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"adhesive study reference"

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Abstract: solutions to long term reliability problems. FEM was used to study two different material combinations where the heat spreader/stiffener attach adhesive and thermal interface materials (TIM) were changed. Temperature cycle tests were performed on both material sets. A secondary goal of this study was to evaluate , flip-chip packages described in this study have a stiffener attached on the periphery of the substrate, and , electroless Ni/immersion Au finish. TIM Chip Heat Spreader Underfill Adhesive Substrate Altera
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Altera Flip Chip BGA warpage cte table flip chip substrate 1806 footprint cte table epoxy substrate BGA cte cte table epoxy
Abstract: stress, E. Effect of Adhesive Material To study the effects of adhesive material on the low-k , low-k dielectric at -55oC is around 123 MPa for all cases. Therefore, this study suggested adhesive , findings of this study, which products designers could benefit from the superior power consumption and , cracking of Cu/low-k structures. Mercado et al. [3] also adopted such technique to study the flip-chip , . Using a 3-D finite element model, this study investigates the effects of various package design Altera
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with or without underfill 53RD Power consumption of FCBGA you ad electronics
Abstract: . Manufacturers/JC-13/ G-12 and Space community members accepted EP study proposal in JEDEC 2010, San Antonio , opportunity for last time buy before product obsolete DSCC 4 3.4.1b Correct reference paragraph , microcircuits package The EP study was conducted, and addition of passive elements (capacitor) proposal , accepted EP study proposal in JEDEC 2010, San Antonio, TX Item No Paragraph to be changed in Rev J Description of changes 15 4.4 Correct reference paragraphs "H.3.4.2 to H.3.2.1.4" and -
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MIL-PRF-123 NCSL Z540.3 A4937 H3213 TM1011 astm B221 C3411 MIL-PRF-38535 MIL-PRF-55681 JC-13/G-12 JC-13
Abstract: to good compatibility with current adhesive dispensing equipment processes. Rauch (4) studied , microelectronic components. For the purpose of this study, we are concerned with the internal thermal , thermal resistance. This is the motivation of this study. The objective is then to identify the thermal , in different thermal and power conditions. In order to accurately study this problem, both FEA and , shown in Table 2 with their respective thermal conditions. Heat sink Heat spreader Adhesive down Altera
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ansys graphite thermal spreader ansys cfd graphite thermal 1998
Abstract: capability. This paper presents the results of a package design study, which employs a "package optimization approach." The package chosen for this study is the 16-lead web-DIP, class of Plastic Dual-In-Line-Package , under study. The projected configuration is also analyzed thermostructurally to examine the mechanical , resistance during temperature cycling. In addition, the study provides a new insight into this type of , targeted package were chosen for this study based on device perfor- 115 Northeast Cutoff, Box 15036 Allegro MicroSystems
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Copper Alloy C151 C151 C194 c194 shear stress c151 lead frame leadframe materials
Abstract: package design study, which employs a "package optimization approach." The package chosen for this study , simulate and analyze the expected thermal performance of the design under study. The projected , . In addition, the study provides a new insight into this type of package and new design principles , companies including our targeted package were chosen for this study based on device perfor- TM , analyzer. Although it is not the intent of this study to critique these packages, the following Allegro MicroSystems
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BERG Electronics c151 TO 92 leadframe PACKAGE THERMAL CHARACTERIZATION et 455 abstract on mini ups system
Abstract: Construction s Schematic Adhesive Insulating coating and impregnated wax Ferrite bead Lead , capacitance change is ±10 % over the temperature range of Ð25 to +85 ¡C in reference to +20 ¡C ]] YD: Maximum capacitance change is +20, Ð30 % over the temperature range of Ð25 to +85 ¡C in reference to +20 , stresses beyond their specified rating, resulting burnout or glowing in the worst case. Study operation of , to occur. Study operation of the circuit. q Excessive mechanical stress may damage the components -
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EMI filter EXC-CMT EXCEMT ISO-9001 EXCCMT1111T
Abstract: 1.25± 0.30 4.5±0.4 0.5±0.2 1.8±0.2 Adhesive Chip capacitor Termination Design , in reference to +20 °C. s Attenuation Characteristics (Reference Data) 0 Measurement Circuit , pcs./reel Weight (mg/pc.) Reference Data 92.5 q Standard Reel Dimensions in mm (not to scale) T , measure a temperature of terminations and study solderability every type of the board, before actual use , circuit where surge or other abnormal voltage is apt to occur. Study operation of the circuit. 7. Store Panasonic
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Abstract: 1.8±0.2 Adhesive Chip capacitor Termination Design, Specifications are subject to change , : Maximum capacitance is ±10 % over the temperature range of ­25 °C to +85 °C in reference to +20 °C. s Attenuation Characteristics (Reference Data) 0 Measurement Circuit 10 Attenuation(dB) 20 30 40 222 , q Standard Quantity Part Number EXCCET111U Embossed Taping 1000 pcs./reel Weight (mg/pc.) Reference , use in conditions other than those specified. l Please measure a temperature of terminations and study Panasonic
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EXCCET222
Abstract: the lead frame, and the cathode end of the block is connected by a conductive adhesive to the other , capacitor. Figure 5. Thermal Impedance Graph Case Size A,B,C & D, In Free Air In the study of the , the Mounted Chip The temperature increase above the reference and the heat flow is given by the , under the body of the capacitor, to simulate the adhesive used to hold the capacitor to the PCB. The , tracks connected to the leads of the capacitor were increased on the second board to study the effect AVX
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tantalum capacitor avx ian salisbury S-TMSM00M301-R
Abstract: block is connected by a conductive adhesive to the other end of the lead frame. The whole assembly is , Impedance Graph Case Size A,B,C & D, In Free Air In the study of the thermal impedance of the various , the adhesive used to hold the capacitor to the PCB. The thermal conductivity of the material will , the Mounted Chip The temperature increase above the reference and the heat flow is given by the , the leads of the capacitor were increased on the second board to study the effect of thermal transfer AVX
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Abstract: of polyimide tapes were applied to the substrate edges to supply the height reference for the applicator (Fig. 2.b). The adhesive was spread over the area by having as a reference point for aligning the tapes (Fig. 2.c). After the adhesive had been applied, the metal sheet under investigation was , et al. [5]. In that study, it was demonstrated that thick layers of higher resistivity materials , attached to the carrier substrate by utilizing an epoxy adhesive. The adhesive thickness had to be same -
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2000C 36804-10M clariant FIN-02150
Abstract: . A Schematic of 2-2-2 BU Substrate CTE = (iViEi) / (ViEi) Adhesive Substrate Stiffener , was used to study the effects of these factors. Some of the results are presented below. Package , was used as the reference temperature which is the stress-free temperature. It is generally 150 oC , important to present the properties of underfill and adhesive correctly to the model. The Young's modulus , and TIM. Some other significant factors, which are not disclosed here, are underfill and adhesive Altera
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thick bga die size crack flip chip ajinomoto Flip Chip Substrate underfill CP-01017
Abstract: ( obtained by trial and study of the casting picture), it allows the greatest flexibility. A forming or a , materials leave a very adhesive residue on heatsink and baseplate during a later removal of the module from , ; it is brittle and fragile. The version Thermflow T 705PSA has an additional adhesive in order to , shipping the printed modules cleaning at disassembly + easy +/- partly adhesive residues - adhesive residues costs + low (for material and tools) - higher (possibly cut / punching - high Eupec
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BSM100GD120DLC Assmann Electronics v6515 Thermagon t-pli 210 kluber grease T-PLI 200 thermagon kluber V6515 FSF-52/98
Abstract: the IC will have a pre- set internal under-voltage reference. If the battery reaches this point , . If the charge voltage increases past that of the IC's built in voltage reference, the charge FET , adhesive (silver loaded adhesive), and gold bond wires connected between die and leads. These can , reference to figure 4 conventional current flow through the device is as follows: when both devices are on , FlipFET device with an industry standard TSSOP8 device, a study on cellphone power requirements was International Rectifier
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bi-directional switches FET bi 370 transistor e Bi-Directional P-Channel Bi-Directional P-Channel mosfet overcharge protection circuit diagram cell phone schematics
Abstract: : Resistance value at reference temperature(T1) R2 : Resistance value at test temperature(T2) Temperature , and solder bridge. (Reference : 100 um to 120 um.) 7.3. Flux and solder in flow soldering Use , temperature of terminals and study solderability every type of boards, before actual use. Preheating , times. * The characteristic of the product may be badly affected when using adhesive to fix it on circuit board, because circuit is on both side of the product. So do not use adhesive. Panasonic Panasonic Electronic Devices
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lot date code panasonic chip resistor humidity resistor washing machine control marking code panasonic label resistor marking code aaaj panasonic capacitor date code 151ZACT005005 151-ZA-ECT00A
Abstract: 7. Taping Specifications for Flat Packages of Toshiba BIP IC's (Reference data) Application Scope These specifications are applicable to taping finish and related m atters on flat packages of BIP IC's delivered by Toshiba Corporation. When taping is required, customers are requested to obtain the actual taping specifications and study relevant applicability. 2. Specifications 2-1). Tape shape and dimensions , either carrier tapes or adhesive tapes 3. 4. 5. 6. Standard Quantity In principle, the -
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toshiba tape and reel TA310Q1F
Abstract: Model 805M1 Accelerometer TO-5 Series Accelerometer 3-Wire Voltage Output Low-Cost, Embedded Applications , configurations; one for adhesive mounting and one for stud mounting. dimensions FEATURES ï'· ï'· ï'· ï , Study Embedded Sensing Solution Data Loggers Model 805M1 Rev C 32 Journey Ste. 150 Aliso Viejo, CA , Sensing Element Case Material Weight (grams) Mounting Piezo-Ceramic Stainless Steel 5.0 Adhesive Measurement Specialties
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805M1-GGGG 805M1-0020
Abstract: Model 805 Accelerometer TO-5 Series Accelerometer 2-Wire IEPE Interface Low-Cost, Embedded Applications Wide Bandwidth to 15kHz The Model 805 is a miniature adhesive mount IEPE accelerometer built on , offered in two configurations; one for adhesive mounting and one for stud mounting. dimensions , '· ï'· ï'· ï'· Machine Monitoring Low-Cost OEM Installation Permanent Structural Study Embedded , Steel 5.0 Adhesive or Circuit Board (M3 Stud Mounting for -01 Option) Notes ±500 10 1-8000 Measurement Specialties
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805-GGGG
Abstract: the lead frame, and the cathode end of the block is connected by a conductive adhesive to the other , ,C & D, In Free Air In the study of the thermal impedance of the various case sizes, all units , increase above the reference and the heat flow is given by the equation Rth = Î"T = Î" T Î"P Î" Q / A , compound has been added under the body of the capacitor, to simulate the adhesive used to hold the , were increased on the second board to study the effect of thermal transfer down the leads, also a AVX
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SM00M301-R
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