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Abstract: . Table 2. Arria II Devices Device Package Pins Lidless: UBGA, Flip Chip (EP2AGX45) 572 780 Lidless: UBGA, Flip Chip (EP2AGX65) EP2AGX65 Lidless: FBGA, Flip Chip (EP2AGX45) Lidless: FBGA, Flip Chip (EP2AGX45) EP2AGX45 358 358 Lidless: FBGA, Flip Chip, (EP2AGX65) 572 Lidless: FBGA, Flip Chip (EP2AGX65) EP2AGZ300 (1) 572 Lidless: FBGA, Flip Chip (EP2AGX125) 780 1152 Lidless: FBGA, Flip Chip (EP2AGX190) 780 Lidless: FBGA, Flip Chip (EP2AGX190) 1152 Lidless Altera
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EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z DS-PKG-16
Abstract: Device Package Pins EP2S15 Flip Chip FBGA 484 Flip Chip FBGA 672 EP2S30 Flip Chip FBGA 484 Flip Chip FBGA 672 EP2S60 Flip Chip FBGA 484 Flip Chip FBGA EP2S90 672 Flip Chip FBGA 1,020 484 Flip Chip FBGA 780 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S130 Flip Chip FBGA 1,508 Flip Chip FBGA 780 Flip Chip FBGA 1,020 Flip Chip FBGA 1,508 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S180 1,508 Table 2 Altera
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ep600i processor cross reference MS-034 1152 BGA EPC-32 EPF10K10A epm7064 cross reference DS-PKG-14
Abstract: , Flip Chip (EP2AGX45) 572 780 572 Lidless: FBGA, Flip Chip (EP2AGX95) 780 1152 Lidless: FBGA, Flip Chip (EP2AGX125) 572 Lidless: FBGA, Flip Chip (EP2AGX125) 780 Lidless: FBGA, Flip Chip (EP2AGX125) EP2AGX260 Lidless: FBGA, Flip Chip, (EP2AGX65) Lidless: FBGA, Flip Chip (EP2AGX95) EP2AGX190 358 Lidless: FBGA, Flip Chip (EP2AGX95) EP2AGX125 780 Lidless: FBGA, Flip Chip (EP2AGX65) EP2AGX95 572 Lidless: UBGA, Flip Chip (EP2AGX65) EP2AGX65 Lidless: FBGA Altera
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EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark SOIC 20 pin package datasheet Theta JC of FBGA
Abstract: Devices Device EP2S15 Package Pins 672 Flip Chip FBGA 484 Flip Chip FBGA EP2S60 484 Flip Chip FBGA EP2S30 Flip Chip FBGA 672 Flip Chip FBGA 484 Flip Chip FBGA Flip Chip FBGA 484 780 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S130 1,020 Flip Chip FBGA EP2S90 672 Flip Chip FBGA 1,508 780 Flip Chip FBGA 1,020 Flip Chip FBGA 1,508 Flip Chip FBGA 1,020 Flip Chip FBGA EP2S180 Flip Chip FBGA 1,508 Table 2. Stratix GX Altera
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EP1800 HC1S6 324 bga thermal HC1S30 FBGA-484 datasheet EPM7192 DS-PKG-13
Abstract: added for Stratix III Thermal Resistance information 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was added 1760-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was added "Wire Bond" and "Flip Chip" was added to title of each data sheet, as appropriate "BGA" was spelled , Enhanced configuration devices Table 2. Arria GX Devices in FineLine Ball Grid Array (FBGA) - Flip Chip , Information Data Sheet Table 2. Arria GX Devices in FineLine Ball Grid Array (FBGA) - Flip Chip Packages Altera
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PQFP 176 240 pin rqfp drawing TQFP 144 PACKAGE DIMENSION FBGA 1760 84 FBGA thermal MO-192 DAF -1 144-P 100-P 256-P 780-P 1517-P 1760-P
Abstract: IEE Vacuum Fluorescent Displays, LED Hardware Visit IEE's Website at www.ieeinc.com FLIP Century , 7 Dot Matrix Character Sets: ASCII, European, cVertical and Horizontal Scroll Modes Katakana, Cyrillic and Hebrew (Dot Matrix Units Only) cEight Software and Hardware Controlled Dimming Levels , , Downloadable Characters (Dot Matrix cScreen Saver Control Mode For Increased Tube Life Units Only) cBell Alarm Output (Dot Matrix Units Only) Key Features c100% Surface Mount Technology cParallel 8-Bit or Serial EIA Allied Electronics Catalog
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DMH23441R-05 IEE matrix Vacuum tube display matrix Vacuum tube display motorola dot matrix led display diagram of LED dot matrix DMH22463R-05 14 pin dot matrix LED display diagram EIA-232 DMH23441R-02 DMH24038-02 DMH23441R-03 DMH24038-03 DMH23441R-04
Abstract: Flip Device · Align Bond Pads to Epoxy Dot (Alignment Marks Help) · Use Even Pressure to Make , GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000, DMK2790-000 I Designed for , I Low Parasitic Flip Chip Configuration Series Pair - DMK8001-000 Description This new series , subject to change without notice. 3/00A 1 GaAs Flip Chip Schottky Diodes 0.080 0.076 0.072 , sales@alphaind.com · www.alphaind.com Specifications subject to change without notice. 3/00A GaAs Flip Chip Alpha Industries
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DMK2308-000 Ablestick 8380 Ablebond 8380
Abstract: Flip Device · Align Bond Pads to Epoxy Dot (Alignment Marks Help) · Use Even Pressure to Make , GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000, DMK2790-000 Designed for High , Applications Include PCN Mixers and Circuits, As Well As Low Power, Fast Switching Low Parasitic Flip Chip , sales@skyworksinc.com · www.skyworksinc.com Specifications subject to change without notice. 12/02A 1 GaAs Flip , www.skyworksinc.com Specifications subject to change without notice. 12/02A GaAs Flip Chip Schottky Diodes Skyworks Solutions
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diodes in mil grade
Abstract: GaAs Flip Chip Schottky Diodes DMK2790-000, DMK2308-000, DMK8001-000 Features s Designed for High , Mixers and Circuits, As Well As Low Power, Fast Switching s Low Parasitic Flip Chip Configuration Series , change without notice. 8/99A 1 GaAs Flip Chip Schottky Diodes DMK2790-000, DMK2308-000, DMK8001 , www.alphaind.com Specifications subject to change without notice. 8/99A GaAs Flip Chip Schottky Diodes , diameter of dot required. Curing Time Temperature 250°C 130°C 100°C 85°C Time 10 min. 20 min. 60 min. 120 Alpha Industries
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DMK23
Abstract: GaAs Flip Chip Schottky Diodes Features Designed for High Volume Designs High Frequency (20­100 , , Fast Switching Low Parasitic Flip Chip Configuration Series Pair - DMK8001-000 Anti-Parallel - , sales@skyworksinc.com · www.skyworksinc.com Specifications subject to change without notice. 3/00A 1 GaAs Flip , /00A GaAs Flip Chip Schottky Diodes Suggested Setup Values For WEST-BOND Model 7200A Epoxy Die , diameter of dot required. Curing Time Temperature 250°C 130°C 100°C 85°C Time 10 min. 20 min. 60 min. 120 Skyworks Solutions
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Abstract: GaAs Flip Chip Mixer Diodes E SAlpha DMK2790-000, DMK2308-000 Single F eat ur e s Designed , Include PCN Mixers and Circuits Low Parasitic Flip Chip Configuration De s c ri p t io n This new series , Specifications subject to change without notice. 2/99A 1 GaAs Flip Chip Mixer Diodes DMK2790 , · www.alphaind.com Specifications subject to change without notice. 2/99A GaAs Flip Chip Mixer , m l e s s Flip Chip Diodes - To Soft or Hard S ub s tr at e - As P la te d Epoxy Microelectronic -
OCR Scan
Abstract: Flip Chip All dimensions and tolerances conform to ASME Y14.5M ­ 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on , - Flip Chip All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity , Outlines 780-Pin FineLine BGA - Flip Chip All dimensions and tolerances conform to ASME Y14 Altera
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MS-034 BGA 64 PACKAGE thermal resistance BGA PACKAGE OUTLINE 780 AC BGA L 63SN 37PB S53008-3 EP1S10 EP1S25 EP1S20 EP1S30 EP1S40
Abstract: Conductive Epoxy Perform Die Attach · Flip Device · Align Bond Pads to Epoxy Dot (Alignment Marks Help) · , GaAs Flip Chip Mixer Diodes Features Designed for High Volume Designs High Frequency (2 0 -1 0 , Parasitic Flip Chip Configuration E BAlpha DM K2790-000, DMK2308-000 S ing le PC m Nl A , change without notice. 2/99A 7-5 GaAs Flip Chip Mixer Diodes DMK2790-000, DMK2308 , subject to change without notice. 2/99A GaAs Flip Chip Mixer Diodes DMK2790-000, DMK2308 -
OCR Scan
Abstract: Figure 9. Flip chip tape and reel specification Dot identifying Pin A1 location 4 +/- 0.1 4 Ordering , interference. The flip chip packaging means the package size is equal to the die size. This filter includes ESD , . Coated flip chip package Pin configuration (Bumps side) Benefits 12 11 10 I8 G ND GND , Version (2 digits) C: Coated flip chip 1: Pitch = 500 um, Bump = 315 um 2: Lead free Pitch = 500 um, Bump = 315 um vv - xxx zz C y 3 Package mechanical data flip chip 500um +/-50 250um STMicroelectronics
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EMIF08-VID01C1 IEC61000-4-2
Abstract: GaAs Flip Chip Schottky Diodes Alpha DMK2790-000, DMK2308-000, DMK8001-000 Features â ,   Applications Include PCN Mixers and Circuits, As Well As Low Power, Fast Switching â  Low Parasitic Flip Chip , sales@alphaind.com â'¢ www.alphaind.com Specifications subject to change without notice. 8/99A 1 GaAs Flip Chip , without notice. 8/99A GaAs Flip Chip Schottky Diodes DMK2790-000, DMK2308-000, DMK8001-000 Suggested , Force 35 grams at tool. Dispense Air 30 psi. Dispense Time To give diameter of dot required. Curing -
OCR Scan
Alpha DMK2790 8380 B-1831-1 B-1831-2 2101-W625-CT-031
Abstract: electromagnetic interferences. The EMIF02 flip chip packaging means the package size is equal to the die size , subjected to ESD surges up 15kV. Flip Chip package BENEFITS s s s s s s s EMI symmetrical , 315Âum EMI Filter Number of lines Flip Chip x: resistance value (Ohms) z: capacitance value , MECHANICAL DATA FLIP CHIP 500Âum ± 10 650Âum ± 50 315Âum ± 50 50 0Âu m ± 15 1.47mm , : 340Âum min for 300Âum copper pad diameter MARKING 365 240 365 Dot, ST logo xxx = marking STMicroelectronics
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EMIF02-MIC03F1 EMIF02-MIC03 AN1235
Abstract: Application Note Epoxy Die Attachment for GaAs Flip Chip Devices APN3001 A major concern in , materials of the assembly. or PC board. The epoxy dot size was determined to be 0.008" in diameter and , of the flip chip device. Flip Chip The epoxy to be used in the die attach process must be , step in developing a die attach process for the flip chip devices was to select an epoxy that would be , one recommended and used to develop the process for attaching the flip chip devices is Ablebond 8380 Skyworks Solutions
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Ablestik 8380 Die Attach epoxy stamping FR4 substrate height and thickness FR4 substrate epoxy FR4 substrate height and thickness 1.2 Ablebond 6/99A
Abstract: electromagnetic interference. The flip chip packaging means the package size is equal to the die size. Lead free flip chip package Pin configuration (Bumps side) This filter includes ESD protection , value / 10 pF or Application (3 letters) and Version (2 digits) F: Flip chip 1: Pitch = 500 um, Bump = 315 um 2: Lead free Pitch = 500 um, Bump = 315 um 3 Package mechanical data flip chip , print recommendation 240 365 Dot, ST Logo xx = marking z = packaging location yww = date STMicroelectronics
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EMIF08-VID01F2
Abstract: Figure 12. Flip Chip tape and reel specification Dot identifying Pin A1 location 3.5 ± 0.1 8 ± 0.3 , of parasitic elements through integration and wafer level packaging Flip Chip package (5 bumps , capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 2 , pad diameter Figure 11. Marking Dot, ST logo xx = marking z = manufacturing location yww = , information is available in the application notes: AN1235:"Flip Chip: Package description and recommendations STMicroelectronics
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EMIF02-SPK02F2 AN1751 JESD97
Abstract: Flip Chip package (4 bumps) Figure 1. Pin configuration (bump side) GND GND IN OUT , = application 2 digits = version Package F = Flip Chip x = 3: lead-free, pitch = 400 um, bump = , EMIF01-TV02F3 Figure 9. Footprint Figure 10. Marking Dot xx = marking z = manufacturing location , Figure 11. Flip Chip tape and reel specification Ø 1.5 ± 0.1 3.5 ±- 0.05 0.95 xxz yww 0.95 , /8 1.75 ± 0.1 Dot identifying pin A1 location User direction of unreeling EMIF01-TV02F3 STMicroelectronics
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