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Abstract: . Table 2. Arria II Devices Device Package Pins Lidless: UBGA, Flip Chip (EP2AGX45 EP2AGX45) 572 780 Lidless: UBGA, Flip Chip (EP2AGX65 EP2AGX65) EP2AGX65 EP2AGX65 Lidless: FBGA, Flip Chip (EP2AGX45 EP2AGX45) Lidless: FBGA, Flip Chip (EP2AGX45 EP2AGX45) EP2AGX45 EP2AGX45 358 358 Lidless: FBGA, Flip Chip, (EP2AGX65 EP2AGX65) 572 Lidless: FBGA, Flip Chip (EP2AGX65 EP2AGX65) EP2AGZ300 EP2AGZ300 (1) 572 Lidless: FBGA, Flip Chip (EP2AGX125 EP2AGX125) 780 1152 Lidless: FBGA, Flip Chip (EP2AGX190 EP2AGX190) 780 Lidless: FBGA, Flip Chip (EP2AGX190 EP2AGX190) 1152 Lidless ... Altera
Original
datasheet

554 pages,
17673.71 Kb

EP4CGX30 FBGA-484 datasheet ep1k30 pin HC335FF1152 fbga -1932 5M1270 EP4CE15 5M80 jedec package MO-247 5M40 5m570z 5M1270Z 5M240Z EP4CE55 DS-PKG-16 Altera EP4CE6 DS-PKG-16 EP4CE40 DS-PKG-16 EP4CE6 package DS-PKG-16 DS-PKG-16 DS-PKG-16 TEXT
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Abstract: Device Package Pins EP2S15 EP2S15 Flip Chip FBGA 484 Flip Chip FBGA 672 EP2S30 EP2S30 Flip Chip FBGA 484 Flip Chip FBGA 672 EP2S60 EP2S60 Flip Chip FBGA 484 Flip Chip FBGA EP2S90 EP2S90 672 Flip Chip FBGA 1,020 484 Flip Chip FBGA 780 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S130 EP2S130 Flip Chip FBGA 1,508 Flip Chip FBGA 780 Flip Chip FBGA 1,020 Flip Chip FBGA 1,508 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S180 EP2S180 1,508 Table 2 ... Altera
Original
datasheet

169 pages,
1673.74 Kb

EP2S30 EP2S180 EP2S15 Cyclone II EP2C35 Cross Reference altera ep610 EP2S60 EP2S90 flip chip bga 0,8 mm EPM7192 epm7064 cross reference EPF10K10A EPC-32 MS-034 1152 BGA processor cross reference ep600i TEXT
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Abstract: , Flip Chip (EP2AGX45 EP2AGX45) 572 780 572 Lidless: FBGA, Flip Chip (EP2AGX95 EP2AGX95) 780 1152 Lidless: FBGA, Flip Chip (EP2AGX125 EP2AGX125) 572 Lidless: FBGA, Flip Chip (EP2AGX125 EP2AGX125) 780 Lidless: FBGA, Flip Chip (EP2AGX125 EP2AGX125) EP2AGX260 EP2AGX260 Lidless: FBGA, Flip Chip, (EP2AGX65 EP2AGX65) Lidless: FBGA, Flip Chip (EP2AGX95 EP2AGX95) EP2AGX190 EP2AGX190 358 Lidless: FBGA, Flip Chip (EP2AGX95 EP2AGX95) EP2AGX125 EP2AGX125 780 Lidless: FBGA, Flip Chip (EP2AGX65 EP2AGX65) EP2AGX95 EP2AGX95 572 Lidless: UBGA, Flip Chip (EP2AGX65 EP2AGX65) EP2AGX65 EP2AGX65 Lidless: FBGA ... Altera
Original
datasheet

514 pages,
16706.78 Kb

311 3ag fBGA package tray 12 x 19 QFN PACKAGE thermal resistance FBGA 1760 fBGA package tray ALTERA CROSS REFERENCE 240 pin rqfp drawing TQFP 144 PACKAGE DIMENSION EP4CE22 DS-PKG-16 EP4CE55 jedec package MO-247 Theta JC of FBGA SOIC 20 pin package datasheet Altera pdip top mark BGA and QFP Altera Package mounting MS 034 EP4CE15 TEXT
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Abstract: Devices Device EP2S15 EP2S15 Package Pins 672 Flip Chip FBGA 484 Flip Chip FBGA EP2S60 EP2S60 484 Flip Chip FBGA EP2S30 EP2S30 Flip Chip FBGA 672 Flip Chip FBGA 484 Flip Chip FBGA Flip Chip FBGA 484 780 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S130 EP2S130 1,020 Flip Chip FBGA EP2S90 EP2S90 672 Flip Chip FBGA 1,508 780 Flip Chip FBGA 1,020 Flip Chip FBGA 1,508 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S180 EP2S180 Flip Chip FBGA 1,508 Table 2. Stratix GX ... Altera
Original
datasheet

159 pages,
1564.13 Kb

apex dot Cyclone II EP2C35 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 EPM3032A application epm3064 epm7032 plcc EPM7192 FBGA-484 datasheet HC1S30 324 bga thermal HC1S6 EP1800 TEXT
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Abstract: added for Stratix III Thermal Resistance information 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was added 1760-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was added "Wire Bond" and "Flip Chip" was added to title of each data sheet, as appropriate "BGA" was spelled , Enhanced configuration devices Table 2. Arria GX Devices in FineLine Ball Grid Array (FBGA) - Flip Chip , Information Data Sheet Table 2. Arria GX Devices in FineLine Ball Grid Array (FBGA) - Flip Chip Packages ... Altera
Original
datasheet

198 pages,
2742.7 Kb

epm7064 cross reference epm7064s cross reference FBGA 152 FBGA 63 altera TQFP 32 PACKAGE Cross Reference MO-192 DAF -1 84 FBGA thermal FBGA 1760 TQFP 144 PACKAGE DIMENSION MS-034 1152 BGA processor cross reference 240 pin rqfp drawing PQFP 176 TEXT
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Abstract: IEE Vacuum Fluorescent Displays, LED Hardware Visit IEE’s Website at www.ieeinc.com FLIP Century , 7 Dot Matrix Character Sets: ASCII, European, cVertical and Horizontal Scroll Modes Katakana, Cyrillic and Hebrew (Dot Matrix Units Only) cEight Software and Hardware Controlled Dimming Levels , , Downloadable Characters (Dot Matrix cScreen Saver Control Mode For Increased Tube Life Units Only) cBell Alarm Output (Dot Matrix Units Only) Key Features c100% Surface Mount Technology cParallel 8-Bit or Serial EIA ... Allied Electronics Catalog
Original
datasheet

1 pages,
62.01 Kb

Tube 6111 64-CHARACTER 3602-100-05420 10 pin 7 segment LED 32*32 led dot matrix 3601-90-080 LED DISPLAYS bit 3715 DMH23441R-05 5*7 led dot matrix display 5*7 led dot matrix driver hitachi fluorescent Display driver diagram of LED matrix display EIA-232 DMH22463R-04 EIA-232 14 pin dot matrix LED display diagram EIA-232 DMH22463R-05 EIA-232 diagram of LED dot matrix EIA-232 motorola dot matrix led display EIA-232 matrix Vacuum tube display EIA-232 IEE matrix Vacuum tube display EIA-232 EIA-232 EIA-232 TEXT
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Abstract: Flip Device · Align Bond Pads to Epoxy Dot (Alignment Marks Help) · Use Even Pressure to Make , GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000 DMK2783-000, DMK2790-000 DMK2790-000 I Designed for , I Low Parasitic Flip Chip Configuration Series Pair - DMK8001-000 DMK8001-000 Description This new series , subject to change without notice. 3/00A 3/00A 1 GaAs Flip Chip Schottky Diodes 0.080 0.076 0.072 , sales@alphaind.com · www.alphaind.com Specifications subject to change without notice. 3/00A 3/00A GaAs Flip Chip ... Alpha Industries
Original
datasheet

4 pages,
83.32 Kb

DMK8001-000 DMK2790-000 DMK2783-000 DMK2308-000 Ablebond 8380 Ablestick 8380 TEXT
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Abstract: Flip Device · Align Bond Pads to Epoxy Dot (Alignment Marks Help) · Use Even Pressure to Make , GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000 DMK2783-000, DMK2790-000 DMK2790-000 Designed for High , Applications Include PCN Mixers and Circuits, As Well As Low Power, Fast Switching Low Parasitic Flip Chip , sales@skyworksinc.com · www.skyworksinc.com Specifications subject to change without notice. 12/02A 12/02A 1 GaAs Flip , www.skyworksinc.com Specifications subject to change without notice. 12/02A 12/02A GaAs Flip Chip Schottky Diodes ... Skyworks Solutions
Original
datasheet

4 pages,
94.2 Kb

DMK8001-000 DMK2790-000 DMK2783-000 DMK2308-000 diodes in mil grade Ablestick 8380 Ablebond 8380 TEXT
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Abstract: GaAs Flip Chip Schottky Diodes DMK2790-000 DMK2790-000, DMK2308-000 DMK2308-000, DMK8001-000 DMK8001-000 Features s Designed for High , Mixers and Circuits, As Well As Low Power, Fast Switching s Low Parasitic Flip Chip Configuration Series , change without notice. 8/99A 8/99A 1 GaAs Flip Chip Schottky Diodes DMK2790-000 DMK2790-000, DMK2308-000 DMK2308-000, DMK8001 DMK8001 , www.alphaind.com Specifications subject to change without notice. 8/99A 8/99A GaAs Flip Chip Schottky Diodes , diameter of dot required. Curing Time Temperature 250°C 130°C 100°C 85°C Time 10 min. 20 min. 60 min. 120 ... Alpha Industries
Original
datasheet

4 pages,
68.49 Kb

Ablestick 8380 Ablebond 8380 DMK2790-000 DMK2308-000 DMK8001-000 TEXT
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Abstract: GaAs Flip Chip Schottky Diodes Features Designed for High Volume Designs High Frequency (20­100 , , Fast Switching Low Parasitic Flip Chip Configuration Series Pair - DMK8001-000 DMK8001-000 Anti-Parallel - , sales@skyworksinc.com · www.skyworksinc.com Specifications subject to change without notice. 3/00A 3/00A 1 GaAs Flip , /00A GaAs Flip Chip Schottky Diodes Suggested Setup Values For WEST-BOND Model 7200A Epoxy Die , diameter of dot required. Curing Time Temperature 250°C 130°C 100°C 85°C Time 10 min. 20 min. 60 min. 120 ... Skyworks Solutions
Original
datasheet

4 pages,
67.17 Kb

Ablebond 8380 DMK8001-000 DMK2308-000 DMK2783-000 DMK2790-000 TEXT
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