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Part Manufacturer Description PDF & SAMPLES
THS6022IGQE Texas Instruments DUAL LINE DRIVER, PBGA80, PLASTIC, LGA-80
THS6022CGQE Texas Instruments DUAL LINE DRIVER, PBGA80, PLASTIC, LGA-80
THS6032CGQE Texas Instruments DUAL LINE DRIVER, PLGA80, PLASTIC, LGA-80
THS6022CGQER Texas Instruments DUAL LINE DRIVER, PBGA80, PLASTIC, LGA-80
THS6032IGQE Texas Instruments DUAL LINE DRIVER, PLGA80, PLASTIC, LGA-80
THS6022IGQER Texas Instruments DUAL LINE DRIVER, PBGA80, PLASTIC, LGA-80

LGA-16 land pattern

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: . . . . . . . . . . . . . . 41 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 10. Land Pattern: 16-Pin Narrow , 12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .48 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , (Si8230/1/2) RoHS-compliant packages 4.0 A peak output (Si8233/4/5/6) SOIC-16 wide body High Silicon Laboratories
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Si8233 LGA PACKAGE thermal resistance LGA-24 land pattern SOIC-16 LGA-14
Abstract: , 16 lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 A.4 2/13 LGA 5x5x1.6 mm, 16 lead. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 , paste can be dispensed on the board with a screen printing method through a stencil. The pattern of the , TN0018 PCB Design Guidelines PCB land and solder masking general recommendations are shown in Figure , open solder mask external to PCB land; Pin #1 indicator is electrically connected to pin 1. Leave STMicroelectronics
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LGA16 footprint lga16 land pattern LGA16 L footprint LGA voiding LGA14 LGA16
Abstract: . . . . . . . . . . . . . . 43 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10. Land Pattern: 16-Pin Narrow , 12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .50 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , (Si8230/1/2/7) RoHS-compliant packages 4.0 A peak output SOIC-16 wide body (Si8233/4/5/6/8) SOIC-16 Silicon Laboratories
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LGA 32 land pattern silicon labs SI823 si8230 E257455 solar inverters circuit diagram
Abstract: . . . . . . . . . . . 40 10. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 12. Land Pattern: 16-Pin Narrow Body , . . . . . . . . . . .46 16. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . , . Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , packages 0.5 A peak output (Si8230/1/2) SOIC-16 narrow body SOIC-16 wide body 4.0 A peak output (Si8233 Silicon Laboratories
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WBSOIC-16 LGA land pattern si8235 mosfet igbt drivers theory Si823x Si8234
Abstract: . . . . . . . . . . . . . . 39 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 10. Land Pattern: 16-Pin Narrow , 12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .45 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , (Si8230/1/2) RoHS-compliant packages 4.0 A peak output (Si8233/4/5/6) SOIC-16 wide body High Silicon Laboratories
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igbt series Si8232BB-B-IS SI8233BD-C-IS SI8234A SI8235BB-C-IS1
Abstract: . . 43 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . 46 10. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . , mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 12. Land Pattern: 14 , . . . .50 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . , +125 °C  RoHS-compliant packages 4.0 A peak output (Si8233/4/5/6/8) ï' SOIC-16 wide body Silicon Laboratories
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AEC-Q100 GB4943
Abstract: . . 43 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . 46 10. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . , mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 12. Land Pattern: 14 , . . . .50 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . , +125 °C  RoHS-compliant packages 4.0 A peak output (Si8233/4/5/6/8) ï' SOIC-16 wide body Silicon Laboratories
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Abstract: . . . . . . . . . . . . . . 41 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 10. Land Pattern: 16-Pin Narrow , 12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . .48 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . , (Si8230/1/2) RoHS-compliant packages 4.0 A peak output (Si8233/4/5/6) SOIC-16 wide body High Silicon Laboratories
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high side IGBT driver si8236 Si8234CB-C-IS si8231bb-b LGA 32 land pattern
Abstract: . . 39 8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . 41 10. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . , mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 12. Land Pattern: 14 , . . . .45 14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . , 0.5 A peak output (Si8230/1/2) RoHS-compliant packages 4.0 A peak output (Si8233/4/5/6) SOIC-16 Silicon Laboratories
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Abstract: . . . . . . . . . . . . . . . . . . . . . . . . .40 11. Land Pattern: Wide-Body SOIC . . . . . . . , . Land Pattern: Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . 45 15. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . , Thermal Pad (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . .48 17. Land Pattern: 14 LD LGA with , RoHS-compliant SOIC-16 (Wide) VIA 1 16 VDDA VIB 2 15 VOA VDDI 3 14 GNDA Silicon Laboratories
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Si8232-A-IS
Abstract: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and , Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These drawings conform with the Surface Mount Design and Land Pattern Standard (IPC-SM , the land pattern drawings in this document together with their respective Figure numbers. These , heat path for thermal performance of amplifier products. Table 1. PCB Land Pattern Drawings Skyworks Solutions
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IPC-SM-782 MO-220 200123K
Abstract: . . . . . . . . . . . . . . . . . . . . . . . . 8 A.1 A.2 LGA 4.4x7.5x1 mm, 16 lead . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 A.5 LGA 4x4x1.5 mm, 16 , 5x5x1.6 mm, 16 lead. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 A , . . 8 LGA 3x3x1.0mm, 16 lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , the board with a screen printing method through a stencil. The pattern of the soldering paste on the STMicroelectronics
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4x4x1 LGA 16L JESD97 aCCELEROMETER APPLICATION CIRCUIT
Abstract: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land , considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF , Electrostatic Discharge High Coefficient of Thermal Expansion High Density Interconnect Land Grid Array Low , Surface Mount Technology Land Grid Array (LGA) Package Rework Application Note, Rev. 1.0 2 , matches the CTE of the mother board materials, ~16 ppm/oC. Typically, most epoxy-glass or polyimide-glass Freescale Semiconductor
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LGA rework AN2920 cte table flip chip substrate Service Manual smd rework station reflow profile FOR LGA COMPONENTS lga components MC1320 MC1321
Abstract: recommended PCB land pattern for the package. 1 13 10x0.8 6x2 6 8 14x0.6 12x1 14x0.9 Figure 2. Recommended PCB Land Pattern for the 5 x 3 mm LGA Package OVERVIEW OF SOLDERING , pattern - 0.5 mm 0.8 mm Wider trace Cu: 0.9 x 0.6 mm sq. SM opening = PCB land pad + 0.1mm = , digital output accelerometer use the Land Grid Array (LGA) package platform. This application note , land should be designed with Non Solder Mask Defined (NSMD) as shown in Figure 5. 2. No additional Freescale Semiconductor
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AN3484 MMA73x1L MMA745xL MMA73 MMA745
Abstract: be an identical mirror image of the bottom pattern of the IR devices, see Figure 8. The land size on , Rectifier Introduction IR BGA (Ball Grid Array) and LGA (Land Grid Array) devices are high performance , recommendations for using IR BGA devices. When using IR LGA devices, if vias are not in land pads (see Figure 4 , reference Figure 5 for different via types. If it is desired to place vias in land pads (see Figure 6 , thickness, and a via capture land of 0.64mm diameter (see Figure 5). 1.0 PCB Layout Design A International Rectifier
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AN-1028 AN-1029 pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A JSTD033A AN1028 reflow hot air BGA
Abstract: openings should be an identical mirror image of the bottom pattern of the LGA package. The land size on the PCB should be 100% of the device land. The next figure shows an example of a 2x2 LGA part in a , to provide information about Kionixâ'™s 2 x 2 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices. The , generate much heat. Therefore, only electrical vias are needed. If vias are not in the land pads, capped Kionix
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5M-1994
Abstract: to provide information about Kionixâ'™s 3 x 5 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices. The , lands. These openings should be an identical mirror image of the bottom pattern of the LGA package. The land size on the PCB should be 100% of the device land. The pin 1 indicator triangle that is exposed , are needed. If vias are not in the land pads, capped, plugged, tented, un-capped or un-plugged vias Kionix
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Abstract: mounted on the recommended land pattern, the cutoff frequency will shift down. Consult our Sales , . When mounted on the recommended land pattern, the cutoff frequency will shift down. Consult our Sales , Marking and Recommended Land Pattern: Marking: Marking Explanation: ï'·ï'  Pin A1 Identifier ï'·ï'  Two digit code representing Recommended Land Pattern: the cutoff frequency as listed below , output of Land Pattern The cutoff frequency, part numbering and product marking which list the cutoff Thin Film Technology
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FL02M651 FL7B5BZ110S-T
Abstract: measurements. When mounted on the recommended land pattern, the cutoff frequency will shift down. Consult our , . When mounted on the recommended land pattern, the cutoff frequency will shift down. Consult our Sales , '  E0 = 14.0GHz ï'·ï'  F0 = 15.0GHz * Please call the factory for DXF output of Land Pattern The , Ground-Signal-Ground probe measurements. When mounted on the recommended land pattern, the cutoff frequency will shift , '  ï'·ï'  Cutoff frequencies between 8.0GHz and 15.0GHz* Low pass Absorptive Land Grid Array (LGA Thin Film Technology
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Abstract: mirror image of the bottom pattern of the LGA package. The land size on the PCB should be 100% of the device land. The pin 1 indicator triangle that is exposed on the LGA substrate does not need to be , to provide information about Kionixâ'™s 3 x 3 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices. The , needed. If vias are not in the land pads, capped, plugged, tented, un-capped or un-plugged vias can be Kionix
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