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"exposed pad" PCB via

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Recommended PCB pad pattern Recommended via position Place one via in the center of PCB pad , (PQFN) Package 1 Purpose This document provides guidelines for Printed Circuit Board (PCB , PCB mounting processes and board design. © Freescale Semiconductor, Inc., 2007. All rights , pads for thermal management. Care should be taken to design pads on a PCB that are compatible with the , to the PCB with x-ray analysis. The periphery lead length under the package should be the nominal ... Freescale Semiconductor
Original
datasheet

16 pages,
1607.58 Kb

PQFN package power freescale PQFN 8 leads JESD51-5 AN2467 "exposed pad" PCB via PQFN footprint DUAL ROW QFN leadframe PQFN TEXT
datasheet frame
Abstract: 7: PCB Thermal Pad and Via Array for 7x7mm, 48 Lead and 10x10mm, 68 lead Packages. 3.3 Solder , ) via encroached from bottom surface of the PCB. All of these options have pros and cons when , as a function of Via type and paste coverage The fillet formation is also a function of PCB land , , 2.9 mils standoff (d) 81% paste coverage, Encroached via, 2.1 mils standoff (e) large PCB pads , : Solder fillet shape as a function of paste coverage in the thermal pad, via type, standoff, and PCB land ... Amkor Technology
Original
datasheet

19 pages,
760.32 Kb

3x3 matrix IPC-SM-782 paste profile "exposed pad" PCB via Thermocouple Type js smd JH die paddle footprint mlf nozzle heater guideline pad dimension 1210 led 3mm 8x8 matrix mlf 0.3mm pitch MLF 6x6 Amkor CSP mold compound 0.3mm pitch csp package led matrix 8x8 mini circuits PCB design for 0.2mm pitch csp package TEXT
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Abstract: mm. For both packages the same via grid was used in the simulation. The maximum PCB temperature was , Package (a) Leadframe + chip Figure 4 (b) Top view PCB (c) Detail (via grid) Schematic of the , nearly 90% of the heat generated flows away from the junction to the PCB via the ePad. Thus a high , BTS5682E BTS5682E, BTS5672E BTS5672E and BTS5662E BTS5662E. The comparisons are done on the same printed circuit board (PCB). The , and PCB temperature. Additionally to that, the basics of the two DSO package groups are described ... Infineon Technologies
Original
datasheet

12 pages,
435.75 Kb

"exposed pad" PCB via TEXT
datasheet frame
Abstract: properties. Thermal performance is a system level concern, impacted by IC packaging as well as PCB design , device. The exposed pad on ICs is intended to provide significant power dissipation, and the PCB designer should add vias from the exposed pad's land area to a copper polygon on the other side of the PCB , performance by proper PCB layout of the exposed pad will also be provided. General Description Most of the heat generated by an IC is conducted to the PCB and then radiates from the PCB to the ambient ... Original
datasheet

3 pages,
49.21 Kb

copper thermal AIC1573 thermal pcb guidelines "thermal via" "exposed pad" PCB via TEXT
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Abstract: . Plated thru via holes in the PCB ground pad should be 0.33 mm (0.013") in diameter and plugged. If via , APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and , Via. 0.063 (1.60 mm) Typ. 0.008 (0.20 mm) 0.110 0.126 (2.79 mm) (3.20 mm) Sq. 1.270 mm Lead Length of LPCC Lead Width Outside of Package 5.200 mm Footprint of PCB Land = Lead Length +0.1 mm , ) GND Via. 0.063 (1.60 mm) Typ. 0.75 mm Ref. 1.65 mm Ref. 0.020 (0.50 mm) 0.40 mm Ref. SC ... Skyworks Solutions
Original
datasheet

7 pages,
744.49 Kb

jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern land pattern for TSsOP 16 recommended land pattern for soic land pattern for TSSOP 24 pin qfn 88 stencil SOIC 8 pcb pattern tssop 16 exposed pad stencil IPC-SM-782 TEXT
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Abstract: Standoff 81% Paste Coverage, Encroached Via, 2.1 mil Standoff Large PCB Pads, 81% Paste Coverage, Plugged Vias 8 37% Paste coverage, Encroached Via, 0.6 mil Standoff Small PCB Pads, 81% Paste , 1. Introduction This document provides PCB designers with a set of guidelines for , electrical contact to the PCB is made by soldering the lands on the bottom surface of the package to the PCB, instead of the conventional formed perimeter leads. The ePad technology enhances the thermal and ... Atmel
Original
datasheet

13 pages,
292.65 Kb

10x10 qfn AT88RF1354 atmel QFN atmel Reflow soldering IPC-SM-782 qfn 44 7x7 PACKAGE footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 footprint Soldering guidelines pin in paste amkor exposed pad qfn 48 7x7 stencil TEXT
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Abstract: Thermal Via Direct Connection to Ground Plane Thermal Isolation Figure 5: Four-Layer PCB with , Die Cu Exposed Contact Exposed Die Attach Pad Figure 3: Exposed-Paddle Package. PCB , conducted to the PCB and then radiates to the surrounding environment. An exposed paddle IC augments the heat transfer process by establishing a low thermal resistive path to the PCB. There must be an area , under the package and located on the top of the PCB. Its geometry is a square or rectangle and should ... Advanced Analogic Technologies
Original
datasheet

5 pages,
223.62 Kb

thermal pcb guidelines AN-121 DFN PACKAGE thermal resistance QFN footprint QFN44-24 QFN PACKAGE thermal resistance qfn44 "thermal via" "exposed pad" PCB via land pattern for DFN TEXT
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Abstract: example of the recommended board layout for a PCB package. Thermal Via Copper area Figure 2. Board Layout for a PCB Package 2.1 Solder Mask Defined Thermal Pad The solder mask defined , equal to 0,3 mm Unfilled Via Figure 5. X-Ray ­ PCB Device With Internal and External Vias If thin , printed-circuit board (PCB) designers understand and better use this information for optimal designs. The , heat sinks and slugs. This package can be easily mounted using standard PCB assembly techniques and ... Texas Instruments
Original
datasheet

7 pages,
858.36 Kb

vias thermal pcb guidelines SLMA002 heat slugs attach "exposed pad" PCB via hatching machine SLOA120 TEXT
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Abstract: . 3 PCB Design Recommendations , . 11 PCB SURFACE FINISH REQUIREMENTS , Printed Circuit Board (PCB) footprint: - Soldering the exposed die attach pad (DAP) to the PCB provides , to the PCB during reflow. The LLP is offered in either dual-in-line (DIP) or quad configuration , on the PCB when necessary. NSMD pads require a ± 0.075 mm (3 mils) clearance around the copper pad ... National Semiconductor
Original
datasheet

25 pages,
2050.52 Kb

4X4 KEY PAD AN-1187 AN1187 MO-229 MO-220 LDA08B dap 07 smd DAP 08 dap 11 dap sot 23-5 JESD22-B111 DAP 07 SAC305 reflow profile sac305 thermal conductive PCB design for 0.2mm pitch csp package TEXT
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Abstract: via diameter. The solder mask thickness should be the same across the entire PCB. A package thermal , . 3 PCB Design Recommendations , . 11 PCB SURFACE FINISH REQUIREMENTS , processing. Printed Circuit Board (PCB) footprint: - Soldering the exposed die attach pad (DAP) to the PCB , . · Facilitates package self alignment to the PCB during reflow. The LLP is offered in either ... National Semiconductor
Original
datasheet

24 pages,
28717.47 Kb

AN-1187 DAP 08 LDA08A LQB08A MO-220 MO-229 SDD04A SQF60A SPA52A dap sot 23-5 transistor smd sensor 80L DAP 07 JESD22-B111 TEXT
datasheet frame

Archived Files

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Figure 16: Mounting on PCB with ground layer Copper foil Ground layer D94AN011 D94AN011 via holes Figure PCB, with loss of time, productivity, floor space and money; 2-They force the use of wave soldering thermal path between the junc- tion and suitable dissipating areas obtained on the PCB and connected to elements and ground layer It must be noticed that previous data are ob- served with a simple PCB, with ) offered by this solution is 20-25 5 C/W for 2.0 - 2.5 5 W dissipation. 3.3.2 Via holes and ground
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/1732-v3.htm
STMicroelectronics 25/05/2000 38.78 Kb HTM 1732-v3.htm
structure for in- sertion and are mounted manually in the PCB, with loss of time, productivity, floor space the PCB and connected to the heat transfer leads (Figure 12). Typical representatives of the medium served with a simple PCB, with single or double face. In applications using multilayer boards, a much ambient. Rth(j-a) offered by this solution is 20-25 5 C/W for 2.0 - 2.5 5 W dissipation. 3.3.2 Via holes and ground layer If via holes are used as in Figure 17, a more di- rect thermal path is obtained from
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/1732.htm
STMicroelectronics 20/10/2000 40.14 Kb HTM 1732.htm
the PCB, with loss of time, productivity, floor space and money; 2-They force the use of wave the PCB and connected to the heat transfer leads (Figure 12). Typical representatives of the medium served with a simple PCB, with single or double face. In applications using multilayer boards, a much ambient. Rth(j-a) offered by this solution is 20-25 5 C/W for 2.0 - 2.5 5 W dissipation. 3.3.2 Via holes and ground layer If via holes are used as in Figure 17, a more di- rect thermal path is obtained from
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/1732-v1.htm
STMicroelectronics 02/04/1999 36.9 Kb HTM 1732-v1.htm
the PCB, with loss of time, productivity, floor space and money; 2-They force the use of wave the PCB and connected to the heat transfer leads (Figure 12). Typical representatives of the medium served with a simple PCB, with single or double face. In applications using multilayer boards, a much ambient. Rth(j-a) offered by this solution is 20-25 5 C/W for 2.0 - 2.5 5 W dissipation. 3.3.2 Via holes and ground layer If via holes are used as in Figure 17, a more di- rect thermal path is obtained from
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/1732-v2.htm
STMicroelectronics 14/06/1999 36.87 Kb HTM 1732-v2.htm
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Linear 22/09/2009 1068.55 Kb ZIP 468a.zip