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JBP18S030MJ Texas Instruments 32X8 Bi-Polar PROM 16-CDIP -55 to 125
JBP18S030MW Texas Instruments 32X8 OTPROM, 50ns, CDFP16, CERAMIC, DFP-16

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32x8

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: 3 2 0 0 D X W i d e D e c o de Modul es . . SRAM 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 . . . . SRAM 32x8 or 64x4 32x8 or 64x4 SRAM Logic Modules SRAM 32x8 or 64x4 32x8 or 64x4 SRAM Logic Modules SRAM 32x8 or 64x4 SRAM 32x8 or 64x4 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 Logic Modules 32x8 or 64x4 SRAM . . . . . . . . 32x8 or 64x4 . . . . . . I/Os supported by Actel
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32X8 sram 64X4 32140DX 3265DX 3200DX
Abstract: 3 2 0 0 D X W i d e D e c o de Modul es . . SRAM 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 . . . . SRAM 32x8 or 64x4 32x8 or 64x4 SRAM Logic Modules SRAM 32x8 or 64x4 32x8 or 64x4 SRAM Logic Modules SRAM 32x8 or 64x4 SRAM 32x8 or 64x4 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 Logic Modules 32x8 or 64x4 SRAM . . . . . . . . 32x8 or 64x4 . . . . . . I/Os supported by Actel
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AC125 prom 32x8 sram 32x8
Abstract: 82S137A/BVA Device Description 8KX8-100 8KX8-35 8KX8-35 1KX8 1KX8 1KX8 1KX8 1KX8 512X8 512X8 32X8 32X8 32X8 32X8 32X8 32X8 256X4 256X4 256X4 256X4 256X4 256X4 256X4 256X4 512X4 512X4 512X4 512X4 512X4 512X4 , 2KX4 2KX4 2KX4 2KX4 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 32X8 32X8 32X8 32X8 32X8 32X8 1KX8 2KX8 32X8 32X8 SECTION 7: RANDOM A C C ESS MEMORY PRODUCTS Part Number 54S189/BEA S4S189/BFA 8X350/BWA -
OCR Scan
82hs189 16x4 ENCODER 54LS377 82HS641 82HS641B 8kx8 prom 27C512/BXA-20 27C512/BXA-25 27C256/BXA-20 27C256/BXA-25 27C256/BXA-30 27C256/BUA-20
Abstract: 2 10/8 76 25(4)/16 60 1.8 3.3 FBD144 LPC2214 16 K 256 K 32x8 K 128-bit Y/Y 4 , . 4 2 ­ 2 10/8 76 16(4)/16 60 1.8 3.3 FBD144 LPC2194 16 K 256 K 32x8 K , ISP/IAP 4 Width 4 16 K 256 K 32x8 K 128-bit Y/Y Sectors 16 K 256 K 32x8 K 128 , 2 ­ 2 10/8 47 22(4)/16 60 3.3 FBD64 LPC2129 16 K 256 K 32x8 K 128-bit Y/Y 4 2 2 2 10/4 46 18(4)/16 60 1.8 3.3 FBD64, BHN64 LPC2124 16 K 256 K 32x8 K 128 Philips Semiconductors
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LPC2000 LPC2136 Philips LPC2000 datasheet LPC2294 LPC2292 LPC2290 LPC2212 LPC2210 LPC2134 LPC2132 LPC2131 LPC2119
Abstract: Bipolar PROM Bipolar PROM Functional Index and Selection Guide Access Time Icc COM'L/MIL COM'L/MIL Organization Max Max 32x8 32x8 32x8 32x8 32x8 32x8 256x4 256 x 4 256x4 256x4 512x4 512x4 512x4 512x4 512x8 512x8 512x8 512x8 512x8 512x8 512 x B 512 x B 512x6 5 12 xB 512x8 512x8 1024x4 1024x4 1024x4 1024x4 1024x6 50/65 50/65 40/50 25/35 40/50 25/35 45/60 30/40 45/60 30/40 50/60 30/40 50/60 30/40 60/90 N.A.Z /N.A.2 N.A.VN.A.4 N.A.Z /N.A.2 55/70 35/45 55/70 35/45 55/70 35/45 55/70 35/45 55/70 35/45 55/70 -
OCR Scan
1024X4 AM27lS08 AIH27LS181 27S18A 27S19 27S19A 27S20 27S20A
Abstract: Philips Semiconductors Military Bipolar Memory Products Product specification 82S23/S23A/S23B 82S123/123A/123B 256-bit TTL bipolar PROM (32x8) APPLICATIONS DESCRIPTION · Prototyping , -bit TTL bipolar PROM (32x8) ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER RATING UNIT +7 , -bit TTL bipolar PROM (32x8) AC ELECTRICAL CHARACTERISTICS -55°C < TA < +125°C, 4.5V < VCC < 5.5V , -bit TTL bipolar PROM (32x8) TIMING DIAGRAMS 3.0V ADDRESS VM 0V CE 0V VOH VM VOL tAA VM = -
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82S23 82S123/BEA GDIP1-T16 GDFP2-F16 82s123 philips 82s123 S23B TRANSISTORS 123A 82S123 82S23/BEA 82S23A/BEA 82S123A/BEA
Abstract: predictable timing. Fast Decode Module 3200DX Floorplan JTAG SRAM SRAM 32x8 or 64x4 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 32x8 or 64x4 JTAG 32x8 or 64x4 SRAM Logic Modules 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 Logic Modules JTAG SRAM Logic Modules 32x8 or 64x4 Fast Decode Module JTAG Figure 1 · 3200DX Floor Plan S e p t e m b e Actel
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bdr 551 DesignWare verification plan e language
Abstract: 21504 (39%) - 3072 tiles (10%) + 1 32x8 block RAM Single-cycle Axcelerator - 256x8 distributed RAM / AX500 / 5138 cells of 8064 (64%) ProASICPLUS - 32x8 distributed RAM / APA075 / 1037 , ) Performance Comb. Modules Seq. Modules Total Modules % (Device) RAM Blocks 32x8 , 655 527 1182 59 (AX125) 0 101 9.9 (Write) 643 (Read) 32x8 with Block RAM , ) 16x8 Distributed 1042 34 (APA075) 0 49 20.4 (Write) 347 (Read) 32x8 Distributed Actel
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AC194 APA600 vhdl code for memory in cam Actel APA075 Content Addressable Memory vhdl code of 4 bit comparator
Abstract: High Performance 53/63S080 32x8 PROM 53/63S081 TiW PROM Family 63S081A Features/Benefits â'¢ 15-ns maximum access time â'¢ Reliable titanium-tungsten fuses (TiW) guarantee greater than 98 , NUMBER SIZE ORGANIZATION OUTPUT PINS TYPE 0°C to +7S°C -55°C to +125°C 1/4 K 32x8 TS 16 (20) N,J , Block Diagram E 01 vcc a E 02 Ã' ¡3 E 03 A4 ¡3 E 04 A3 32x8 E E 05 A2 ID E 06 A1 -
OCR Scan
63S081 53S081 63S080 53S080 63S141 J525 53/63S140 53/63S141/A
Abstract: High Performance 32x8 PROM TiW PROM Family 53/63S080 53/63S081 63S081A Features/Benefits â'¢ 15-ns maximum access time â'¢ Reliable titanium-tungsten fuses (TiW) guarantee greater than 98 , NUMBER SIZE ORGANIZATION OUTPUT PINS TYPE 0°C to +75°C -55°C to +125°C 1/4 K 32x8 TS 16 , Configurations Block Diagram E Ol VCC 1 E 02 E E E 03 A4 a E 04 A3 32x8 E 05 A2 m E OS Ai ID E 07 AO ID E GMD OS H 02 01 NCVCC Ã' / 3 2 1 20 19 â'"s 03 £ 4 o 18 ] A4 04 : 5 17 ]A3 NC £ e 32x8 -
OCR Scan
Abstract: tSSg& Sfi High Performance 32x8 PROM TiW PROM Family 5 3 /6 3 S 0 8 0 53/63S081 63S081A Features/Benefits Description â'¢ 15-ns maximum access lime The 53/63S080, 53/63S081 and 63S081A , OUTPUT ORGANIZATION 32x8 PINS TYPE 16 (20) N.J.W (NL).(L) 0°C to +75°C Enhanced TS 02 Ã' 03 A4 04 A3 32x8 3 ID 3D ID 05 A2 3 06 A1 ID , 17 : A3 5 6 16 ] N C 32x8 ]A 2 05 £ 7 15 06 £ 8 14 > 1 9 10 11 -
OCR Scan
Abstract: Product Folder: JBP18S030, 32X8 Bi-Polar PROM Contact Us Buy About TI TI Worldwide my.TI Keyword Part , /AVAILABILITY/PKG | APPLICATION NOTES | USER GUIDES | MORE LITERATURE JBP18S030, 32X8 Bi-Polar PROM DEVICE , Digital Logic Product Folder: JBP18S030, 32X8 Bi-Polar PROM q q Evaluation of Nickel/Palladium Texas Instruments
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TBP18S030 TBP18SA030 SDMS024 SCYB004 SCET004 SGYN138
Abstract: EI-33 63S481J out compatibility in the space saving 16,18 and 20 pin packages. The 8-bit-wide PROMs range from 32x8 , ranges. MEMORY SIZE ORGANIZATION PACKAGE PINS TYPE DEVICE TYPE 0°C to +75°C 'AK 1K 2K 32x8 , a« ] E a2 a? 3 E a3 a9 3 E 04 32x8 A3 3 E A3 A5 3 E A3 a6 3 E E A2 Al 01 4096x4 PROM 02 3 3 -
OCR Scan
63S280 63S480 prom 256x4 bit Generic PROM Family asa 300f 63S841 16k prom 53/63SXXX 53/63XX-1 52/62XX-1 63S140 53S140 63S240
Abstract: Hard Macros (3200DX Family Only) Function Macro Description SRAM DXRAM8RR 32x8 Rising WCLK Rising RCLK DXRAM8RF 32x8 Rising WCLK Falling RCLK DXRAM8RA 32x8 Rising WCLK Async read DXRAM8FR 32x8 Falling WCLK Rising RCLK DXRAM8FF 32x8 Falling WCLK Falling RCLK DXRAM8FA 32x8 Falling WCLK Async read DXRAM4RR 64x4 Rising WCLK Rising RCLK Actel
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TA164 TA190 TA273 TA688 7input and gate ao1b DLM8 TA-191 AO11 1200XL TA161 TA169 TA174 TA175
Abstract: MICROCONTROLLER Part Number PIC16C54 PIC16C55 PIC16C56 PIC16C57 Pins 18 28 18 28 I/O 12 20 12 20 RAM 32x8 32x8 32x8 80 X 8 ROM . - EPROM 512x12 512 x 12 1024 x 12 2048 x 12 Oscillator Range M in.Instr.Cycle , PIC1655 PIC1670 Pins 18 28 40 I/O 12 20 32 RAM 32x8 32 x 8 64 x 8 ROM 512 x 12 512 x 12 1 0 2 4 x 13 EPROM -
OCR Scan
PIC16XXX PIC PROGRAMMING CODES 32x8 EPROM picsim DS30031A-4
Abstract: ST25C16CML6 ST25C16CML6TR 2K x 8 2K x 8 2K x 8 2K x 8 2K x 8 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 Write -
OCR Scan
M48Z32Y-100PC1 ST24C02CB1 M2764AF1 MKI48Z12B15 MK48Z02B-20 ST24C01CB1 M27C64A-15F1 M27C64A-20F1 M27C64A-25F1 M27C64A-30F1 M27C64A-20F6 M27C64A-25F6
Abstract: 7611B/E.F 7620/E,F 7620A/E.F 7620B/E.F 7621/E,F 7621 A/E,F 7621B/E,F 32x8 32x8 256x4 256x4 256x4 -
OCR Scan
LA 7610A 7610A 7641 prom PROM 7611 G00DM7 20-LEAD
Abstract: . The 8-bit-wide PROMs range from 32x8 to 2048x8 in a wide selection of package sizes. All PROMs have , 'AK 1K 2K 2K ORGANIZATION 32x8 256x4 512x4 256x8 4K 1024x4 4K 512x8 4K , E 04 E 05 E E O7 E GND 33 Ã' ID T A4 33 Vcc 32x8 PO RM Ofi A3 33 33 A ID -
OCR Scan
53S240 53S280 53S440 63S440 53S480 63S840
Abstract: FUNCTIONS AND CHARACTERISTICS TYPE/PKG ORGANIZATION 32x8 32x8 256x4 256x4 256x4 256x4 256x4 256x4 512x4 -
OCR Scan
7611 prom mi 7641 4096X4 7621 prom E-16-LEAD 28-LEAD MIL-M-38510
Abstract: describe an asynchronous version of the 16x16 FIFO buffer, and 32x8 and 64x8 FIFO buffers with both , data multiplexing between multiple RAM banks. The asynchronous 32x8 FIFO buffer requires 28 CLBs and Xilinx
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FIFO 32x8 16-WORD XC4000E XC4000ETM
Abstract: predictable timing. Fast Decode Module 3200DX Floorplan JTAG SRAM SRAM 32x8 or 64x4 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 32x8 or 64x4 JTAG 32x8 or 64x4 SRAM Logic Modules 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 32x8 or 64x4 SRAM SRAM 32x8 or 64x4 Logic Modules JTAG SRAM Logic Modules 32x8 or 64x4 Fast Decode Module JTAG Figure 1 · 3200DX Floor Plan S e p t e m b e Nanya Technology
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ISO-9002 NT256D64S88B1G-6K NT56V1616A0T-7 NT256D64SH8B0GM-75B PC2100 PC2700-2533 NT512D64S8HB1G-6K PC100 PC133 DDR266 DDR333 ISO-9001
Abstract: Philips Semiconductors Military Bipolar Memory Products Product specification 82S23/S23A/S23B 82S123/123A/123B 256-bit TTL bipolar PROM (32x8) APPLICATIONS DESCRIPTION · Prototyping , -bit TTL bipolar PROM (32x8) ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER RATING UNIT +7 , -bit TTL bipolar PROM (32x8) AC ELECTRICAL CHARACTERISTICS -55°C < TA < +125°C, 4.5V < VCC < 5.5V , -bit TTL bipolar PROM (32x8) TIMING DIAGRAMS 3.0V ADDRESS VM 0V CE 0V VOH VM VOL tAA VM = -
OCR Scan
LM 458 0-300VDC 110/220VAC 3000VAC IEEE-587 LMS-3000 LMS-4000
Abstract: 21504 (39%) - 3072 tiles (10%) + 1 32x8 block RAM Single-cycle Axcelerator - 256x8 distributed RAM / AX500 / 5138 cells of 8064 (64%) ProASICPLUS - 32x8 distributed RAM / APA075 / 1037 , ) Performance Comb. Modules Seq. Modules Total Modules % (Device) RAM Blocks 32x8 , 655 527 1182 59 (AX125) 0 101 9.9 (Write) 643 (Read) 32x8 with Block RAM , ) 16x8 Distributed 1042 34 (APA075) 0 49 20.4 (Write) 347 (Read) 32x8 Distributed -
OCR Scan
8X353 8X305- 8X305 BD00630S AF01402S AF01411S
Abstract: MICROCONTROLLER Part Number PIC16C54 PIC16C55 PIC16C56 PIC16C57 Pins 18 28 18 28 I/O 12 20 12 20 RAM 32x8 32x8 32x8 80 X 8 ROM . - EPROM 512x12 512 x 12 1024 x 12 2048 x 12 Oscillator Range M in.Instr.Cycle , PIC1655 PIC1670 Pins 18 28 40 I/O 12 20 32 RAM 32x8 32 x 8 64 x 8 ROM 512 x 12 512 x 12 1 0 2 4 x 13 EPROM -
OCR Scan
lifo n8x355n UFO Systems 8X355 8X310 F106SO
Abstract: ST25C16CML6 ST25C16CML6TR 2K x 8 2K x 8 2K x 8 2K x 8 2K x 8 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 32x8 or 16x16 Write -
OCR Scan
8X372 N8X353N N8X353F X30S CDC0921S
Abstract: High Performance 32x8 PROM TiW PROM Family 53/63S080 53/63S081 63S081A Features/Benefits â'¢ 15-ns maximum access time â'¢ Reliable titanium-tungsten fuses (TiW) guarantee greater than 98 , NUMBER SIZE ORGANIZATION OUTPUT PINS TYPE 0°C to +75°C -55°C to +125°C 1/4 K 32x8 TS 16 , Configurations Block Diagram E Ol VCC 1 E 02 E E E 03 A4 a E 04 A3 32x8 E 05 A2 m E OS Ai ID E 07 AO ID E GMD OS H 02 01 NCVCC Ã' / 3 2 1 20 19 â'"s 03 £ 4 o 18 ] A4 04 : 5 17 ]A3 NC £ e 32x8 -
OCR Scan
LMS-9060 LMS-6000 LMS-7000 lambda LMS lms-6008 lms-9120 LMS-9040 lms-5008 LMS-3120 LMS-4120 LMS-5120 LMS-6120 LMS-7120
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