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"eMMC" Thermal Impedance

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: .48 Thermal Management Signals , 104 6 Thermal Management . 106 6.1 On-Die Digital Thermal Sensor (DTS) . 106 6.1.1 Reading the Digital Thermal Sensor. 106 6.2 Intel® Thermal Monitor Intel
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finder type 81.11 emmc 4.41 firmware operation Z2760 2002/95/EC
Abstract: OMAP4430 omap543x K30 y-249 TWL6041 OMAP5432 Public Version OMAP5430 SWPS052F ­ MAY 2013 www.ti.com 5.7 5.8 6 Thermal Management 6.1 , . IN Package Thermal Characteristics , . Series Model Impedance Equation . Typical Impedance Profile of a Capacitor Texas Instruments
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3E991 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 EAR99 ISO/TS16949
Abstract: SAMSUNG DDR4 . . . . . . . . . 30 4.4. Output Buffer Impedance Characteristics . . . . . . 38 4.5. I/O AC , required. This resistor should be connected through a short (low impedance connection) and placed away from Freescale Semiconductor
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samsung eMMC 4.5 Samsung eMMC 4.41 lpddr2 emmc emmc 4.5 spec 153 ball eMMC memory emmc 4.41 spec IMX50CEC MCIMX50 MX508
Abstract: . . . . . . . . . . 31 4.4. Output Buffer Impedance Characteristics . . . . . . 37 4.5. I/O AC , resistor should be connected through a short (low impedance connection) and placed away from other noisy Freescale Semiconductor
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Abstract: Parameters . . . . . . . . . . . . . . . . . . . . . . . . 30 4.4. Output Buffer Impedance Characteristics . , resistor should be connected through a short (low impedance connection) and placed away from other noisy Freescale Semiconductor
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Abstract: . . . . . . . . . . 30 4.4. Output Buffer Impedance Characteristics . . . . . . 36 4.5. I/O AC , resistor should be connected through a short (low impedance connection) and placed away from other noisy Freescale Semiconductor
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Abstract: . . . . . . . . . 30 4.4. Output Buffer Impedance Characteristics . . . . . . 36 4.5. I/O AC , required. This resistor should be connected through a short (low impedance connection) and placed away from Freescale Semiconductor
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eMMC 4.51 Samsung eMMC 4.51 eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec
Abstract: Impedance Characteristics . . . . . . 36 4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . , required. This resistor should be connected through a short (low impedance connection) and placed away from Freescale Semiconductor
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emmc 4.4 standard jedec 50 50 mfd CAPACITOR USB_OTG SAMSUNG emmc samsung eMMC 5.1 eMMC 4.4
Abstract: Parameters . . . . . . . . . . . . . . . . . . . . . . . . 30 4.4. Output Buffer Impedance Characteristics . , resistor should be connected through a short (low impedance connection) and placed away from other noisy Freescale Semiconductor
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Abstract: . I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 30 4.4. Output Buffer Impedance , resistor should be connected through a short (low impedance connection) and placed away from other noisy Freescale Semiconductor
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Abstract: sandisk sdhc sandisk micro sdhc i.MX23 includes a low noise headphone driver that allows the i.MX23 to directly drive the low impedance Texas Instruments
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SPRUH87 TMS320C5535 sandisk emmc 4.5 sandisk eMMC 4.41 emmc controller sandisk emmc circuit diagram sandisk 64 mb hitachi eMMC TMS320C5535/34/33/32
Abstract: THERMAL SIMULATIONS Typical Airflow 14 Elma has performed extensive thermal simulation studies to , AdvancedMC module can be incorporated in the thermal simulation to verify and optimize your specific , embraces extensive use of thermal simulations that helps to perfect the design and reduce time to market. Our Validation Lab includes thermal, environmental, and EMC chambers and a wind tunnel to verify the Freescale Semiconductor
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toshiba emmc 4.4 micron emmc micron emmc 4.4 toshiba emmc micron emmc 4.3 micron eMMC 100 ball BGA AN4198 ARM926EJ-STM ARM926EJ-S ARM11
Abstract: Public Version OMAP5432 www.ti.com SWPS051E ­ MAY 2013 5.7 5.8 6 Thermal Management 6.1 6.2 , . 118 AR Package Thermal Characteristics , . Thermal Resistance Characteristics , the interfaces (Section 5) · The thermal management recommendations including the thermal resistance , not defined by ball multiplexing, this pad is actually set undriven (high impedance: Z) with potential Elma Electronic
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D-75179 F-38460 RO-011048
Abstract: . Two speakers with 8 impedance rating and 1W power rating are attached through a power amplifier Texas Instruments
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MIPI csi-2 spec toshiba emmc 4.4 spec toshiba 16GB Nand flash emmc 4GB eMMC toshiba ABE 814 mipi DSI LCD controller
Abstract: 5.5 Thermal Characteristics . 61 1.1 Features , system clock generator. ROC I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = , impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder Input pins of type I, I/O , = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder Input pins , impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder Input pins of type I, I/O Freescale Semiconductor
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OV5642 sony IMX 322 cmos DA9053 Atheros AR6003 SII9022 ov5642 omnivision MCIMX53SMD IMX53SMDHUG CH370 RDIMX53SABRETAB
Abstract: Table of Contents Device Overview . 1 5.5 Thermal , system clock generator. ROC I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = , impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder Input pins of type I, I/O , = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder Input pins , impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder Input pins of type I, I/O Texas Instruments
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TMS320C5517 SPRS727C TMS320C55 200-MH 320KB 256KB
Abstract: 5.5 Thermal Characteristics . 61 1.1 Features , system clock generator. ROC I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = , impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder Input pins of type I, I/O , = High impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder Input pins , impedance, S = Supply voltage, GND = Ground, A = Analog signal, BH = Bus Holder Input pins of type I, I/O Texas Instruments
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SPRS727B 225-MH 128KB
Abstract: . Other factors are CPU latency requirements, thermal restrictions, peripheral I/O performance , measured. The temperature measurements were taken using the on-chip thermal sensor, on a thermally , measurement error. For more details on thermal aspects, see the application note AN4579, Thermal Management , the power consumption of the DDR interface pins. â'" Use proper output driver impedance for DDR interface pins which provides good impedance matching. Select the lowest possible drive strength, which Texas Instruments
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Abstract: range of impedance support, e.g 200-400 Ohm and 50K Ohm) Temperature Example · · · · · · , Controller with Touchscreen Temperature sensor for thermal protection Multiple connectivity ports (UARTs , 12-bit ADC x 8 16K I Cache 2Msps ADC x 1 Thermal Protection Power Management DC/DC - Freescale Semiconductor
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AN4509
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