500 MILLION PARTS FROM 12000 MANUFACTURERS

Datasheet Archive - Datasheet Search Engine

 

"dry bake"

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: detailed instructions for dry bake. This information provides ON Semiconductor customers with the , http://onsemi.com 2 AND8003/D AND8003/D Table 3. Bake Conditions for SMD Packages prior to Dry Pack after , life. This can be accomplished by dry packing or storing in a dry cabinet maintained at 5% RH. Bake , moisture sensitive and delivers in a dry pack. Moisture sensitive devices include, but are not limited to , LIMITS OUT OF DRY PACK The MSL at which each SMD is classified determines the appropriate packaging ... ON Semiconductor
Original
datasheet

4 pages,
102.44 Kb

A113 floor life reset J-STD-020D J-STD-033b.1 JEDEC J-STD-020d JESD22-A113 J-STD-020d.1 JESD625 AND8003/D APPLICATION note jedec JESD625-a JEDEC J-STD-033b.1 AND8003 12MSB17722C AND8003/D JESD625-a AND8003/D JEDEC J-STD-020d.1 AND8003/D AND8003/D AND8003/D TEXT
datasheet frame
Abstract: REQUIRE BAKE AND DRY PACK WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 2 REQUIRE DRY PACK ONLY WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 1 REQUIRE NO BAKE , TEMP BAKE TIME DRY PACK/ NOTES +125C N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A , REQUIRE BAKE AND DRY PACK WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 2 REQUIRE DRY PACK ONLY WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 1 REQUIRE NO BAKE ... Micrel Semiconductor
Original
datasheet

9 pages,
67.13 Kb

TEXT
datasheet frame
Abstract: SMD PACKAGES HOW TO USE THIS TABLE: PRODUCT AND PACKAGES CLASSIFIED LEVEL 2A-6 REQUIRE BAKE AND DRY , APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 1 REQUIRE NO BAKE AND NO DRY PACK PACKAGE , : PRODUCT AND PACKAGES CLASSIFIED LEVEL 2A-6 REQUIRE BAKE AND DRY PACK WITH APPROPRIATE WARNING LABEL , PACKAGES CLASSIFIED LEVEL 1 REQUIRE NO BAKE AND NO DRY PACK PACKAGE TYPE SOICW PRODUCT ALL , 5.0 2000-0012, DRY PACK PROCEDURE FOR MOISTURE SENSITIVE DEVICES EQUIPMENTS AND SUPPLIES N/A ... Micrel Semiconductor
Original
datasheet

5 pages,
34.19 Kb

SOT23 2A6 LGA 16L 44L-84L 20L-28L TEXT
datasheet frame
Abstract: have occurred to indicate excess moisture exposure. Table 4-2 gives conditions for bake prior to dry , ) . 3 DRY PACKING . 3 3.1 3.2 , . Drying Requirements - Other . Excess Time Between Bake and Bag. Dry Pack . Description , . 9 Dry Pack. 9 Dry Atmosphere ... Silicon Standard
Original
datasheet

20 pages,
117.63 Kb

J-STD-033A J-STD-033 TEXT
datasheet frame
Abstract: Reflow Package Moisture Sensitivity Levels per J-STD-020 J-STD-020 Factory Floor Life Dry Bake Recommendation and Dry Bag Policy Handling Parts in Sealed Bags Moisture Induced Cracking During Solder Reflow The , floor level. Dry Bake Recommendation and Dry Bag Policy Xilinx recommends, as do the mentioned , =Default value of semiconductor manufacturer's time between bake and bag. If the semiconductor manufacturer's actual time between bake and bag is different from the default value, use the actual time. 2. Y = Floor ... Xilinx
Original
datasheet

3 pages,
44.97 Kb

ipc-sm-786A Q1-02 TEXT
datasheet frame
Abstract: PACKAGES CLASSIFIED LEVEL 2A-6 REQUIRE BAKE AND DRY PACK WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 2 REQUIRE DRY PACK ONLY WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 1 REQUIRE NO BAKE AND NO DRY PACK PACKAGE TYPE BGA/PBGA/LFBGA CHIP SCALE (WLP , CLASSIFIED LEVEL 2A-6 REQUIRE BAKE AND DRY PACK WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES , LEVEL 1 REQUIRE NO BAKE AND NO DRY PACK PACKAGE TYPE PRODUCT LEAD COUNT PACKAGE THICKNESS ... Micrel Semiconductor
Original
datasheet

2 pages,
23.33 Kb

MLF33 -34mm 44L-84L 20L-28L SOT23 2A6 TEXT
datasheet frame
Abstract: Moisture-Sensitive Devices Handling Information Cypress Dry Bag Policy In order to insure against moisture damage, Cypress carries out dry bake and dry packing on all devices that are moisture sensitive in , Plastic Quad Flat Packs (PQFPs), and Thin Quad Flat Packs (TQFPs) be used dry in surfacemount applications. NOTE: A package is considered dry if it has been baked for 24 continuous hours at 125 ± 5°C and has , warning stated on the caution label, the sealed MBBs should be stored unopened in a relatively dry ... Cypress Semiconductor
Original
datasheet

2 pages,
45.65 Kb

TEXT
datasheet frame
Abstract: against moisture damage, Cypress carries out dry bake and dry packing on all devices that are moisture , fax id: 6001 1 Moisture-Sensitive Devices Handling Information Cypress Dry Bag Policy , higher, all Plastic Quad Flat Packs (PQFPs), and Thin Quad Flat Packs (TQFPs) be used dry in surfacemount applications. NOTE: A package is considered dry if it has been baked for 24 continuous hours at , Baked devices are then vacuum sealed and dry packed in MBBs within the 24 hour factory-floor-life limit ... Cypress Semiconductor
Original
datasheet

2 pages,
34.4 Kb

TEXT
datasheet frame
Abstract: , 150°C P High Accelerated Saturation Test (HAST) 130°C, 85% RH, 5.5V Precondition: Dry bake , : Dry bake + 72 Hrs 30°C/60%RH P Temperature Cycle MIL-STD-883C MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: Dry Bake, 3 Cys Solder Relfow P Temperature Cycle JEDEC22 JEDEC22 CONDITION B, -40°C to 125°C Precondition: Dry Bake, 3 Cys Solder Reflow P Pressure Cooker Test 121 , -STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRECONDITION DRY BAKE + 3 CYS SOLDER REFLOW ... Cypress Semiconductor
Original
datasheet

7 pages,
46.86 Kb

CY7C016 CY7C024 CY7C0241 CY7C025 CY7C0251 CY7C133 CY7C138 CY7C139 CY7C143 CY7C144 CY7C145 EME 7320 EME-7320 dual port 16 SRAM PLCC CY7C025-AC hitachi 8144 PIX 8144 Pix-8144 Hitachi PIX 8144 Hitachi PIX-8144 TEXT
datasheet frame
Abstract: Handling Requirements All surface mount products which do not meet Level 1 moisture sensitivity requirements are processed through dry bake and pack procedure. The necessary data is recorded on the caution , at , conditions , high temperature or shorter bake times are desired, reference IPC/JEDEC-J-STD-033 IPC/JEDEC-J-STD-033 for bake procedure ... Peregrine Semiconductor
Original
datasheet

1 pages,
22.71 Kb

JEDECJ-STD-033 JEDEC-J-STD-033 "dry bake" JEDEC-J-STD-020 JEDEC J-STD-033 TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
Shipping Media PPGA Tray 50 units per box 10 units per tray No dry bake is
/datasheets/files/intel/products one/design/quality/celeron/ppga/hints.htm
Intel 30/04/1999 10.5 Kb HTM hints.htm
Shipping Media PPGA Tray 50 units per box 10 units per tray No dry bake is
/datasheets/files/intel/design/quality/celeron/ppga/hints.htm
Intel 01/02/1999 10.5 Kb HTM hints.htm
handling flow. Figure 9. Dry Pack Flow Chart VR02104H VR02104H DRY PACK DESSICANT HUMIDITY MARKING DRY BAKE TESTING Hours ? PRODUCT TO PINK ? BAKE 125yC / 24 h YES NO NO YES SGS-THOMSON CUSTOMER 30 5C HUMIDITY 60% maximum VR02104I VR02104I Moisture Gain (Weight %) TIME 85yC / 85% RH DRY BAKE (125 yC 0.75 1 OK PROBLEM GLUABILITY (kg / mm2) 9/12 DRY PACKING 5 DRY PACKING Quality and reliability of SMDs amount of ab- sorbed humidity. Moisture sensitive Surface Mount Devices (SOP, PLCC, PQFP) are dry packed
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5037-v1.htm
STMicroelectronics 20/10/2000 15.47 Kb HTM 5037-v1.htm
handling flow. Figure 9. Dry Pack Flow Chart VR02104H VR02104H DRY PACK DESSICANT HUMIDITY MARKING DRY BAKE VR02104I VR02104I Moisture Gain (Weight %) TIME 85yC / 85% RH DRY BAKE (125 yC) 0.05 24 h DRY PACKING 12 DRY PACKING 5 DRY PACKING Quality and reliability of SMDs after soldering depends heavily on Moisture sensitive Surface Mount Devices (SOP, PLCC, PQFP) are dry packed to protect them from moisture molding compound characteristics. Figure 8. Dry Pack according to SMD Package SMD products are contained
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5037-v3.htm
STMicroelectronics 25/05/2000 14.95 Kb HTM 5037-v3.htm
handling flow. Figure 9. Dry Pack Flow Chart VR02104H VR02104H DRY PACK DESSICANT HUMIDITY MARKING DRY BAKE TESTING Hours ? PRODUCT TO PINK ? BAKE 125yC / 24 h YES NO NO YES SGS-THOMSON CUSTOMER 30 5C HUMIDITY 60% maximum VR02104I VR02104I Moisture Gain (Weight %) TIME 85yC / 85% RH DRY BAKE (125 yC 0.75 1 OK PROBLEM GLUABILITY (kg / mm2) 9/12 DRY PACKING 5 DRY PACKING Quality and reliability of SMDs amount of ab- sorbed humidity. Moisture sensitive Surface Mount Devices (SOP, PLCC, PQFP) are dry packed
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5037-v4.htm
STMicroelectronics 16/01/2001 15.33 Kb HTM 5037-v4.htm
DRY PACK DESSICANT HUMIDITY MARKING DRY BAKE TESTING SEALING CONTROL INDICATOR VACUUM STORAGE / mm2) 9/12 DRY PACKING 5 DRY PACKING Quality and reliability of SMDs after soldering depends heavily on sensitive Surface Mount Devices (SOP, PLCC, PQFP) are dry packed to protect them from moisture absorption characteristics. Figure 8. Dry Pack according to SMD Package SMD products are contained in tubes , on trays or on tape , and are then vacuum sealed in an hermetic bag. VR02104G VR02104G PQFP SOP PLCC PQFP SOP PLCC DRY PACK DRY
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5037-v2.htm
STMicroelectronics 14/06/1999 13.14 Kb HTM 5037-v2.htm
handling flow. Figure 9. Dry Pack Flow Chart VR02104H VR02104H DRY PACK DESSICANT HUMIDITY MARKING DRY BAKE TESTING 0.75 1 OK PROBLEM GLUABILITY (kg / mm2) 9/12 DRY PACKING 5 DRY PACKING Quality and reliability of SMDs amount of ab- sorbed humidity. Moisture sensitive Surface Mount Devices (SOP, PLCC, PQFP) are dry packed , package structure and molding compound characteristics. Figure 8. Dry Pack according to SMD Package SMD VR02104G VR02104G PQFP SOP PLCC PQFP SOP PLCC DRY PACK DRY PACKING 10/12 Opening the package will stop the ideal
/datasheets/files/stmicroelectronics/stonline/books/ascii/an/5037.htm
STMicroelectronics 17/09/1999 15.06 Kb HTM 5037.htm
DRY PACK DESSICANT HUMIDITY MARKING DRY BAKE TESTING SEALING CONTROL INDICATOR VACUUM STORAGE / mm2) 9/12 DRY PACKING 5 DRY PACKING Quality and reliability of SMDs after soldering depends heavily on sensitive Surface Mount Devices (SOP, PLCC, PQFP) are dry packed to protect them from moisture absorption characteristics. Figure 8. Dry Pack according to SMD Package SMD products are contained in tubes , on trays or on tape , and are then vacuum sealed in an hermetic bag. VR02104G VR02104G PQFP SOP PLCC PQFP SOP PLCC DRY PACK DRY
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/5037.htm
STMicroelectronics 02/04/1999 13.18 Kb HTM 5037.htm
No abstract text available
/download/90212243-999460ZC/dbookold.zip ()
Xilinx 07/09/1996 10340.01 Kb ZIP dbookold.zip