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"ball collapse" height

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: such as solder ball volume and pad diameter, the solder balls on the device will collapse to a height , shown in Figure 2, a solder ball with an original height of 0.4 mm will give a standoff of 0.35 mm ... Texas Instruments
Original
datasheet

11 pages,
40.36 Kb

TMS320C6201 tms320 solder reflow TMS320 AN1231 BGA Solder Ball collapse BGA 0.35mm pitch BGA NSMD ball 0.4mm pitch BGA routing BGA Solder Ball 0.35mm BGA Package 0.35mm pitch 0.35mm BGA SPRA429 BGA Solder Ball 0.35mm collapse TMS320C6x "0.4mm" bga "ball collapse" height TEXT
datasheet frame
Abstract: device will collapse to a height of less than the original ball diameter. It is necessary to control , joint fatigue strength. Typically, as shown in Figure 2, a solder ball with an original height of 0.4 ... Texas Instruments
Original
datasheet

3 pages,
21.51 Kb

TMS320C6201 AN1231 0.35mm BGA "ball collapse" height bga thermal cycling reliability TMS320 BGA 0.35mm pitch TMS320 bga 0.4mm pitch BGA routing tms320 solder reflow BGA Solder Ball 0.35mm BGA Solder Ball collapse BGA Package 0.35mm pitch BGA Solder Ball 0.35mm collapse "0.4mm" bga "ball collapse" height TEXT
datasheet frame
Abstract: starts with an approximate height of 25 mils (plus paste if any) and collapses down one to nine mils ... Mindspeed Technologies
Original
datasheet

4 pages,
39.95 Kb

Cold solder joint pbga package weight mindspeed pbga 500154B TEXT
datasheet frame
Abstract: height, and the performance established in the previous non-RoHS product. The standard ClearONE Ball , Flow Stenciling Solder Paste Step 1 *Visual Inspection *Solder Paste Height Measurement , stencil thoroughly, and then apply fresh solder paste to stencil. The solder paste height should be , ) ( Figure 10b. Paste Height of un-reflowed paste (Cross Section View) Any SnAgCu paste with good stencil , oven Wash system, if needed Magnifying glass Paste height measuring system Microscope X-ray ... CTS
Original
datasheet

11 pages,
96.09 Kb

X-RAY INSPECTION paste profile IPC-A-610C C-200 AN1005 TEXT
datasheet frame
Abstract: the overall height of the receptacle the OEM may desire to use larger land pads on the motherboard. Data shows that there is no significant impact to the overall height by using a metal-defined land pad ... Intel
Original
datasheet

16 pages,
109.68 Kb

pcb warpage after reflow BGA Solder Ball collapse BGA PACKAGE thermal profile reflow hot air BGA BGA reflow guide heller 1700 TEXT
datasheet frame
Abstract: Overall Height ... ON Semiconductor
Original
datasheet

8 pages,
56.35 Kb

SM-782A J-STD-013 IPC-7095 AND8075/D TEXT
datasheet frame
Abstract: creates an improved mechanical connection. As shown in Figure 16, the original ball height on the package is 0.40mm. The ball height typically drops to 0.35mm after the package is mounted. FIGURE 16 ... Fairchild Semiconductor
Original
datasheet

8 pages,
719.81 Kb

vias 74LCX16500 74VCX32374 74VCX32500 AN5026 BGA 0.35mm pitch BGA 0.56mm BGA Solder Ball 0.35mm "ball collapse" height FST32211 FST16211 AN-5026 micro pitch BGA 1mm pitch BGA BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA socket 0.35mm BGA fanout BGA Solder Ball 0.35mm collapse BGA Solder Ball collapse TEXT
datasheet frame
Abstract: Instruments evaluations and research. Package Height . ranges depending on body size, ball size and ... Texas Instruments
Original
datasheet

17 pages,
780.17 Kb

tray 23X23 high current pogo pin shape 376ZDW 27X27 23x23 tray Texas Instruments Philippines SSZA002 PBGA 23X23 0.8 pitch 208z TEXT
datasheet frame
Abstract: connection. 5. The weight of the package. As shown in Figure 12, the original ball height on the package is 0.40mm. The ball height typically drops to 0.35mm after the package is mounted. FIGURE 11 ... Fairchild Semiconductor
Original
datasheet

7 pages,
517.26 Kb

FSTD32211 AN-5026 AN500543 AN5026 BGA 0.35mm pitch BGA 0.56mm 0.35mm BGA fanout BGA Solder Ball 0.35mm FSTD16211 BGA Package 0.35mm pitch BGA Solder Ball 0.35mm collapse BGA Solder Ball collapse TEXT
datasheet frame
Abstract: Mold Cap Height 1.17 mm 1.17 mm 1.17 mm 1.17 mm Package Thickness Overall 2 Layers/4 Layers , package height soldered to PCB is [(Ball Diameter X reflow collapse ~66%) + PCB + Mold Cap] Non Solder ... QuickLogic
Original
datasheet

5 pages,
186.35 Kb

bga rework "ball collapse" height stencil tension Cu-56 BGA "direct replacement" thick bga die size entek Cu-56 TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
The height and width of the flat panel are programmable through configuration registers up to a size
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/6377.htm
STMicroelectronics 20/10/2000 103.85 Kb HTM 6377.htm
height and width of the flat panel are programmable through configuration registers up to a size of
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/6377-v3.htm
STMicroelectronics 24/01/2001 101.68 Kb HTM 6377-v3.htm
it to the TFT format. The height and width of the flat panel are programmable through configuration
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/6377-v1.htm
STMicroelectronics 02/04/1999 62.7 Kb HTM 6377-v1.htm
height and width of the flat panel are programma- ble through configuration registers up to a size of
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/7341-v1.htm
STMicroelectronics 16/10/2000 126.76 Kb HTM 7341-v1.htm
it to the TFT format. The height and width of the flat panel are programmable through configuration
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/6377-v2.htm
STMicroelectronics 14/06/1999 62.67 Kb HTM 6377-v2.htm
the RAM- DAC and reformats it to the TFT format. The height and width of the flat panel are programma-
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/7341.htm
STMicroelectronics 20/10/2000 132.77 Kb HTM 7341.htm
No abstract text available
/datasheets/files/linear/lview4/parts.edb
Linear 15/02/2000 7168.02 Kb EDB parts.edb
No abstract text available
/download/79262054-393174ZC/mplabc30v2_05.tgz
Microchip 09/11/2006 27045.95 Kb TGZ mplabc30v2_05.tgz
No abstract text available
/download/46713865-484035ZC/gnu_tsc.bz2
Motorola 16/02/2000 22032.79 Kb BZ2 gnu_tsc.bz2
No abstract text available
/download/49104857-995987ZC/xapp542.zip ()
Xilinx 11/11/2004 9180.01 Kb ZIP xapp542.zip