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"ceramic frit"

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Abstract: robustness of the chips. Terminations for ceramic chip capacitors consist of three layers. The first layer is formed by firing a mixture of silver powder and glass frit onto the end of the capacitor. The primary purpose of the frit is to bond the silver to the ceramic. Without the frit, the termination , ceramic ca- pacitors. If one considers that the glass frit diffuses into and reacts with the ceramic , to understand and eliminate the root causes for thermal shock cracking of ceramic chip capacitors ... Original
datasheet

2 pages,
525.18 Kb

Kemet x7r kemet c chip CROSS KEMET glass frit electronics material composition of chip capacitors TEXT
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Abstract: customer needs. · Dual In-Line Packages; Frit glass sealed CERDIP (F package family) with 8-40 leads, and side-brazed ceramic (I package family) with 48-64 leads. · Flat Packages; Frit glass sealed alumina CERPAC (W package family) with 14-28 leads, and brazed leaded ceramic (Q package family) with 52 leads. · Ceramic Chip Carriers; triple laminated, metal-lidded LCC (G package family) with 20-68 terminals. · Ceramic Leaded Chip Carriers; Frit glass sealed CERQUAD (K package family) with 28-68 leads formed to a J-bend. · ... OCR Scan
datasheet

1 pages,
23.28 Kb

TEXT
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Abstract: on Thermal Shock Chip Type Ceramic B Ceramic C 1206 0.1 uF 1825 1.0 uF Conc. of Glass Frit , CERAMIC CAPACITORS by Bharat S. Rawal Kumar Krishnamani John Maxwell AVX Corporation P.O. Box 867 Myrtle Beach, SC 29577 Abstract: With increasing use of multilayer ceramic capacitors (MLCs) in , FOR SURFACE MOUNT APPLICATIONS OF MULTILAYER CERAMIC CAPACITORS by Bharat S. Rawal Kumar , sources of defects which may arise in multilayer ceramic capacitors (MLCs) after assembly. In line ... AVX
Original
datasheet

10 pages,
261.48 Kb

Maxwell IPC-SM-782 avx CAPA TEXT
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Abstract: construction of a ceramic body component. I Provides intermediate inductance values not available in , ordering, please specify termination and testing codes: Core material Ceramic ST319RAD10NJLZ ST319RAD10NJLZ Termination: L = RoHS compliant silver-palladium-platinum glass frit. Special order: S = Tin-lead (63/37) over silver-palladium-platinum-glass frit. T = Tin-silver-copper (95.5/4/0.5) over silver-palladiumplatinum-glass frit. R = Tin over nickel over silver-platinum-glass frit. P = Tin-lead (63/37) over tin over ... Coilcraft Critical Products & Services
Original
datasheet

2 pages,
86.4 Kb

0604SMS ST319RAD TEXT
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Abstract: on Thermal Shock Chip Type Ceramic B Ceramic C 1206 0.1 uF 1825 1.0 uF Conc. of Glass Frit , CERAMIC CAPACITORS by Bharat S. Rawal Kumar Krishnamani John Maxwell AVX Corporation P.O. Box 867 Myrtle Beach, SC 29577 Abstract: With increasing use of multilayer ceramic capacitors (MLCs) in , FOR SURFACE MOUNT APPLICATIONS OF MULTILAYER CERAMIC CAPACITORS by Bharat S. Rawal Kumar , sources of defects which may arise in multilayer ceramic capacitors (MLCs) after assembly. In line ... AVX
Original
datasheet

10 pages,
282.02 Kb

profile wave soldering conductivity meter circuit CRACK PROPAGATION PATTERNS cte18 IPC-SM-782 material composition of chip capacitors PEAK 1819E PH 593 1819E AVX film chip capacitors TEXT
datasheet frame
Abstract: ) Frequency (MHz) Core material Ceramic Terminations Silver-palladium-platinum-glass frit. Other terminations , provide exceptional Q values, even at high frequencies. They have a ceramic Inductance2 (nH) 2.8 @ 3.0 @ , RoHS compliant silver-palladium-platinum glass frit. Special order: S = Tin-lead (63/37) over silver-platinum-glass frit. T = Tin-silver-copper (95.5/4/0.5) over silver-platinumglass frit. P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit. Q = Tin-silver-copper (95.5/4/0.5) over tin over ... Coilcraft Critical Products & Services
Original
datasheet

2 pages,
82.63 Kb

ST336RAA TEXT
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Abstract: hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification only on press ceramic glass frit seal only Falls within MIL-STD-1835 MIL-STD-1835 GDIP1-T20 GDIP1-T20 POST OFFICE BOX , MECHANICAL DATA MCER003A MCER003A ­ JANUARY 1997 JL (R-GDIP-T20 R-GDIP-T20) CERAMIC DUAL-IN-LINE PACKAGE 0.975 (24,76) 0.930 (23,62) 11 20 0.300 (7,62) 0.245 (6,22) 1 10 0.050 (1,27) 0.015 (0,38) 0.050 (1,27) 0.015 (0,38) Window 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN ... Texas Instruments
Original
datasheet

1 pages,
33.56 Kb

R-GDIP-T20 Package glass frit GDIP1-T20 MCER003A R-GDIP-T20 TEXT
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Abstract: package HCC 4049 UBF for dual in-line ceramic package, frit seal HCC 4049 UBK for ceramic flat package HCF 4049 UBE for dual in-line plastic package HCF 4049 UBF for dual in-line ceramic package, frit , for dual in-line ceramic package, frit seal HCC 4050 BK for ceramic flat package HCF 4050 BE for dual in-line plastic package HCF 4050 BF for dual in-line ceramic package, frit seal HCF 4050 BM for , ceramic package, ceramic flat package and plastic micropackage. The HCC/HCF 4049UB/4050B 4049UB/4050B are inverting ... OCR Scan
datasheet

6 pages,
212.38 Kb

transistor bd 911 4049 buffer 14049 cmos 4050B 4050B 4049 CMOS cmos 4050 4049 not 4049UB HCF 4049 UBE vc 4050 4049 ubm CMOS 4049 4049 bf 4049 4049 UBE 4049 CMOS Inverter TEXT
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Abstract: ) Current Derating Core material Ceramic Terminations Silver-palladium-platinum-glass frit. Other , values, even at high frequencies. They have a ceramic body and Part number1 ST336RAA020JLZ ST336RAA020JLZ , 5% Termination: L = RoHS compliant silver-palladium-platinum glass frit. Special order: S = Tin-lead (63/37) over silver-platinum-glass frit. T = Tin-silver-copper (95.5/4/0.5) over silver-platinumglass frit. P = Tin-lead (63/37) over tin over nickel over silverplatinum-glass frit. Q = ... Coilcraft Critical Products & Services
Original
datasheet

2 pages,
89.05 Kb

ST336RAA TEXT
datasheet frame
Abstract: for dual in-line ceramic package, frit seal HCC 4049 UBK for ceramic flat package HCF 4049 UBE for dual in-line plastic package HCF 4049 UBF for dual in-line ceramic package, frit seal HCF 4049 UBM , ceramic package, frit seal HCC 4050 BK for ceramic flat package HCF 4050 BE ' for dual in-line plastic package HCF 4050 BF for dual in-line ceramic package, frit seal HCF 4050. BM for plastic micropackage , monolithic integrated circuits available in 16-lead dual in-line plastic or ceramic package, ceramic flat ... OCR Scan
datasheet

7 pages,
520.58 Kb

08815 HCF 4049 UBE cmos 4050B transistor bd 911 4049UB UBF 11 4050B mos 4049 CMOS 4049 4049 bf 4049 CMOS 4049 CMOS Inverter 4049 4049 UBE CI 4049 TEXT
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Archived Files

Abstract Saved from Date Saved File Size Type Download
Ceramic Frit Seal Cerpack Package (Cerpack) Ceramic Dual-In-Line Metal Seal Packages (SBDIP) Ceramic Dual-In-Line Frit Seal Packages (CerDIP) Ceramic Pin Grid Array Packages (CPGA Packages (Can) Ceramic Frit Seal Cerpack Package (Cerpack) A14.A 14 Lead Ceramic Frit Seal Cerpack Package Ceramic Dual-In-Line Metal Seal Packages (SBDIP) D8.3 Metal Seal Package Ceramic Dual-In-Line Frit Seal Packages (CerDIP) F8.3A Mil-Std-1835
/datasheets/files/harris/families/hermetic.htm
Harris 15/08/1997 16.6 Kb HTM hermetic.htm
A14.A Harris Corporation's Home Page € Semiconductor's Home Page € Product Information € A14.A A14.A Packaging pk0000.pdf 14 Lead Ceramic Frit Seal Cerpack Package ( Adobe's pdf format - 10290 bytes) Here's where you can find out how to get your free copy of Adobe's acrobat reader . All Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 quality systems
/datasheets/files/harris/data/pk/pk0/pk0000/index.htm
Harris 15/08/1997 2.33 Kb HTM index.htm
Packages Ceramic Frit Seal Cerpack Package (Cerpack) Ceramic Dual-In-Line Metal Seal Packages (SBDIP) Ceramic Dual-In-Line Frit Seal Packages (CerDIP) Ceramic Pin Grid Array Packages (CPGA) Ceramic Leadless Chip Carrier Packages (CLCC) Ceramic Metal Seal Flatpack Packages (Flatpack) Ceramic SOIC Flatpack Package (SOIC Flatpack) Ceramic Quad Flatpack Package (CQFP Ceramic Leadless Chip Carrier Dual-In-Line Plastic Package JEDEC Plastic Packages JEDEC
/datasheets/files/harris/families/pkg.htm
Harris 15/08/1997 3.64 Kb HTM pkg.htm
Ceramic Frit Seal Cerpack Package (Cerpack) Ceramic Dual-In-Line Metal Seal Packages (SBDIP) Ceramic Dual-In-Line Frit Seal Packages (CerDIP) Ceramic Pin Grid Array Packages (CPGA) Ceramic Leadless Chip Carrier Packages (CLCC) Ceramic Metal Seal Flatpack Packages (Flatpack) Ceramic SOIC Flatpack Package (SOIC Flatpack) Ceramic Quad Flatpack Package (CQFP) Metal Can Ceramic Leadless Chip Carrier Dual-In-Line Plastic Package JEDEC Plastic Packages JEDEC
/datasheets/files/harris/packages/index.htm
Harris 15/08/1997 5.59 Kb HTM index.htm
BEY HCF4519 HCF4519 BC1 F (Ceramic Frit Seal Package) M1 (Micro Package) C1 (Plastic Chip Carrier) The ceramic packages or in 16-pin SO micro- packages. The HCC4519B HCC4519B and HCF4519B HCF4519B can be used for three 0.130 Z 1.27 0.050 P001C P001C 2/6 Ceramic DIP16/1 DIP16/1 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN.
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/2083-v3.htm
STMicroelectronics 25/05/2000 5.71 Kb HTM 2083-v3.htm
HCF4519 HCF4519 BC1 F (Ceramic Frit Seal Package) M1 (Micro Package) C1 (Plastic Chip Carrier) The HCC4519B HCC4519B and HCF4519B HCF4519B are monolithic in- tegrated circuits, available in 16-lead dual-in-line plastic or ceramic Ceramic DIP16/1 DIP16/1 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 20 0.787 B 7 0.276 D 3.3
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/2083-v2.htm
STMicroelectronics 14/06/1999 3.9 Kb HTM 2083-v2.htm
BM1 HCF4560 HCF4560 BEY HCF4560 HCF4560 BC1 F (Ceramic Frit Seal Package) M1 (Micro Package) C1 (Plastic Chip Carrier plastic or ceramic packages and plastic micro pack- ages. The HCC4560B HCC4560B and HCF4560B HCF4560B add two 4-bit num- 1.27 0.050 P001C P001C 2/6 Ceramic DIP16/1 DIP16/1 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 20
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/2092.htm
STMicroelectronics 20/10/2000 5.94 Kb HTM 2092.htm
BM1 HCF4566 HCF4566 BEY HCF4566 HCF4566 BC1 F (Ceramic Frit Seal Package) M1 (Micro Package) C1 (Plastic Chip dual-in-line plastic or ceramic packages and plastic micro pack- ages. The HCC4566B HCC4566B and HCF4566B HCF4566B are 3.3 0.130 Z 1.27 0.050 P001C P001C 2/6 Ceramic DIP16/1 DIP16/1 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX.
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/2093-v3.htm
STMicroelectronics 25/05/2000 6.23 Kb HTM 2093-v3.htm
PROTECTION ON ALL INPUTS ORDER CODES : HCC4560 HCC4560 BF HCF4560 HCF4560 BM1 HCF4560 HCF4560 BEY HCF4560 HCF4560 BC1 F (Ceramic Frit Seal tegrated circuits, available in 16-lead dual-in-line plastic or ceramic packages and plastic micro pack- 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 0.050 P001C P001C 2/6 Ceramic DIP16/1 DIP16/1 MECHANICAL DATA DIM. mm inch
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/2092-v2.htm
STMicroelectronics 14/06/1999 3.96 Kb HTM 2092-v2.htm
ALL INPUTS ORDER CODES : HCC4560 HCC4560 BF HCF4560 HCF4560 BM1 HCF4560 HCF4560 BEY HCF4560 HCF4560 BC1 F (Ceramic Frit Seal tegrated circuits, available in 16-lead dual-in-line plastic or ceramic packages and plastic micro pack- 2.54 0.100 e3 17.78 0.700 F 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 0.050 P001C P001C 2/6 Ceramic
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/2092-v3.htm
STMicroelectronics 25/05/2000 5.76 Kb HTM 2092-v3.htm