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"alpha" PACKAGE OUTLINE

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Abstract: _ Gunn Diodes Features Spot Frequency Choice of Package Styles Range of Microwave Power , with the active layer up permost in the package, requiring the heat sink to be biased as the anode. A , close to the package heat sink for optimum thermal performance. Such devices require the heat sink to be , Anode Heat Sink Package 023-001 Type Operating Operating CW Power (mW) C urrent (mA) Voltage (Volts) 5 Pulsed Gunn Diodes, X-Band, 8.2-12.4 GHz Anode Heat Sink Package 023-001 Typ« Operating Operating CW ... OCR Scan
datasheet

9 pages,
603.2 Kb

DGB7191 DGB8081 DGB8091 DGB8355 DGB843 DGB8545 Gunn Diode e band gunn DGB9215 DGB8535 DGB8521 DGB7131 x-band gunn diode DGB8281 DGB8332 Gunn Diode x-band DGB8625 DGB8381 alpha GUNN OSCILLATORS gunn diodes TEXT
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Abstract: Small Outline Package) I = PCB Chip Carrier K = Cerdip Window L = Ceramic LCC (Leadless Chip Carrier , ) 23 PACKAGE INFORMATION CPS95CO0125 CPS95CO0125 PACKAGE INFORMATION SOIC (Small Outline Integrated , . Coplanarity Maximum 4 mils deviation 18-Lead Small Outline Integrated Circuit (SOIC) 24 PACKAGE INFORMATION CPS95CO0125 CPS95CO0125 PACKAGE INFORMATION SOIC (Small Outline Integrated Circuit) (Continued) 1 , Maximum 4 mils deviation 20-Lead Small Outline Integrated Circuit (SOIC) 25 PACKAGE INFORMATION ... ZiLOG
Original
datasheet

50 pages,
833.94 Kb

Z84C90 ceramic QFP Package 100 lead 64 CERAMIC LEADLESS CHIP CARRIER LCC 10X10 84C00 MIL-STD-883C CPS95CO0125 Z84C0010PEC TEXT
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Abstract: Case Industry Standard Package Dimensions Wide Variety of Switching and Attenuator PIN diodes 100% TX , mount PIN diodes uses a cylindrical glass package, commonly called the MELF, which incorporates various , techniques. Parasitic inductance is extremely low since the package is free of thin wire or ribbon contacts , . .-65 to +175°C Power Dissipation.(derated linearly to zero at 175°C) Case Outline 469 at 25°C.500 mW Case Outline 471 at 25°C.1.0W Maximum Soldering Temperature ... OCR Scan
datasheet

2 pages,
210.86 Kb

ALPHA SOLDER TEXT
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Abstract: Hermetically Sealed Glass Case Industry Standard Package Dimensions Wide Variety of Switching and , Operating Temperature: Storage Temperature: Power Dissipation: Case Outline 469 at 25°C: Case Outline 471 at , cylindrical glass package, commonly called MELF, which incorporates various PIN chips between two conducting , since the package is free of thin wire or ribbon contacts. These devices are designed for optimum , 0.5 0.5 3.0 2.0 0.5 TL @IF = 10 mA IR = 6 mA 90% Recovery 0.2 0.2 0.8 1.5 2.5 2.0 Outline ... OCR Scan
datasheet

2 pages,
75.92 Kb

MA01801 SMP1600 TEXT
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Abstract: Mount Design Hermetically Sealed Glass Case Industry Standard Package Dimensions W ide Variety of , 1.0W 250°C for 20sec. Storage Temperature: Power Dissipation: Case Outline 469 at 25°C: Case Outline 471 at 25°C: Max. Soldering Temperature: Description Alpha's line of hermetic surface mount PIN diodes uses a cylindrical glass package, commonly called MELF, which incorporates various PIN , inductance is extremely low since the package is free of thin wire or ribbon contacts. These devices are ... OCR Scan
datasheet

3 pages,
229.42 Kb

SMP1604-01 SMP1602-01 SMP1600 TEXT
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Abstract: Package Outline: 023-001 V^Xmin) 10 Volte 20 Volts 30 Volts 40 Volts «VÍPF) 0.3-0.35 0.3-0.45 , -30 D5256-06 D5256-06 D5256-12 D5256-12 D5249-06 D5249-06 D5249-12 D5249-12 D5249-18 D5249-18 D5249-24 D5249-24 D5259-06 D5259-06 Package Outline: 067-001 V8 , -12 D5018-18 D5018-18 D 5018-24 D5019-06 D5019-06 Package Outline: 290-001 VB(1)(min) 10 Volts 20 Volts 30 Volts , signal sources. The diodes are offered in the 023 outline for application up to 35 GHz output, the 067 outline for application up to 60 GHz output (the 067 outline has the same interior dimensions as the 082 ... OCR Scan
datasheet

3 pages,
203.26 Kb

Frequency Tripler varactor D5244-06 D5244-12 D5244-18 D5244-24 D5244-30 D5244-36 D5244-42 D5244-48 D5245-06 D5245-36 varactor multiplier 94 GHz varactor ghz varactor alpha power varactor millimeter gunn diode Gunn Diode varactor diode high frequency 2.4 GHZ GaAs Gunn Diode "94 GHz" TEXT
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Abstract: Chip Outline Number 149-801 149-801 149-801 149-801 149-801 Available Package Outlines2 Glass , Junctions Available in a Wide Range of Package Outlines and in Die Form Maximum Ratings Reverse Voltage , package styles, please consult the factory. Very High Capacitance Ratio Hyperabrupt Varactors (HF and , 0.2 0.15 0.10 0.10 0.10 Q1 2V, 50 MHz Min 750 500 500 500 300 Chip Outline Number 149-803 149-818 149-819 149-828 149-806 Available Package Outlines 2 Glass 099-001 099-001 099-001 099-001 ... OCR Scan
datasheet

8 pages,
327.61 Kb

SMV1201-98 DKV6522 DKV6520-24 CKV2104 CKV2010 CKV2020 DKV6520 DKV6530 TEXT
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Abstract: selection of outline (package) dimensions. 210 219 230 240 Outline Dimensions 149­801 , Offered in Package Styles Suitable for a Wide Range of Applications Description Maximum Ratings , chip capacitance measured at 1 MHz. For packaged varactors add appropriate package capacitance, e.g., 0.22 pF for package 210, to obtain total capacitance. Electrical Specifications at 25°C Square , CJ @ 4V (pF) CJ @ 20V (pF) Q @ 4V 50 MHz Chip Outline Number N mber " Available ... Alpha Industries
Original
datasheet

2 pages,
44.99 Kb

The Diode with Package Outlines SMV2023 SMV2022 SMV2021 SMV2020 SMV2019 alpha industries catalog "Varactor Diodes" HYPERABRUPT TEXT
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Abstract: the Outline Drawings section in this catalog for the total selection of outline (package) dimensions , Network Offered in Package Styles Suitable for a Wide Range of Applications Description Alpha microwave , specifications table indicates chip capacitance measured at 1 MHz. For packaged varactors add appropriate package capacitance, e.g., 0.22 pF for package 210, to obtain total capacitance. Part Number vb @ 10 nA (V) Ir @ 17.6V (nA) Cj @4V (pF) Cj @ 20V (pF) Q @4V 50 MHz Chip Outline Number Min. Max. Min. Max. Min. Max ... OCR Scan
datasheet

2 pages,
127.49 Kb

SMV2023 SMV2022 SMV2021 SMV2020 SMV2019-000 SMV2019 TEXT
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Abstract: 's performance. Please refer to Outline Drawings section for catalog package outlines, their characteristics, and , CVG7864-01 CVG7864-01 die in a 290-001 package outline. Hyperabrupt Abrupt Varactor Diodes for High Reliability , ): Typical Linearity Range of G am m a = 1 . 0 + 10%: Chip Outline: Junction Capacitance C j @ 4V (pF) Chip , at Alpha are specified in this section. For availability and delivery on other package styles, please , Outline: Junction Capacitance C j @ 4V (pF) Chip Part Number CVG9800-01 CVG9800-01 CVG9800-02 CVG9800-02 CVG9800-03 CVG9800-03 CVG9800 CVG9800 ... OCR Scan
datasheet

4 pages,
182.13 Kb

varactor diodes application varactor diode capacitance range varactor diode AM CVG9800 "Varactor Diodes" CVG7864-01 varactor diode capacitance measurement x band varactor diode varactor diode q factor measurement CVG7864 TEXT
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Archived Files

Abstract Saved from Date Saved File Size Type Download
QFN Package: Compliant to JEDEC PUB95 PUB95 MO-220 MO-220 QFN - Quad Flat No Leads - Package Outline Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile Outline Plastic Package 20 Lead Wide Body Small Outline Plastic Package (JEDEC MS-013-AC MS-013-AC Issue C)  Part No. Status Temp. Package MSL Price US $   of the control, output adjustment, monitoring and protection functions into a single package. The
/datasheets/files/intersil/device_pages/device_hip6004b.html
Intersil 07/09/2006 32.49 Kb HTML device_hip6004b.html
Often caused by alpha particles. SOI Silicon on Insulator SOIC Small Outline Integrated Circuit plastic non-hermetic package (typically commercial) SOJ SOIC package "J" formed SOS
/datasheets/files/texas-instruments/sc/docs/military/milprdov/acronym1.htm
Texas Instruments 07/11/1996 7.96 Kb HTM acronym1.htm
Outputs Synchronous Clear Package Options Include Plastic Small Outline Packages, Both Plastic and Ceramic Chip Carriers, and Standard Plastic and Ceramic
/datasheets/files/texas-instruments/asl_data/aslbooks/graphics/sdas062a/sdas062a.fea
Texas Instruments 16/12/1996 3.18 Kb FEA sdas062a.fea
the driver. The SN74ABT16240 SN74ABT16240 is available in TI's shrink small-
/datasheets/files/texas-instruments/asl_data/aslbooks/graphics/scbs346/scbs346.fea
Texas Instruments 17/12/1996 4.55 Kb FEA scbs346.fea
Ics      Other: 14 Lead Narrow Body Small Outline Plastic Package No. Status Temp. Package MSL Price US $   , output adjustment, monitoring and protection functions into a single package. The output voltage of the Programmable from 50kHz to Over 1MHz 14 Ld, SOIC Package Pb-Free Plus Anneal Available
/datasheets/files/intersil/device_pages/device_hip6013.html
Intersil 07/09/2006 21.74 Kb HTML device_hip6013.html
Lead Narrow Body Small Outline Plastic Package (JEDEC MS-012-AB MS-012-AB Issue C)   Status Temp. Package MSL Price US $   , output adjustment, monitoring and protection functions into a single package. The output voltage of the Programmable from 50kHz to Over 1MHz 14 Pin, SOIC Package Related Documentation
/datasheets/files/intersil/device_pages/device_hip6007.html
Intersil 07/09/2006 20.66 Kb HTML device_hip6007.html
Part No. Status Temp. Package MSL Price US $   of the control, output adjustment, monitoring and protection functions into a single package. The Programmable from 50kHz to Over 1MHz 14 Pin, SOIC and TSSOP Package Pb-Free Available (RoHS ® 2000 Systems      Other: 14 Lead Narrow Body Small Outline Plastic Package (JEDEC MS-012-AB MS-012-AB Issue C)      Parametric Data
/datasheets/files/intersil/device_pages/device_hip6006.html
Intersil 07/09/2006 40 Kb HTML device_hip6006.html
>56-pin shrink small outline (SSOP) packaging Today, many industry valign="top" align="left">
/datasheets/files/texas-instruments/asl_data/aslbooks/graphics/alvc/alvc.sgm
Texas Instruments 30/10/1996 7.19 Kb SGM alvc.sgm
Small Outline (DGG) and 64-Pin Ceramic Dual Flat (HKC) Packages Using 0.5-mm Center-to-Center Spacings >The SN74LVTH18512 SN74LVTH18512 and SN74LVTH182512 SN74LVTH182512 are available in TI's thin shrink small-outline package, which
/datasheets/files/texas-instruments/asl_data/aslbooks/graphics/scbs671/scbs671.fea
Texas Instruments 16/12/1996 7.05 Kb FEA scbs671.fea
Part No. Status Temp. Package MSL Price US $   of the control, output adjustment, monitoring and protection functions into a single package. The ® 2000 Systems      Other: 14 Lead Narrow Body Small Outline Plastic Package (JEDEC MS-012-AB MS-012-AB Issue C)      Parametric Data
/datasheets/files/intersil/device_pages/device_hip6012.html
Intersil 07/09/2006 41.4 Kb HTML device_hip6012.html