300 mil Wide, Dual In-Line, 100 mil pitch 150 mil Wide, Gull Wing, 25 mil pitch 150 mil Wide , mil Wide, 1.1 mm High, Gull Wing, 25 mil pitch 150 mil Wide, 1.1 mm High, Gull Wing, 25 mil pitch 300 mil Wide, Gull Wing, 50 mil pitch 300 mil Wide, Gull Wing, 50 mil pitch 300 mil Wide, Gull Wing, 50 -
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TVSOP-48 TVSOP-56 SSOP-16 SSOP-24 SSOP-28 TSSOP-14
Abstract: plastic dual in-line package; 16 leads (300 mil) SOT38-1 PCF8574T; PCF8574AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 PCF8574TS SSOP20 plastic shrink , Dimensions in mm. Fig.16 Plastic dual in-line package; 16 leads (300 mil) DIP16; SOT38-1. September , , space-saving SO16 or SSOP20 package. GENERAL DESCRIPTION The PCF8574 is a silicon CMOS circuit. It provides , PCF8574 PINNING PIN SYMBOL DESCRIPTION DIP16; SO16 SSOP20 A0 1 6 address input 0 Philips Semiconductors
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MBC237 MBC237- MBD977 MBD973
Abstract: package; 16 leads (300 mil) SOT38-1 PCF8574T; PCF8574AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 PCF8574TS SSOP20 plastic shrink small outline , 8 Dimensions in mm. Fig.16 Plastic dual in-line package; 16 leads (300 mil) DIP16; SOT38 , pins for use of up to 8 devices (up to 16 with PCF8574A) · DIP16, space-saving SO16 or SSOP20 package , PCF8574 PINNING PIN SYMBOL DESCRIPTION DIP16; SO16 SSOP20 A0 1 6 address input 0 -
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pcf8574 Application Note MBA608 pcf8574 c code
Abstract: the protected device from destruction when subjected to ESD surges up to 15 kV. SSOP20 PIN-OUT , Value Unit Maximum electrostatic discharge in following measurement conditions: MIL STD 883C - , . 4: Input capacitance versus reverse applied voltage (typical values). Ipp(A) 30.0 1 C , -20) and -26dBm (SSOP20), while the attenuation for FM broadcastrange (around 100MHz) is better than -17dBm for both SO-20 and SSOP20. Fig. A6: Measurement conditions TRACKING GENERATOR TG OUTPUT STMicroelectronics
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74HC04 EMIF09-02726S EMIF09-02726 EMIF09-02726S3 EMIF09-02726S6
Abstract: plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 7.5 , PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body PCF8574 SOT38 , DIP16, or space-saving SO16 or SSOP20 packages. The PCF8574 is a silicon CMOS circuit. It provides , -1 PCF8574P; PCF8574AP PCF8574T; PCF8574AT PCF8574TS DIP16 SO16 SSOP20 1997 Apr 02 3 Philips , SCL SDA VDD n.c. n.c. n.c. n.c. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 - - - - SSOP20 6 7 9 10 11 12 Philips Semiconductors
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PCF8574APN marking code PH 817 mbc602 PCF8574TS/F3
Abstract: Version 74HC573N -40 °C to +125 °C DIP20 plastic dual in-line package; 20 leads (300 mil , °C DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 74HCT573D -40 °C to , leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 w M , 7.5 mm SOT163-1 74HC573DB -40 °C to +125 °C SSOP20 plastic small outline package; 20 , -1 74HCT573DB -40 °C to +125 °C SSOP20 plastic small outline package; 20 leads; body width 5.3 mm -
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74HC573 74HCT573 74HC563 74HCT563 74HC373 74HCT373 74HC573D Current 74HCT573 74HCT573N
Abstract: dual in-line package; 20 leads (300 mil) SOT146-1 74HC244D -40 °C to +125 °C SO20 , -1 74HCT244N -40 °C to +125 °C DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146 , ; 20 leads (300 mil) SOT146-1 ME seating plane D A2 A A1 L c e Z b1 , SSOP20 plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 74HC244PW , SOT163-1 74HCT244DB -40 °C to +125 °C SSOP20 plastic shrink small outline package; 20 leads -
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74HC244N 74HC244DB EIA/JESD22-A114-C EIA/JESD22-A115-A HCT244 MS-001 SC-603
Abstract: package; 20 leads (300 mil) SOT146-1 1998 Jan 16 6 Philips Semiconductors Product , per Jedec Std 17 · ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200 V per Machine , Octal buffer/line driver (3-State) 74ABT244 SSOP20: plastic shrink small outline package; 20 leads , protection exceeds 500mA per Jedec Std 17 ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200 V , 74ABT244PW Package SOT163-1 (SO20) SOT339-1 (SSOP20) SOT146-1 (DIP20) Package name Nr of pins Family Logic NXP Semiconductors
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msl 9350 560 SOT339 74ABT244D 74ABT244DB 74ABT244N ICP1020807
Abstract: square JR PLCC rectangular P PDIP, 300-mil PA TSSOP 170-mil 240-mil 240-mil Q QSOP, 150-mil , 208 31 11 48 87 55 40 87 55 80 56 11 Package SO SOIC, 300-mil S1 SOIC, 150-mil TF , 1500 SSOP 300 mil (PV) 48 56 32 32 16 16 12.0 12.0 16.2 18.7 3.2 3.2 , ) 48 56 24 24 12 12 8.6 8.6 13.2 14.5 1.6 1.8 2500 2500 300 mil SOIC (SO , 18.3 3.0 3.0 3.0 3.0 1000 1000 1000 1000 300 mil SOJ (V) 28 24 12 9.3 Integrated Device Technology
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QS6611 qsop 16 pcb footprint 16 QSOP pcb footprint qsop 24 footprint TSSOP48 SSOP56 SSOP48 64L-TF EIA-481-A
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