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Part Manufacturer Description PDF & SAMPLES
WM8350GEB/V Cirrus Logic Consumer Circuit, CMOS, PBGA129, 7 X 7 MM, 0.94 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MO-195, BGA-129
WM8310CGEB/V Cirrus Logic Microprocessor Circuit, CMOS, PBGA169, 7 X 7 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, BGA-169
WM8350GEB/RV Cirrus Logic Consumer Circuit, CMOS, PBGA129, 7 X 7 MM, 0.94 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MO-195, BGA-129
WM8310CGEB/RV Cirrus Logic Microprocessor Circuit, CMOS, PBGA169, 7 X 7 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, BGA-169
CS42L73-CRZR Cirrus Logic Consumer Circuit, PBGA65, 5 X 5 MM, FBGA-65
CS42L73-CRZ Cirrus Logic Consumer Circuit, PBGA65, 5 X 5 MM, FBGA-65

"ball collapse" height

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: such as solder ball volume and pad diameter, the solder balls on the device will collapse to a height , shown in Figure 2, a solder ball with an original height of 0.4 mm will give a standoff of 0.35 mm Texas Instruments
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SPRA429 AN1231 TMS320C6201 TMS320C6x BGA Solder Ball 0.35mm collapse 0.35mm BGA BGA Package 0.35mm pitch TMS320C6
Abstract: device will collapse to a height of less than the original ball diameter. It is necessary to control , joint fatigue strength. Typically, as shown in Figure 2, a solder ball with an original height of 0.4 Texas Instruments
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TMS320 BGA Solder Ball collapse BGA Solder Ball 0.35mm tms320 solder reflow 0.4mm pitch BGA routing TMS320 bga
Abstract: starts with an approximate height of 25 mils (plus paste if any) and collapses down one to nine mils Mindspeed Technologies
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mindspeed pbga pbga package weight Cold solder joint 500154B
Abstract: height, and the performance established in the previous non-RoHS product. The standard ClearONE Ball , Flow Stenciling Solder Paste Step 1 *Visual Inspection *Solder Paste Height Measurement , stencil thoroughly, and then apply fresh solder paste to stencil. The solder paste height should be , ) ( Figure 10b. Paste Height of un-reflowed paste (Cross Section View) Any SnAgCu paste with good stencil , oven Wash system, if needed Magnifying glass Paste height measuring system Microscope X-ray CTS
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AN1005 C-200 IPC-A-610C paste profile X-RAY INSPECTION
Abstract: the overall height of the receptacle the OEM may desire to use larger land pads on the motherboard. Data shows that there is no significant impact to the overall height by using a metal-defined land pad Intel
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heller 1700 BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow 240-P
Abstract: Overall Height ON Semiconductor
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IPC-7095 J-STD-013 SM-782A AND8075/D
Abstract: creates an improved mechanical connection. As shown in Figure 16, the original ball height on the package is 0.40mm. The ball height typically drops to 0.35mm after the package is mounted. FIGURE 16 Fairchild Semiconductor
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0.35mm BGA fanout 1mm pitch BGA socket land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026
Abstract: Instruments evaluations and research. Package Height . ranges depending on body size, ball size and Texas Instruments
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SSZA002 208z PBGA 23X23 0.8 pitch Texas Instruments Philippines 23x23 tray 27X27
Abstract: connection. 5. The weight of the package. As shown in Figure 12, the original ball height on the package is 0.40mm. The ball height typically drops to 0.35mm after the package is mounted. FIGURE 11 Fairchild Semiconductor
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FSTD16211 BGA 0.56mm BGA 0.35mm pitch AN5026 AN500543 FSTD32211
Abstract: Mold Cap Height 1.17 mm 1.17 mm 1.17 mm 1.17 mm Package Thickness Overall 2 Layers/4 Layers , package height soldered to PCB is [(Ball Diameter X reflow collapse ~66%) + PCB + Mold Cap] Non Solder QuickLogic
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entek Cu-56 thick bga die size BGA "direct replacement" Cu-56 stencil tension bga rework
Abstract: resist is removed and the UBM etched. The bump characteristics are controlled via bump height, shear , . Electroplating limits the achievable solder bump height after reflow to about 100 microns. If redistribution , necessary bump height. Stencil printed solder balls with 200 micron height have been demonstrated for 0.5 , height 250 um dodecagon 500 um Polyimide TiW-Cu 300 um Different structure combinations have , bump height on a chip is 90 um, bump height range 5.5 um. Fig .7 Flip chip solder bumps Error EM Microelectronic-Marin
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CH-2074
Abstract: . Test Socket Support BGA 1.5 mm Height BGA Adapters: Emulation Technology ZIF & production Xilinx
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XC73108 225-pin BGA fine BGA thermal profile X3365 capacitance in BGA package TEXTOOL zif
Abstract: precise definition for either. CSP configurations are often broadly classified by solder bump height or , placement height should be programmed to adjust for the height of the device. The mechanical pick-up and Semtech
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MO-211 SN62 PB36 ag2 SN62 PB36 ag2 Copper design ideas SFC05-4 smd ag2 SI00-06
Abstract: ball collapse and final mated height. · The recommended solder volume is 0.026 - 0.044 cubic mm FCI
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LR-735 of Ball grid array reflow soldering profile BGA GES-12-100
Abstract: bump height or by package sizes. The latter definition is a device with a package size that is 1.2 to , optical component centering is used to place the devices on the board. The placement height should be programmed to adjust for the height of the device. The mechanical pick-up and placement force must be Semtech
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Abstract: count, cross-section for standoff height determination t Twenty solder joints/cell analyzed for voids , standoff height t Voids, while not altering crack propagation path, slowed crack propagation by forcing Motorola
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PBGA 256 reflow profile bt 2328 pbga 144 304-pin dimensions bga jedec pbga OSP FLIPCHIP CRACK
Abstract: height of the tallest component. This allows for a 45 degree soldering angle in case manual work is , land · The board assembly reflow conditions · The weight of the package The original ball height on Texas Instruments
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SZZA005 12x12 bga thermal resistance A113 BGA Ball Crack TMS320VC549 TMS320VC549GGU S-PBGA-N240 4145255-4/B PCI1450
Abstract: Symbol Description of Dimensions A Overall Height A1 Stand Off A2 Encapsulant Height A3 Die Height with FC Bumps and Underfill b Ball Diameter c Substrate Thickness D , 0.001-0.002mils) lower standoff height from the PCB. The thermal cycle reliability of BGA component could be slightly compromised because of the reduced standoff height, especially if solder balls are under the die , possible solutions are: · Establish the head height prior to reflow and control the stroke. · Place Intel
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Intel reflow soldering profile BGA A5832 JEDEC bga 63 tray Intel BGA A4470-01 Lead Free reflow soldering profile BGA
Abstract: volume to give a standoff height of 0.7mm to 0.75mm across the device, depending on the device to board pad configuration. The solder has a sufficient collapse height to ensure that no opens will occur Fairchild Semiconductor
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AN-3011 FODB100 90Pb10Sn FODB10X 5SN3 62Sn36Pb2Ag 95Pb-5 95Pb5Sn AN3006009
Abstract: Letter or Symbol Description of Dimensions A Overall Height A1 Stand Off A2 Encapsulant Height b Ball Diameter c Substrate Thickness D Package Body Length D1 , (usually 0.001-0.002mils) lower standoff height from the PCB. The thermal cycle reliability of BGA component could be slightly compromised because of the reduced standoff height, especially if solder balls , . Two possible solutions are: · Establish the head height prior to reflow and control the stroke. · Intel
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bga 196 land pattern BGA PACKAGE TOP MARK intel bga Shipping Trays land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package
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