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Part Manufacturer Description PDF & SAMPLES
CS181002-CQZ Cirrus Logic 32-bit Microprocessor IC; Package/Case:144-LQFP; Leaded Process Compatible:No; MIPS:120; Peak Reflow Compatible (260 C):No
CS181022-CQZ Cirrus Logic 32-bit Microprocessor IC; Package/Case:144-LQFP; Leaded Process Compatible:No; MIPS:120; Peak Reflow Compatible (260 C):No
CS181012-CQZ Cirrus Logic 32-bit Microprocessor IC; Package/Case:144-LQFP; Leaded Process Compatible:No; MIPS:120; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
CS496112-CQZ Cirrus Logic 32-Bit AUDIO DSP IC; Package/Case:144-LQFP; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
CS496122-CQZ Cirrus Logic 32-Bit AUDIO DSP IC; Package/Case:144-LQFP; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
CS496102-CQZ Cirrus Logic 32-Bit AUDIO DSP IC; Package/Case:144-LQFP; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No

"device package guide"

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Pin-out Cross-reference Table 5 HT-2CWriter User¢s Guide Programming a 2-Chip-1-Package Device , if the 2-Chip-1-Package device is locked already. 12 HT-2CWriter User¢s Guide Figure 14 , .5 Programming a 2-Chip-1-Package Device with the HT-MWriter .6 Prepare the OTP & MEM File Before Programming the 2-Chip-1-Package Device.6 Running the HT-MWriter Software Utility , into the HT-2CWriter. The HT-2CWriter writes both program code and data to 2-Chip-1-Package MCU device Holtek
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40 pin TEXTOOL CADPDIP40B DIP18 HT-IDE3000 ht45r04 HT46R46E
Abstract: . * 7 [+] Feedback Reference Design Package Contents 2.2 Device Functionality After the PCB , Reference Design Guide, Doc. No. 001-54438 Rev. * 9 [+] Feedback Reference Design Package , Package Contents When the installation is complete, the new device appears in the Device Manager , Astoria DMB-T/H Storage TV Dongle Reference Design Guide Document No. 001-54438 Rev , Storage TV Dongle Reference Design Guide, Doc. No. 001-54438 Rev. * [+] Feedback Contents 1 Cypress Semiconductor
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usb media Player circuit 8G75 eeprom schematic for tv tv tuner for laptop Dmb-th HDTV antenna
Abstract: the update package for the automatic firmware upgrade feature (see firmware user's guide). 3. Copy , . User Guide Section 1 Introduction , .1-1 Section 2 Package Download , .2-3 Package Content .2-4 , . 3-5 3.1 3.2 3.3 3.4 AT85DVK-07 Getting Started User Guide Requirement Atmel
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atmel 246 ATMEL 342 AT85C51SND3B AT85C51SND3Bx atmel 8051 application notes Atmel flip
Abstract: " "Intel packaging reference guide" "Small Outline Package Guide" "Sampling procedures and tables for , package (and leads). 5.4 Programmer-to-Tray Transfer Using Precision Vacuum Wand (wand with guide , McMaster 1966T3 SOP Pkg. guide Intel Pkg. guide Intel's specific SOP package guide Intel's general package guide­ all of Intel's packages (SOP included) Intel Corp. Intel Corp. 296514 , drop-off: (Figures 1 and 2) Device pick-up from tray: 1. Lower wand into tray pocket, ensure guide pins Intel
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IPC-J-STD-001 6n1 tube TRAY DAEWON TSOP IPC-JSTD-001 VHH10-6N1 DAEWON tray TSOP
Abstract: .11 DEVICE SUPPORT .12 8051 SUPPORT PRODUCTS GUIDE .14 AVR SUPPORT PRODUCTS GUIDE , ) with the contents of the currently selected device. 8 Micro-Pro User Guide V1.04 Software , Micro-Pro User Guide V1.04 Device Selection It is necessary to select the particular device to be , the current device AT89C1051 AT89C2051 AT89S8252 AT89S553 AT89LS8252 Micro-Pro User Guide , User Guide V1.04 Device Support 89C Microcontroller 89C Microcontroller 89C Microcontroller 89C Equinox Technologies
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Atmel 89C51 microcontroller Microcontroller - AT89C2051 pin diagram 8051 microcontroller free atmel 89C51 user manual microcontroller 89c51 pin diagram introduction to microcontroller 89C51 C51TM ASM-51 PL/M-51 B-AVR-981 CAB-PAR25MM AD-PLCC44-A
Abstract: and electronic assemblies" "Intel packaging reference guide" "Small Outline Package Guide , . Using Non-Precision Vacuum Wand 5.3.3 When removing package from tray, carefully raise device in , Intel Pkg. guide Intel's specific SOP package guide Intel's general package guide­ all of Intel , still depressed). Device pick-up from socket: 1. Lower wand into socket, ensure guide pins are aligned to guide holes. 2. Depress and slowly release valve stem button to pick device up into wand. 3 Intel
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DAEWON tray tsop 48LD nikon v12B nikon TRAY TSOP 56LD GRAINGER daewon
Abstract: Guide Ordering codes and included components Ordering code MCU package Includes Emulator , to your application board 3.1 ST7MDT25-DVP3 Probe User Guide TQFP64 (14 x 14) package This , Guide TQFP44 (10 x 10) package This procedure tells you how to connect the ST7MDT25-DVP3 to your , Guide TQFP32 (7 x 7) package This procedure tells you how to connect the ST7MDT25-DVP3 to your , User Guide 3 - Connecting to your application board TQFP32 Device Adapter TQFP32 Adapter STMicroelectronics
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IC149-064-075-B5 PA418 ST72561 TQFP64 socket DOC-MDT0017 89/336/EEC EN55022
Abstract: steps. This installation guide covers installation of the Windows demo application, device driver and , board and the software. Installation Guide The Lattice PCI Express demo package is released as a , Evaluation Board in PCI Express slot 3. Install PCI Express Device Driver 4. Run Demo Demo Package , 's Guide Lattice Semiconductor Trouble Installing the Demo Software Package The most likely issue , Lattice PCI Express Demo Installation User's Guide January 2008 UG05_01.1 Lattice PCI Lattice Semiconductor
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16 SEGMENT DISPLAY 7-segment led x4 16-segment led display J102 J105 2000/XP/S 100MH
Abstract: Guide Ordering code Delivery checklist MCU package Contents Adapter kits ST7MDT10 , when your target ST7 microcontroller is in a DIP16 package, using the DIP16/SO16 device adapter. 1 , your application board 3.2 ST7MDT10-DVP3 Probe User Guide SO16 package This procedure tells , Connecting to your application board 3.3 ST7MDT10-DVP3 Probe User Guide DIP20 package This , your application board 3.5 ST7MDT10-DVP3 Probe User Guide SDIP32 package This procedure tells STMicroelectronics
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he10 connector 20 pins SO16 footprint st7lite and cable ST7Flite SO20 SO16 package DOC-ST7MDT10-DVP3
Abstract: . Low level device driver layer code for OneNANDTM is provided with RFS package and is tested on , NAND flash memory as a device driver. 3 Linux RFS v1.3.0 Porting Guide 2 Prerequisites This , .3.0 Porting Guide fs ­ RFS file system module drivers - XSR block device driver module tools - Utilities , device driver. The detailed usage of this program is described in Ftools Utility Guide document , device on your target, please refer to ftools utility guide. 3.3 Using the NLS (Native Language Samsung Electronics
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samsung rfs BML STL samsung xsr omap2420 Sector Translation Layer SAMSUNG NAND FLASH TRANSLATION LAYER
Abstract: Guide ffrom w ebsitej UV/OV Device Protection dumber Circuit Breaker Sense Resistor Auto Retry Type , ) New Products Catalog, V.1 - p. 248 L E D Driver ICs Selector Guide ¡from website] +V|N Device , complete Package Options. High Voltage Telecommunication Ring Generator ICs Selector Guide Ifrom , Guide I from websitej Device Number HV20220 HV20320 HV20720 HV20822 HV209 HV214 HV232 Output Channels , - I\l-ChanneI Selector Guide ¡from websitej VGS(off) Device Number BVdsx Rd S(ON) Min Max Min V Max -
OCR Scan
VP0808 pj 72 diode pj 44 diode 9v 200 ohm relay ic 7pin dip PWM Converter pj 89 diode TP0606 TP0610 TP0620 TP2104 TP2424 TP2435
Abstract: Device Package User Guide [Guide Subtitle] [optional] UG112 (v3.5) November 6, 2009 [optional , property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3 , .5) November 6, 2009 www.xilinx.com Device Package User Guide Date Version Revision 03/17/09 , . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Device Package User Guide UG112 (v3 , . . . . . . . . . . 77 6 www.xilinx.com Device Package User Guide UG112 (v3.5) November 6 Xilinx
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qfn 3x3 tray dimension XCDAISY XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 jedec so8 Wire bond gap XC3S400AN-4FG400I UG072 UG075 XAPP427
Abstract: User Guide Ordering code 2 - Delivery checklist MCU package Contents (b) 1 additional 50 , Probe User Guide 4 From the adapter, remove the SDIP connector for the package you are not using , User Guide TQFP64 (14 x 14) package To connect the ST7MDT20-DVP3 to your application board when , Connecting to your application board 3.5 ST7MDT20-DVP3 Probe User Guide TQFP44 (10 x 10) package To , ST7MDT20-DVP3 Probe User Guide 3.6 3 - Connecting to your application board TQFP32 (7 x 7) package To STMicroelectronics
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TQFP80 DB545 yamaichi TQFP32 J1 HE10 TQFP80/64 TQFP44 package DOC-ST7MDT20-DVP3
Abstract: Selection Guide" section of this application note. A USB hub is a repeating device that allows multiple , right for your application, see the "Cypress USB Hub Device Selection Guide" section of this , Peripheral Device Selection Guide" section of this application note. For full-speed signaling, the payload , the "Cypress Full-Speed USB Peripheral Device Selection Guide" section of this application note , Figure 1 Device Selection Decision Tree Cypress USB Embedded Host/OTG Selection Guide For host Cypress Semiconductor
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AN1222 SL811HST CY7C65642 CY7C68013A cypress fx3 EZ-USB SX2 I2C
Abstract: INTRODUCTION This blank Printed Circuit Board allows any 14-pin device in the following four package types to , 's Guide TABLE 2-1: OPTIONAL PASSIVE COMPONENTS Device C2 Comment Power supply bypass capacitor , PCB PADs For each package pin (pins 1 to 14), there is a PCB pad (pads 1 to 14). The device will , convert the footprint of the device to that of a DIP package. This allows the device to be installed into , device is installed into the appropriate package footprint. This allows the PCB to convert the SOIC Microchip Technology
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DIP14 footprint SOIC-14 r2e sot 23 PIC16F676 programmer schematic PG164101 MOSFET R3D DS51597A DS51597A-
Abstract: Reference Design Guide, Doc. No. 001-54437 Rev. * [+] Feedback 2. Reference Design Package Contents , DMB-T/H TV Dongle Reference Design Guide, Doc. No. 001-54437 Rev. * [+] Feedback 2.3 Device , FX2LP DMB-T/H TV Dongle Reference Design Guide Doc. No. 001-54437 Rev. * Cypress , Dongle Reference Design Guide, Doc. No. 001-54437 Rev. * [+] Feedback Contents 1 , . 5 1.1 2. Reference Design Package Contents Cypress Semiconductor
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LGS-8GL5 FX2Lp dongle legend tv block diagram of media player schematic eeprom for tv
Abstract: Device Package User Guide [Guide Subtitle] [optional] UG112 (v3.2) March 17, 2009 [optional , property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3.2) March , . UG112 (v3.2) March 17, 2009 www.xilinx.com Device Package User Guide Date Version 12/18 , . Updated links in Table A-1, page 119. Device Package User Guide www.xilinx.com UG112 (v3.2) March , . . 38 Device Package User Guide UG112 (v3.2) March 17, 2009 www.xilinx.com 5 R Xilinx
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xilinx part marking xilinx topside marking HQG160 FGG484 reballing top marking 957 so8
Abstract: for device/package combinations and maximum I/Os, pin definitions, pinout tables, pinout diagrams , capacitors because highfrequency ceramic capacitors are already present inside the device package (mounted on , number of I/O banks in the device. Table 2-2: Package Required PCB Capacitor Quantities per Device , Package and on the PCB Table 2-2: Package Required PCB Capacitor Quantities per Device: LXT Devices , number of I/O banks in the device. Table 2-3: Package Required PCB Capacitor Quantities per Device Xilinx
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UG203 ff1136 FF665 ff676 signal path designer XC5vfx70t
Abstract: Intel provides thermal simulation models of the device and a thermal model user's guide to aid , Dimensions (3D View) Dual-Core Intel® Xeon® processor LV and ULV Thermal Design Guide 9 Package , and ULV Thermal Design Guide 10 August 2006 Reference Number: 311374-002 Package Information , ® processor LV and ULV Thermal Design Guide 11 Package Information Figure 5. Package Dimensions , Package Dual-Core Intel® Xeon® processor LV and ULV Thermal Design Guide 13 Package Information Intel
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PCM45F cpu socket mPGA479m heatsink ECC-00177-01-GP ECC-00178-01-GP EEP-N41CS-I1-GP
Abstract: Device Package User Guide [Guide Subtitle] [optional] UG112 (v3.6) September 22, 2010 , property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3 , .6) September 22, 2010 www.xilinx.com Device Package User Guide Date Version Revision 03/17 , . Added VO48/VOG48 in Table 6-2, page 102. Device Package User Guide www.xilinx.com UG112 (v3 , . . 36 Device Package User Guide UG112 (v3.6) September 22, 2010 www.xilinx.com 5 R Xilinx
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CF1752 smd code v36 XC2VP7 reflow profile BGA reflow guide recommended layout CSG324 SMD MARKING CODE C1G
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