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ISL12022IBZ-T Intersil Corporation Low Power RTC with Battery-Backed SRAM and Embedded Temp Comp ±5ppm with Auto Day Light Saving; SOIC8; Temp Range: -40° to 85°C
ISL12022IBZ Intersil Corporation Low Power RTC with Battery-Backed SRAM and Embedded Temp Comp ±5ppm with Auto Day Light Saving; SOIC8; Temp Range: -40° to 85°C
ISL12023IVZ Intersil Corporation Low Power RTC with Battery-Backed SRAM and Embedded Temp Compensation ±5ppm with Auto Day Light Saving; TSSOP14; Temp Range: -40° to 85°C
ISL12023IVZ-T Intersil Corporation Low Power RTC with Battery-Backed SRAM and Embedded Temp Compensation ±5ppm with Auto Day Light Saving; TSSOP14; Temp Range: -40° to 85°C
ISL12022IBZ-T7A Intersil Corporation Low Power RTC with Battery-Backed SRAM and Embedded Temp Comp ±5ppm with Auto Day Light Saving; SOIC8; Temp Range: -40° to 85°C
TMDSDSPTXT Texas Instruments DSP Software Development Techniques for Embedded and Real-Time Systems

"embedded dram" and market and mcp

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: ) MCP (Multi-Chip-Package) The future of MCP: moviMCPTM and PRAM As the popularity of handheld , , and now even PRAM technology. Samsung moviMCPTM is the newest generation of MCP technology , with the space and power savings of an MCP. moviMCP can eliminate the need to design for external , -chip MCP · Faster system performance at lower power · Lower BOM count simplifies manufacturing and cost · Faster time to market The latest MCP solution from Samsung replaces NOR Flash with PRAM ­ the Samsung Semiconductor
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samsung eMMC 4.5 eMMC lpddr2 samsung* lpddr2 emmc 4.5 SAMSUNG emmc 200MH BRO-09-DRAM-001
Abstract: , SRAM and flash · Samsung has developed MCP technology for 2- to 16-chip stacks · MCPs can include flash (NAND, NOR, OneNAND), SRAM/UtRAM and mobile DRAM · For its 16-die MCP, Samsung created a new , developed by JEDEC and MMCA moviMCP This MCP version of moviNAND is aimed at high-end 3G mobile phones , integrate different memory technologies and can also include logic, software and other elements on a single , Samsung Fusion Semiconductors performance and cut costs while enabling mobile products to be smaller Samsung Electronics
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movinand samsung 32GB Nand flash MLC memory Samsung 8Gb MLC Nand flash Flex-OneNAND Samsung Samsung 16GB Nand flash oneDRAM BR-07-MEM-001
Abstract: : For semiconductor products, flat panel displays, and PC cards in the U.S., Canada and Mexico, please , contact for resolving customer issues and answering technical questions. Web: Click on Tech Support in , 5 PST outside U.S., Canada & Mexico call: 010-1-408-922-9000 and ask for the Customer Response , in this document has been carefully checked and is believed to be reliable. However, Fujitsu , not convey any license under the copyrights, patent rights or trademarks claimed and owned by Fujitsu Fujitsu
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mb87020 tag 9335 MB87086 MB87086A 2M X 32 Bits 72-Pin Flash SO-DIMM prescaler fujitsu mb506 SD-SG-20342-9/96
Abstract: computing to embedded applications but at consumer electronics pricing with MIPS-per-dollar and , with a large instruction and data cache, memory-management unit (MMU), and read/write buffers running , communication channels, a color/gray scale LCD controller, PCMCIA support for up to two sockets, and , generation - Internal phase-locked loop (PLL) - 3.686-MHz oscillator - 32.768-kHz oscillator Big and , data cache 32-entry MMUs - Maps 4 Kbyte, 8 Kbyte, or 1 Mbyte Write buffer - 8-entry, between 1 and -
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SA-1100 686-MH
Abstract: clocked and other units remain static. s Speeds time to market with its complete suite of software , computing to embedded applications but at consumer electronics pricing with MIPS-per-dollar and , with a large instruction and data cache, memory-management unit (MMU), and read/write buffers running , communication channels, a color/gray scale LCD controller, PCMCIA support for up to two sockets, and , and little endian operating modes s Write buffer - 8-entry, between 1 and 16 bytes each s Intel
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EPOC32 intel 27809 S1100 UCB1100 UCB1200
Abstract: only currently required units are clocked and other units remain static. s Speeds time to market , computing to embedded applications but at consumer electronics pricing with MIPS-per-dollar and , with a large instruction and data cache, memory-management unit (MMU), and read/write buffers running , communication channels, a color/gray scale LCD controller, PCMCIA support for up to two sockets, and , and little endian operating modes s Write buffer - 8-entry, between 1 and 16 bytes each s Intel
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Philips metal trim pots
Abstract: time to market. · Compatibility with ARM and the availability of key third-party development tools , Important Notice As of May 17, 1998, Digital Equipment Corporation's StrongARM, PCI Bridge, and , acquired by Intel Corporation and transferred to Intel Massachusetts, Inc. As a result of this transaction, certain references to web sites, telephone numbers, and fax numbers have changed in the documentation , ordering number and are referenced in this document, or other Intel literature may be obtained by calling Digital Equipment
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executive protocol vending
Abstract: , services and operating systems. Numerous Flash + pSRAM and Flash + DRAM MCP (multi-chip-package) combinations allow manufacturers and developers to tailor solutions to specific market segments. Our , Spansion Product Selector Guide ® Embedded and Mobile Applications Portfolio March 2011 , Machine-to-Machine Spansion offers a wide range of NOR Flash memory solutions in multiple voltages, densities and packages expressly designed and optimized for embedded and mobile applications, including: . Networking Spansion
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S25FL129 S98GL064 S98GL064NB0 S70FL256 S98GL064NB s71vs128 S71PL127NB0 S71PL127NC0 1-866-SPANSION 43715B
Abstract: and Flash + DRAM MCP (multi-chip-package) combinations allow manufacturers and developers to tailor , Flash + pSRAM MCP 133-BALLS For Flash + DRAM MCP Spansion® Product Selector Guide Embedded and , ® Product Selector Guide Embedded and Mobile Applications Portfolio 12 1.8V Parallel ADP MCP , wide range of NOR Flash memory solutions in multiple voltages, densities and packages expressly designed and optimized for embedded and mobile applications, including: > > > > Automotive Consumer Spansion
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S25FL256 S25FL512 S25FL256* spansion S25FL204 s25fl128s S25FL032K S71GL032NA0 43715C
Abstract: solution in the form of MCP, by offering a wide range of products including SRAM, UtRAM, NAND, and DRAM , â  For Code & Data Storage â  Mobile, Consumer and Network Application with Discrete or MCP L NAND , products such as digital still camera, Handsets, MP3 players and USB Rash drives, etc. Leading NAND Flash , 's Gigabyte NAND Flash memory which can make your product much slimmer, smaller, and spectacular. > Doubling , hold the stored data even when the power is out. It also allows random data access, and provides fast -
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K9HCG08U5M K9WBG08U1M K9LAG08U0M-PCB0 KMAFN0000M KMBGN0000A K9MDG08U5M-PCB0 120GB 128MB 256MB 512MB 256MC99
Abstract: 's stacked Multi-Chip Package (MCP) sets the industry pace for the growing wireless market and are designed , automotive market offers the opportunity for steady, stable growth, and we will build on our successful history in this sector. Fujitsu began marketing 4- and 8-bit microcontrollers to the automotive market 20 years ago in Japan. By the early 1990s, we had moved into the European market and, for the past , sensors Expanding to other segments of the wireless market, Fujitsu launched a Bluetooth solution and Fujitsu
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fujitsu LVDS vga wireless video camera construction smart traffic light control by laser MB86S02A wiring pcb camera ccd cell phone camera module MB90F372 MB90372 MB86293 CORP-NL-20908-10/2002
Abstract: . The MCP gluelessly interfaces to the Philips UCB1200*, which provides support for both audio and , high-performance computing to embedded applications but at consumer electronics pricing with MIPS-per-dollar and , with a large instruction and data cache, memory-management unit (MMU), and read/write buffers running , communication channels, a color/gray scale LCD controller, PCMCIA support for up to two sockets, and , and little endian operating modes s Write buffer - 8-entry, between 1 and 16 bytes each s Intel
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intel processor transistor count arm microprocessor data sheet circuit diagram of voice recognition StrongARM SA-1100 3.686 MHZ uart General Instrument
Abstract: NAND â'"â'" Hardware automation on command fetch and status return â'¢â'¢ Optimized design for MCP , Marvell 88NV1140/88NV1120 Small-Form Factor and Value-Line SSD Controller PRODUCT OVERVIEW The , 6Gb/s SATA interface for small-form factor and value-line SSD markets. While NAND Flash cost is , instrumental in quickly driving SSD adoption in client PC market. In addition to enabling value-line SSD, the , process node technology, the new controller is perfect for multiple-chip-package (MCP) integration running MARVELL
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128GB 88NV1140 88NV1120
Abstract: . The MCP gluelessly interfaces to the Philips UCB1200*, which provides support for both audio and , high-performance computing to embedded applications but at consumer electronics pricing with MIPS-per-dollar and , with a large instruction and data cache, memory-management unit (MMU), and read/write buffers running , communication channels, a color/gray scale LCD controller, PCMCIA support for up to two sockets, and , and little endian operating modes s Write buffer - 8-entry, between 1 and 16 bytes each s Intel
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Abstract: x16 70/13.5ns FBGA/MCP Now *Depends on market 1.8V Flash ­ Product Guideline CFI , memory products, which has resulted in a segmentation of the DRAM market, based on applications and , FCRAMTM ­ Fast Cycle Ram MCP ­ Multi-Chip Packages Packaging Technology information and , effective versus SRAM high density SRAM (16, 32 and 64Mb) ASM solutions in combination with Fujitsu's MCP , reducing the time and costs of development and design work. Fujitsu is currently developing MCP devices Fujitsu
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29LV160TE 29lv800ta Micron 512MB NOR FLASH 29F800TA 29F033C 29f400tc D-63303 F-94035 D-85737 I-20080
Abstract: card specifications and market SD products. SD CardTM Part Number Status *1 Comments , access memory), and Flash, Toshiba probably has a solution that can meet your requirements. The memory , memory for low power or space constrained applications, and high performance DRAM for high speed requirements. File Memory (Data Storage) CompactFlash FLASH NAND SD Mobile Memory (Handheld and , . Typically used in mass storage applications such as memory cards, USB drives, and solid-state storage Toshiba
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TC58DVM72A1FTI0 tsop-56 samsung TSOP1-48 THNCF1G02DG THNCF1G02DGI tc58fvm5t2atg TC58DVM72A1FT00 TC58DVM82A1FT00 TC58DVM82A1FTI0 TC58DVM92A1FT00 TC58DVM92A1FTI0
Abstract: ··AMBA bus architecture 2 TM Networking Cores ··High-speed serial interfaces and SerDes cores , Ethernet, FibreChannel, Serial-ATA, sRIO ··SPI 4.2, POS L3 ··10/100 M Ethernet MAC and PHY ··10/100/1000 , LINK layer and PHY ··USB1.1, USB2.0 ··JPEG ··MPEG Technology Specific Cores ··A/D converter, D/A , ··Very low-cost technology ­ ideally suited for cost-saving FPGA replacements ··Simple and fast design , Microcontrollers ··High performances and High flexibility ··Very simple and fast development ··Low unit price NEC
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ARM946E-STM ARM926EJ-STM ARM946E-S ARM1136J ARM1156T2 ARM11 MIPS 24KC CMOS-N5 CMOS-10HD Ethernet-MAC ic V850E ARM966E-STM
Abstract: ··AMBA bus architecture ··High-speed serial interfaces and SerDes cores ··From 120 Mbps up to 6.4 , , Serial-ATA, sRIO ··SPI 4.2, POS L3 ··10/100 M Ethernet MAC and PHY ··10/100/1000 M Ethernet MAC ··8B/10B coder/decoder ··UTOPIA interface ··CAN 2 TM Multimedia Cores ··IEEE1394-a LINK layer and , low-cost technology ­ ideally suited for cost-saving FPGA replacements ··Simple and fast design flow , Microcontrollers ··High performances and High flexibility ··Very simple and fast development ··Low unit Renesas Electronics
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ARM966E-S ARM11 hs spi CMOS-9HD DDR PHY ASIC Ethernet-MAC MIPS Technologies V30MZ 1G/10G IEEE1394- CMOS-12M ARM946EJ-S
Abstract: . The MCP gluelessly interfaces to the Philips UCB1200*, which provides support for both audio and , and data cache, memory-management unit (MMU), and read/write buffers. In addition, the SA , , PCMCIA support for up to two sockets, and generalpurpose I/O ports. s s High performance -150 , Write buffer -8-entry, between 1 and 16 bytes each s Big and little endian operating modes s , to ROM, Flash, SRAM, and DRAM -Supports two PCMCIA sockets Power dissipation, particularly Intel
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278087 touchpad SA1100 multi protocol serial controller DE-S1100AA UCB1200 modem
Abstract: mobile phones, Portable Navigation Devices and other general applications. To provide optimized H/W , and includes many powerful hardware accelerators for tasks such as motion video processing, display control and scaling. An integrated Multi Format Codec (MFC) supports encoding and decoding of MPEG4/H.263, H.264 and decoding of VC1. This H/W Encoder/Decoder supports real-time video conferencing and TV out for NTSC and PAL mode. In addition, the S3C6410 Includes an advanced 9M triangles/ sec 3D Samsung Electronics
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S3C6410X01 S3C6410X5A S3C6410X5D s3c6410x s3c6410 external interrupt s3c6410 arm1176JZF datasheet s3c6410 datasheet samsung S3C6410 Samsung S3C6410 ARM 533MH 667MH 800MH
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