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Part : 3046-D-440-B-44 ANNEALED Supplier : RAF Electronic Hardware Manufacturer : Bisco Industries Stock : 38 Best Price : - Price Each : -
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"annealing copper"

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: present the findings of a series of whisker growth studies performed on 100% matte Sn plating on Copper , Reduction in induced stress during assembly and storage by o Annealing after plating (150°C for 1 hour , though there is general agreement to the benefits of annealing, conflicting results are available in the , whisker growth studies using 100% matte Sn finish on C194 copper leadframes. Table 1 summarizes the , studies done on Sn whisker growth Annealing Plating Assby Test Component/Board Package (150°C, 1hr -
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leadframe Cu C194 ALLOY leadframe C7025 ALLOY leadframe C7025 material property SEM 2004 SEM 2006 leadframe C7025 20052004/YAGEO 20APE
Abstract: alloy containing approximately 76 percent nickel with additions of iron, chromium and copper. The alloy , annealing cycle. 2) Physical Properties Density: 8.6 gm/cm.³ 0.305 Ib./in.³ Electrical Resistivity , annealed. HEAT TREATMENT Magnetic properties of MUMETAL ® are a function of the final annealing , properties. These properties are best obtained by annealing for four hours at 1100° C/1180°C in a pure dry -
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A753-85 MIL-N-14411C mumetal nickel magnetic properties mil grade relays spang specialty alloys
Abstract: a certain propensity to whisker growth. Fig. 1: Whiskers grown on SnCu1 plated copper after 1 , leadframe materials, such as Olin 194, K 75, K80, K81, Olin 7025, Alloy 42, copper plated Alloy 42, . , to tin on copper. Thus the conclusion was near to correlate this to the interdiffusion of metals and also to the formation of intermetallics. Fig. 2 shows the cross section of a tin layer on copper , at ambient conditions with small Ni3Sn4 intermetallics Fig. 2: Electroplated tin on copper after -
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Cu6Sn5 FeNi42 Infineon diffusion solder leadframe materials olin 7025 smema
Abstract: .4 Annealing , annealing operation afterwards. 4. In general, an increase in shield thickness from 0.014" to 0.050 , . ANNEALING High permeability nickel-iron alloys have poor magnetic properties in the cold rolled or , affected by annealing temperatures and cooling rates (See pg. 6). Therefore, shielding efficiencies of , annealing temperature, the higher the permeability and attenuation ratio. Annealing improves the properties Spang
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permalloy 80 ALLOY48 Aluminum alloys physical properties Helmholtz Coil permalloy 48 magnetic field shield EMC-10
Abstract: grown on SnCu1 plated copper after 1 year storage in ambient conditions. From processability and , ), FeNi42, copper plated FeNi42 and others. Various electrolytes from six different suppliers have been , material do not exhibit whisker growth under ambient conditions in contrast to tin on copper. Thus the , intermetallics. Fig. 2 shows the cross section of a tin layer on copper after an ambient storage of nine months , . Sn Ag3Sn Ag Cu6Sn5 Cu Fig. 2: Electroplated tin on copper after 9 months storage at -
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C1807 C18070 C70250 CuCrSiTi C19400 C1441
Abstract: shows its flow. Rebound annealing at 100°C is omitted in the flow, since there are enough data showing , Electrical Tests Fail Functionality 4. Room Temperature Annealing 5. Post RT Annealing Elec Tests , pre-irradiation (step 1 in Figure 1), postirradiation (step 3), and post room temperature annealing tests (step 5 , passed 3.2 IDDSTANDBY IDDstandby was monitored during the irradiation and annealing period. Because the board had a measurable leakage, only the delta IDDstandby due to radiation and/or annealing was -
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A1280A LAN1001 LAN1002 LAN1005 TM1019 LAN1003 RT1280A RT1280 t14100 99T-RT1280A-2 CQFP176 U1H486
Abstract: Selective Annealing â'¢ Deep Internal Serrations Because of the mechanical strength of copper, an , puts our terminals through one more step called selective annealing. This process leaves the barrel , goals by removing valuable material or using a softer copper which has lower conductivity. This Thomas & Betts
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MIL-G-45204 QQ-N-290 MIL-T-16366 MIL-T-10727
Abstract: CONTACT & SPRING = BERYLLIUM COPPER PER ASTM B196, ALLOY C17300, TEMPER TD04. SLEEVE = BRASS PER C36000, ANNEALING 1H AT 500°C, HARDNESS 80-120 HV. CRIMP SLEEVE = SEAMLESS LOWLEAD BRASS TUBE, ALLOY 330, SOFT ANNEAL TEMPER, .025/.060 GRAIN SIZE OR SEAMLESS COPPER TUBE PER ASTM B75, TYPE C12000, TEMPER: LIGHT , 2105-1521-903 1. BODIES = GOLD PLATE PER MIL-G-45204, TYPE II, CLASS 1, GRADE C, OVER .0001 TO .0002 COPPER , , CLASS 0, GRADE D, OVER .00010 TO .00020 COPPER STRIKE PER MIL-C-14550. 4. ALL OTHER METAL PARTS = GOLD RADIALL
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MIL-PRF-M39012/69B0009 D1710 RG-316
Abstract: CONTACT & SPRING = BERYLLIUM COPPER PER ASTM B196, ALLOY C17300, TEMPER TD04. SLEEVE = BRASS PER C36000, ANNEALING 1H AT 500°C, HARDNESS 80-120 HV. CRIMP SLEEVE = SEAMLESS LOWLEAD BRASS TUBE, ALLOY 330, SOFT ANNEAL TEMPER, .025/.060 GRAIN SIZE OR SEAMLESS COPPER TUBE PER ASTM B75, TYPE C12000, TEMPER: LIGHT , 2105-1521-803 1. BODIES = GOLD PLATE PER MIL-G-45204, TYPE II, CLASS 1, GRADE C, OVER .0001 TO .0002 COPPER , , CLASS 0, GRADE D, OVER .00010 TO .00020 COPPER STRIKE PER MIL-C-14550. 4. ALL OTHER METAL PARTS = GOLD RADIALL
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MIL-PRF-M39012/69B0010
Abstract: approximately 77% Nickel with additions of Iron, Chromium and Copper. It is available to MIL-N14411C , Sintering Hot Rolling Shot Blasting Strip Grinding Batch Annealing Cold Rolling Strip Reroll Continuous Strip Annealing Strip Flattening Slitting Used for internal research and development work , Molybdenum lron 80% 4.4% Balance MuMetal ® - Vacuum Melted Nickel Copper Chromium Iron 77% 5 -
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A801-82 permendur permeability permendur orthonol Permalloy powder copper chromium
Abstract: , TYPE I, CLASS "B". CONTACT & SPRING = BERYLLIUM COPPER PER ASTM B196, ALLOY C17300, TEMPER TD04 , SEAMLESS COPPER TUBE PER ASTM B75, TYPE C12000, TEMPER: LIGHT ANNEAL O50 EXCEPT YIELD STRENGTH. 5. SLEEVE = BRASS PER C36000, ANNEALING 1H AT 500°C, HARDNESS 80-120 HV. FINISHES: UNLESS OTHERWISE , -290, CLASS 1, GRADE G, EXCEPT .0001 TO .0002 THICK OVER .00005 TO .0001 THICK COPPER PER MIL-C-14550. 3 , COPPER STRIKE PER MIL-C-14550. RADIALL RADIALL
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RG-316DS
Abstract: .The applicable cable conductor is the tin plated annealing copper wire. Note 2.If other cables are used instead , Applicable Cable (Tin Plated Annealing Copper Wire) Conductor Size (Wire construction) AWG20 (21cores , is the tin plated annealing copper wire. Note 2.If other cables are used instead of the applicable , Annealing Copper Wire) Conductor Size (Contact wire construction) AWG20 (21 pieces/0.18mm) AWG22 (17 , Contact for Socket Contact Phosphor copper Tin plated or gold plated ­­­­­­ Crimping Hirose Electric
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4-S25 UL1007 AWG22 DF1B-R28F DF1B-26DEP-2.5RC B155 B154 AWG24 DF1B-2428SCF/SCFA AP105-DF1B-30S DF1B-30SCF/SCFA AP105-DF1B-2022P DF1B-2022PCF/PCFB
Abstract: plated annealing copper wire. Note 2.If other cables are used instead of the applicable cable, cotact , (C) Note 1.The applicable cable conductor is the tin plated annealing copper wire. Note 2.If other , for Plug K Applicable Cable (Tin Plated Annealing Copper Wire) Conductor Size (Contact wire , Insulator Contact Insulator Contact Contact Material Polyamide Phosphor copper Phosphor copper Polyamide Brass Polyamide Phosphor copper Phosphor copper White Tin plating or gold plating Tin plating or gold Hirose Electric
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02244 7es2 DF1B-20DS-2 PCFB CL550-0210-0 CL901-0005-4 CL550-0170-8 CL550-0179-2 DF1B-2022SCF/SCFA DF1B-2428PCF
Abstract: post-irradiation measurements were performed to investigate annealing behaviour. In those cases, the bias was , function of the total ionizing dose (mV/decade). 2.2.3. Annealing effects Some annealing and reverse annealing effects were observed. The saturation voltage mentioned before decreases when the , . This reverse annealing effect has also been noticed in total dose radiation tests on CCDs6. 3 , , the irradiation was stopped and the room temperature annealing behaviour was investigated (562 hours -
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shockley diode ccd sensor star tracker shockley diode application diode shockley sun tracking sensors photodiodes shockley diode datasheet
Abstract: treatment was necessary to stabilize the devices by annealing out gate oxide charge, as well as those , % TO 10% DECAY TIME (us) AFTER IRRADIATION AND ANNEALING LATCH AT 27A 0 5 10 15 IA - , AS-FABRICATED DEVICE AND AFTER 14MeV NEUTRON IRRADIATION (1013n/cm2) FOLLOWED BY ANNEALING AT +300oC. n , and (2) after irradiation with 14MeV neutrons and annealing is shown in Figure 3. Here, the neutron fluence was ~1013n/cm2; this was followed by annealing at +300oC. Note that tF, has not only been Fairchild Semiconductor
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AN-7505 fairchild low power transistor 1977
Abstract: AFTER IRRADIATION AND ANNEALING LATCH AT 27A 0 5 10 15 IA - ANODE CURRENT (A) 20 25 , NEUTRON IRRADIATION (1013n/cm2) FOLLOWED BY ANNEALING AT +300oC. n+ pn- EPITAXIAL LAYER p+ (100 , annealing out gate oxide charge, as well as those radiation induced defects in the silicon (recombination , 14MeV neutrons and annealing is shown in Figure 3. Here, the neutron fluence was ~1013n/cm2; A FIGURE 1C. SCHEMATIC DIAGRAM OF MODIFIED STRUCTURE this was followed by annealing at +300oC. Note that Harris Semiconductor
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AN8603 SCHEMATIC WITH IGBTS Abstract schematic power transistor MOS-Gated Thyristor thyristor rca ED-26
Abstract: 1.The applicable cable conductor is the tin plated annealing copper wire. Note 2.If other cables , Socket K Applicable Cable (Tin Plated Annealing Copper Wire) Conductor Size (Wire construction) AWG20 , is the tin plated annealing copper wire. Note 2.If other cables are used instead of the applicable , Annealing Copper Wire) Conductor Size (Contact wire construction) AWG20 (21 pieces/0.18mm) AWG22 (17 , Phosphor copper Tin plating or gold plating ­­­­­­ Crimping Contact for Socket Contact Hirose Electric
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DF1-PD2428SCB CM-105 UL1061 AWG20 2428 UL1007 AWG20 541-0645 DF1B-12DES-2.5RC DF1B-2428SCA AP105-DF1B-2428P DF1-PD2428SCF/SCFB AP105-DF1B-30P DF1B-30PCF/PCFB DF1B-TA2022SHC DF1B-2022SC/SCA
Abstract: CONTACT MATERIALS AND FINISHES: MATERIALS AND FINISHES: HIGH CONDUCTIVITY: Tellurium copper , REMOVABLE CONTACTS Precision machined copper alloy with gold flash over nickel. Other finishes are , . MATERIALS AND FINISHES: Precision machined copper alloy with gold flash over nickel. Other finishes are , contacts eliminating possibility of incorrect annealing causing reliability problems on the mating end of Positronic Industries
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2002/95/EC FC720N2/AA FC720N2/AA-14 FC422N8
Abstract: additional heat treatment was necessary to stabilize the devices by annealing out gate oxide charge, as , STRUCTURE tF - 90% TO 10% DECAY TIME (us) AFTER IRRADIATION AND ANNEALING LATCH AT 27A 0 5 , ANNEALING AT +300oC. n+ p+ (100) SUBSTRATE AS FABRICATED An example of the variation of tF , with iA (1) as fabricated and (2) after irradiation with 14MeV neutrons and annealing is shown in Figure 3. Here, the neutron fluence was ~1013n/cm2; this was followed by annealing at +300oC. Note that Fairchild Semiconductor
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AN75 semiconductor power devices
Abstract: necessary to stabilize the devices by annealing out gate oxide charge, as well as those radiation induced , CURRENT FOR ORIGINAL STRUCTURE AND MODIFIED STRUCTURE 4-2 AFTER IRRADIATION AND ANNEALING LATCH , ) FOLLOWED BY ANNEALING AT +300oC. n+ p+ (100) SUBSTRATE AS FABRICATED An example of the variation of tF , with iA (1) as fabricated and (2) after irradiation with 14MeV neutrons and annealing is shown in Figure 3. Here, the neutron fluence was ~1013n/cm2; this was followed by annealing at +300oC. Intersil
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ISO9000
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