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Part Manufacturer Description PDF & SAMPLES
EL5427CL-T13 Intersil Corporation 12 BUFFER AMPLIFIER, QCC32, EXPOSED PAD, LPP-32
EL5327CL-T13 Intersil Corporation 10 BUFFER AMPLIFIER, QCC24, EXPOSED PAD, LPP-24
EL5227CL-T7 Intersil Corporation OCTAL BUFFER AMPLIFIER, QCC24, EXPOSED PAD, LPP-24
EL5227CL-T13 Intersil Corporation OCTAL BUFFER AMPLIFIER, QCC24, EXPOSED PAD, LPP-24
EL5327CL-T7 Intersil Corporation 10 BUFFER AMPLIFIER, QCC24, EXPOSED PAD, LPP-24
EL5427CLZ Intersil Corporation 12 BUFFER AMPLIFIER, QCC32, LEAD FREE, EXPOSED PAD, LPP-32

"exposed pad" PCB via

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Recommended PCB pad pattern Recommended via position Place one via in the center of PCB pad , (PQFN) Package 1 Purpose This document provides guidelines for Printed Circuit Board (PCB , PCB mounting processes and board design. © Freescale Semiconductor, Inc., 2007. All rights , pads for thermal management. Care should be taken to design pads on a PCB that are compatible with the , to the PCB with x-ray analysis. The periphery lead length under the package should be the nominal Freescale Semiconductor
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AN2467 PQFN DUAL ROW QFN leadframe PQFN footprint JESD51-5 PQFN 8 leads
Abstract: 7: PCB Thermal Pad and Via Array for 7x7mm, 48 Lead and 10x10mm, 68 lead Packages. 3.3 Solder , ) via encroached from bottom surface of the PCB. All of these options have pros and cons when , as a function of Via type and paste coverage The fillet formation is also a function of PCB land , , 2.9 mils standoff (d) 81% paste coverage, Encroached via, 2.1 mils standoff (e) large PCB pads , : Solder fillet shape as a function of paste coverage in the thermal pad, via type, standoff, and PCB land Amkor Technology
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PCB design for 0.2mm pitch csp package led matrix 8x8 mini circuits 0.3mm pitch csp package Amkor CSP mold compound MLF 6x6 mlf 0.3mm pitch
Abstract: mm. For both packages the same via grid was used in the simulation. The maximum PCB temperature was , Package (a) Leadframe + chip Figure 4 (b) Top view PCB (c) Detail (via grid) Schematic of the , nearly 90% of the heat generated flows away from the junction to the PCB via the ePad. Thus a high , BTS5682E, BTS5672E and BTS5662E. The comparisons are done on the same printed circuit board (PCB). The , and PCB temperature. Additionally to that, the basics of the two DSO package groups are described Infineon Technologies
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Abstract: properties. Thermal performance is a system level concern, impacted by IC packaging as well as PCB design , device. The exposed pad on ICs is intended to provide significant power dissipation, and the PCB designer should add vias from the exposed pad's land area to a copper polygon on the other side of the PCB , performance by proper PCB layout of the exposed pad will also be provided. General Description Most of the heat generated by an IC is conducted to the PCB and then radiates from the PCB to the ambient -
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AIC1573 thermal pcb guidelines copper thermal
Abstract: . Plated thru via holes in the PCB ground pad should be 0.33 mm (0.013") in diameter and plugged. If via , APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and , Via. 0.063 (1.60 mm) Typ. 0.008 (0.20 mm) 0.110 0.126 (2.79 mm) (3.20 mm) Sq. 1.270 mm Lead Length of LPCC Lead Width Outside of Package 5.200 mm Footprint of PCB Land = Lead Length +0.1 mm , ) GND Via. 0.063 (1.60 mm) Typ. 0.75 mm Ref. 1.65 mm Ref. 0.020 (0.50 mm) 0.40 mm Ref. SC Skyworks Solutions
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tssop 16 exposed pad stencil SOIC 8 pcb pattern qfn 88 stencil land pattern for TSSOP 24 pin recommended land pattern for soic land pattern for TSsOP 16 IPC-SM-782 SC-70 SC-79
Abstract: Standoff 81% Paste Coverage, Encroached Via, 2.1 mil Standoff Large PCB Pads, 81% Paste Coverage, Plugged Vias 8 37% Paste coverage, Encroached Via, 0.6 mil Standoff Small PCB Pads, 81% Paste , 1. Introduction This document provides PCB designers with a set of guidelines for , electrical contact to the PCB is made by soldering the lands on the bottom surface of the package to the PCB, instead of the conventional formed perimeter leads. The ePad technology enhances the thermal and Atmel
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qfn 48 7x7 stencil amkor exposed pad Soldering guidelines pin in paste qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint
Abstract: Thermal Via Direct Connection to Ground Plane Thermal Isolation Figure 5: Four-Layer PCB with , Die Cu Exposed Contact Exposed Die Attach Pad Figure 3: Exposed-Paddle Package. PCB , conducted to the PCB and then radiates to the surrounding environment. An exposed paddle IC augments the heat transfer process by establishing a low thermal resistive path to the PCB. There must be an area , under the package and located on the top of the PCB. Its geometry is a square or rectangle and should Advanced Analogic Technologies
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AN-121 land pattern for DFN qfn44 QFN PACKAGE thermal resistance QFN44-24 QFN footprint
Abstract: example of the recommended board layout for a PCB package. Thermal Via Copper area Figure 2. Board Layout for a PCB Package 2.1 Solder Mask Defined Thermal Pad The solder mask defined , equal to 0,3 mm Unfilled Via Figure 5. X-Ray ­ PCB Device With Internal and External Vias If thin , printed-circuit board (PCB) designers understand and better use this information for optimal designs. The , heat sinks and slugs. This package can be easily mounted using standard PCB assembly techniques and Texas Instruments
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hatching machine heat slugs attach SLMA002 vias SLOA120
Abstract: . 3 PCB Design Recommendations , . 11 PCB SURFACE FINISH REQUIREMENTS , Printed Circuit Board (PCB) footprint: - Soldering the exposed die attach pad (DAP) to the PCB provides , to the PCB during reflow. The LLP is offered in either dual-in-line (DIP) or quad configuration , on the PCB when necessary. NSMD pads require a ± 0.075 mm (3 mils) clearance around the copper pad National Semiconductor
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AN-1187 sac305 thermal conductive SAC305 reflow profile DAP 07 JESD22-B111 dap sot 23-5 dap 11 CSP-9-111C2 CSP-9-111S2
Abstract: via diameter. The solder mask thickness should be the same across the entire PCB. A package thermal , . 3 PCB Design Recommendations , . 11 PCB SURFACE FINISH REQUIREMENTS , processing. Printed Circuit Board (PCB) footprint: - Soldering the exposed die attach pad (DAP) to the PCB , . · Facilitates package self alignment to the PCB during reflow. The LLP is offered in either National Semiconductor
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transistor smd sensor 80L SPA52A SQF60A SDD04A MO-229 MO-220
Abstract: allows, a gap of 0.25mm or more is preferred. 4. Plated thru via holes in the PCB pad should be 0.33mm , VQFN PCB Design Guidance Notes Publication: D/VQFN/2 February 2008 General guidelines on using the CML VQFN package © 2008 CML Microsystems Plc VQFN PCB Design Guidance Notes 1 , Connection Pad End Surface Figure 2 Electrical contact is via rectangular pads around the perimeter of , soldered to the PCB in addition to the pins. The dot in the corner of the package and/or the cut off CML Microcircuits
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VQFN package jedec package MO-220 Die Attach epoxy stamping IPC A 610
Abstract: diameter = 13 mils) Figure 2. 20-Pin DWP PowerPAD PCB Etch and Via Pattern 4. Connect all holes , board (PCB) assembly techniques, and can be removed and replaced using standard repair procedures , printed circuit board (PCB), using the PCB as a heatsink. In addition, through the use of thermal vias , into the PCB. LEADFRAME (COPPER ALLOY) IC (SILICON) DIE ATTACH (EPOXY) ÔÔÔÔÔ ÉÉÉÉÉ ÔÔÔÔÔ , PowerPAD Package PowerPAD Assembly Process 1. Prepare the PCB with a top side etch pattern as shown in Texas Instruments
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SLMA004 SLMA002 LAND PATTERN powerPAD
Abstract: Thermal Pad and Via Design Tolerance analysis should be performed on the package and the PCB dimensions , diameter should be 100 microns larger than the diameter of the via. www.xilinx.com PCB Pad Pattern , Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for , directly soldered to the PCB. Additionally, this near chip scale package offers improved electrical , considerations are required to properly assemble the package and design the PCB. For optimal thermal, electrical Xilinx
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XAPP439 land pattern for QFN 7x7 qfn 28 land pattern 24 leads qfn 5x5 qfn 3X3 land pattern pcb design 0,5 mm pitch 5x5 matrix
Abstract: helps printed-circuit board (PCB) designers understand and better use this information for optimal , of bulky heat sinks and slugs. This package can be easily mounted using standard PCB assembly , Copper Areas Copper areas on and in a PCB act as heat sinks for the QFN device. Top copper areas should , copper layer of the PCB to the inner or bottom copper layers. TI provides the recommended layout of the thermal vias in most data sheets. The recommended via diameter is 0,3 mm or less, and the recommended via Texas Instruments
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SLOA122 TEXAS INSTRUMENTS, Mold Compound QFN SLUA271 dsp layout guidelines
Abstract: 3.4.1 3.5 3.6 PCB DESIGN GUIDELINES Land Pad Styles Land Pad Design Lead Finger Pad PCB Design Exposed Pad PCB Design Via Design Solder Mask Surface Finishes 4.0 4.1 4.2 4.3 4.4 SOLDER , that via tenting from the top is less likely to produce voids between the exposed pad and the pcb , Solder Reflow PCB Cleaning Inspection 6.0 6.1 6.2 6.3 REWORK Component Removal Cleaning and Prep of the PCB Land Component Replacement & Reflow 7.0 Appendix April 2002 Page 1 MLP Carsem
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VPI-1000 IPC-7527 IPC7527 QFN 16 CARSEM package outline metcal VPI-1000 QFN 8 CARSEM APR-5000
Abstract: by a surface-mount package is conducted to the PCB and then radiates to the surrounding environment , path to the PCB. There must be an area of solderable copper underneath the exposed pad. This area is , package and located on the top of the PCB. Its geometry is a square or rectangle and should be the same , top layer ground plane. Thermal Layers in the PCB Figure 3. Exposed-Paddle Package PCB Layout , For a double-sided PCB, using a minimum 1 oz. of copper, the surface layers (top and bottom) must be Skyworks Solutions
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Abstract: between exposed pad and board 10. Thermal via design 6.2 RESULTS AND DISCUSSION Comparison among PCB , . 2 3.0 DOE of PCB (Printed Circuit Board) Design , . 7 7.0 PCB Design Recommendations , AN-1520 and suggest guidelines for designing the PCB for JA measurement of exposed packages. The , high power devices since the PCB will critically affect the thermal performance, including device National Semiconductor
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pcb thermal Design guide trace theta AN1520 LM2652
Abstract: via, 2.9 mil standoff 81% paste coverage, encroached via, 2.1 mil standoff Large PCB pads, 81 , provides PCB designers with a set of guidelines for successful board mounting of Atmel's DataFlash , the PCB is made by soldering the lands on the bottom surface of the package to the PCB, instead of , properties of the package. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB , , for proper heat conduction through the board, thermal vias need to be incorporated in the PCB in the Atmel
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3641B atmel Reflow soldering die paddle atmel touch pattern
Abstract: , etc.). These devices require an extensive thermal via structure in the PCB center pad area for thermal management. Figure 1 shows a typical PCB layout for this type of package showing via holes in , EXPOSED HEAT SPREADER PQFN PCB a d THERMAL VIA PERIPHERAL PADS CENTER PAD WITH THERMAL , holes in the PCB. However, during solder reflow, the liquid solder tends to wick into the thermal via , minimize the thermal resistance of the PCB. Before determining the via hole design, an analysis of the Freescale Semiconductor
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AN3778 SAC305 PQFN-24 rf 4 mm PQFN SAC-305
Abstract: plug the via, the thermal vias can be tented with solder mask on the top surface of the PCB. The , . 5 PCB Design Recommendations , . 9 PCB SURFACE FINISH REQUIREMENTS , recommends a one-to-one correlation between the PCB land patterns and the package footprint. - Soldering the exposed die attach pad (DAP) to the PCB provides the following advantages: - Optimizes thermal National Semiconductor
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package tray design dwg
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