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"adhesive study reference"

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Abstract: solutions to long term reliability problems. FEM was used to study two different material combinations where the heat spreader/stiffener attach adhesive and thermal interface materials (TIM) were changed. Temperature cycle tests were performed on both material sets. A secondary goal of this study was to evaluate , flip-chip packages described in this study have a stiffener attached on the periphery of the substrate, and , electroless Ni/immersion Au finish. TIM Chip Heat Spreader Underfill Adhesive Substrate ... Altera
Original
datasheet

6 pages,
634.87 Kb

with or without underfill bga warpage crack flip chip cte table epoxy BGA cte cte table epoxy substrate 1806 footprint cte table flip chip substrate Altera Flip Chip BGA warpage TEXT
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Abstract: stress, E. Effect of Adhesive Material To study the effects of adhesive material on the low-k , low-k dielectric at -55oC is around 123 MPa for all cases. Therefore, this study suggested adhesive , findings of this study, which products designers could benefit from the superior power consumption and , cracking of Cu/low-k structures. Mercado et al. [3] also adopted such technique to study the flip-chip , . Using a 3-D finite element model, this study investigates the effects of various package design ... Altera
Original
datasheet

7 pages,
567.34 Kb

you ad electronics Power consumption of FCBGA cte table epoxy substrate 53RD with or without underfill Altera Flip Chip BGA warpage TEXT
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Abstract: . Manufacturers/JC-13/ G-12 and Space community members accepted EP study proposal in JEDEC 2010, San Antonio , opportunity for last time buy before product obsolete DSCC 4 3.4.1b Correct reference paragraph , microcircuits package The EP study was conducted, and addition of passive elements (capacitor) proposal , accepted EP study proposal in JEDEC 2010, San Antonio, TX Item No Paragraph to be changed in Rev J Description of changes 15 4.4 Correct reference paragraphs "H.3.4.2 to H.3.2.1.4" and ... Original
datasheet

7 pages,
50.91 Kb

Z540.3 MIL-PRF-123 C3411 astm B221 TM1011 H3213 A4937 NCSL Z540.3 MIL-PRF-38535 TEXT
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Abstract: to good compatibility with current adhesive dispensing equipment processes. Rauch (4) studied , microelectronic components. For the purpose of this study, we are concerned with the internal thermal , thermal resistance. This is the motivation of this study. The objective is then to identify the thermal , in different thermal and power conditions. In order to accurately study this problem, both FEA and , shown in Table 2 with their respective thermal conditions. Heat sink Heat spreader Adhesive down ... Altera
Original
datasheet

6 pages,
236.54 Kb

graphite thermal 1998 ansys cfd graphite thermal spreader ansys Altera Flip Chip BGA warpage TEXT
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Abstract: capability. This paper presents the results of a package design study, which employs a "package optimization approach." The package chosen for this study is the 16-lead web-DIP, class of Plastic Dual-In-Line-Package , under study. The projected configuration is also analyzed thermostructurally to examine the mechanical , resistance during temperature cycling. In addition, the study provides a new insight into this type of , targeted package were chosen for this study based on device perfor- 115 Northeast Cutoff, Box 15036 ... Allegro MicroSystems
Original
datasheet

12 pages,
172.4 Kb

C194 C151 "leadframe material" DIP leadframe materials c151 lead frame c194 shear stress C151 C194 Copper Alloy C151 TEXT
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Abstract: package design study, which employs a "package optimization approach." The package chosen for this study , simulate and analyze the expected thermal performance of the design under study. The projected , . In addition, the study provides a new insight into this type of package and new design principles , companies including our targeted package were chosen for this study based on device perfor- TM , analyzer. Although it is not the intent of this study to critique these packages, the following ... Allegro MicroSystems
Original
datasheet

12 pages,
195.18 Kb

"leadframe material" DIP 20 c151 lead frame C194 case A package conference system electronics engineering projects study of alloy leadframe materials LSI Data Book 1986 thomas shear abstract on mini ups system et 455 PACKAGE THERMAL CHARACTERIZATION TO 92 leadframe c194 shear stress c151 BERG Electronics C151 C194 Copper Alloy C151 TEXT
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Abstract: Construction s Schematic Adhesive Insulating coating and impregnated wax Ferrite bead Lead , capacitance change is ±10 % over the temperature range of Ð25 to +85 ¡C in reference to +20 ¡C ]] YD: Maximum capacitance change is +20, Ð30 % over the temperature range of Ð25 to +85 ¡C in reference to +20 , stresses beyond their specified rating, resulting burnout or glowing in the worst case. Study operation of , to occur. Study operation of the circuit. q Excessive mechanical stress may damage the components ... Original
datasheet

4 pages,
299.06 Kb

EXCEMT EXC-CMT EMI filter TEXT
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Abstract: 1.25± 0.30 4.5±0.4 0.5±0.2 1.8±0.2 Adhesive Chip capacitor Termination Design , in reference to +20 °C. s Attenuation Characteristics (Reference Data) 0 Measurement Circuit , pcs./reel Weight (mg/pc.) Reference Data 92.5 q Standard Reel Dimensions in mm (not to scale) T , measure a temperature of terminations and study solderability every type of the board, before actual use , circuit where surge or other abnormal voltage is apt to occur. Study operation of the circuit. 7. Store ... Panasonic
Original
datasheet

4 pages,
1251.06 Kb

TEXT
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Abstract: 1.8±0.2 Adhesive Chip capacitor Termination Design, Specifications are subject to change , : Maximum capacitance is ±10 % over the temperature range of ­25 °C to +85 °C in reference to +20 °C. s Attenuation Characteristics (Reference Data) 0 Measurement Circuit 10 Attenuation(dB) 20 30 40 222 , q Standard Quantity Part Number EXCCET111U EXCCET111U Embossed Taping 1000 pcs./reel Weight (mg/pc.) Reference , use in conditions other than those specified. l Please measure a temperature of terminations and study ... Panasonic
Original
datasheet

4 pages,
1299.01 Kb

EXCCET222 TEXT
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Abstract: the lead frame, and the cathode end of the block is connected by a conductive adhesive to the other , capacitor. Figure 5. Thermal Impedance Graph Case Size A,B,C & D, In Free Air In the study of the , the Mounted Chip The temperature increase above the reference and the heat flow is given by the , under the body of the capacitor, to simulate the adhesive used to hold the capacitor to the PCB. The , tracks connected to the leads of the capacitor were increased on the second board to study the effect ... AVX
Original
datasheet

10 pages,
224.94 Kb

tantalum capacitor avx ian salisbury TEXT
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