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"Dallas Semiconductor" TOP MARKING

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Abstract: Date: November 25, 1996 Subject: PRODUCT CHANGE NOTICE ­ K62502 Description: Marking Format ­ Delay Lines Description of Change: The format of the top side marking for the 8 and 14 pin , after the part number on the 8 pin Gull Wing part. See the attached page for sample marking layouts , Status: There is no change to the product other than marking, so the qualification status is unchanged , Marking New Marking G Package ­ 14 pin Gull Wing DALLAS DSXXXXG­nnn yywwRR DALLAS DSXXXX­nnn -
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dALLAS MARKING CODE K6250 dallas marking
Abstract: determined from the top side marking. The previous revision marking was "A1", and parts with the new passivation scheme will be marked as revision level "A2". The revision level marking is immediately after the -
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DS1000 DS1005 DS1000S DS1000M marking code 214 6K MARKING CODE K428 PECVD K42801
Abstract: flip chip/UCSP by its marking; the reliability of wafer-level packaged parts; and finding applicable , reliability reports, evaluation kits). The top right of the QuickView gives access to the Part Number Table , conventional marking that is common with plastic packages. The smallest UCSPs (4 bumps) have just enough space , . Page 4 of 8 Figure 4. Flip chip and UCSP marking templates. The Topmark Coding for UCSPs is , Semiconductor flip chips and UCSPs. The laser marking is very small and requires a magnifying glass to read it Maxim Integrated Products
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DS1804 DS1845 DS2431 DS2432 DS2502 maxim CODE TOP MARKING Pb95Sn5 maxim TOP MARKING philip IC marking Maxim date code DS2431 maxim assembly of code DS2401 DS2411 DS2417 DS2430A
Abstract: ). The top DS1275'sTXout uses this negative charge reservoir when it is in a marking state. The , line is at a negative level (marking). Since most asynchronous communication over an RS-232 connection typically remains in a marking state when data is not being sent, the DS1275 will not consume system power , uses the RXin line for swinging to negative levels. The RXin line must be in a marking or idle state to , 2 uA when TXout is marking . Of course, when TXout is spacing, Vdrv will draw substantially more -
OCR Scan
DS1275S DS127S marking asa r3k marking SN75154 OOS47 RS-232-C RS-232T T-75-
Abstract: -state buffers) I/O PORTS 6 4 2 0 TIBPAL16L8' C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J OR W PACKAGE (TOP , PACKAGE M SUFFIX . . . FK PACKAGE (TOP VIEW) I I I VCC 3 2 description These programmable array , ® CIRCUITS TIBPAL16R4' C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J OR W PACKAGE (TOP VIEW) TIBPAL16R4' C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE (TOP VIEW) I I CLK VCC 3 2 10 11 TIBPAL16R6' C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J OR W PACKAGE (TOP VIEW) TIBPAL16R6' C SUFFIX . Texas Instruments
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TIBPAL16L8-25C TIBPAL16R4-25C TIBPAL16R6-25C TIBPAL16R8-25C TIBPAL16L8-30M TIBPAL16R4-30M
Abstract: Voltage at 500 mA (3.3-V Option) PW (TSSOP) PACKAGE (TOP VIEW) 1 20 19 18 17 16 15 14 13 12 11 D ±2% , Thermal-Overload Protection Internal Overvoltage Protection KTP (PowerFLEXE/TO-252*) PACKAGE (TOP VIEW) TJ = 25 , resistive connection to ground and should be grounded or electrically isolated. KC (TO-220) PACKAGE (TOP VIEW) KCS (TO-220) PACKAGE (TOP VIEW) GND OUTPUT GND INPUT GND OUTPUT GND INPUT , TLV2217-33 2217-33 TOP-SIDE MARKING 2217-18 TLV2217-18 TLV2217-25 2217-25 *Complies to TO Texas Instruments
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TLV2217 SLVS067L FLEXE/TO-252 FLEX/TO-252 TLV2217-18KTPR TLV2217-18KCS
Abstract: : Traceability Marking Location Change ­ SOICs Errata Description: There is an error in PCN B71801 ­ A number , location of the lot traceability marking for certain SOICs is being changed. The abbreviated lot number brand on the "Belly" or bottom of the device is being moved to the top of the device. There will be no change to the format or interpretation to this marking. See attached pages for a complete list of all , . Qualification Status: There is no change to the product other than marking, so the qualification status is -
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DS1205U DS2501 DS1223 DS1229 DS1232N DS1272 ds1232l datasheet dallas ds1213 DS1267A dallas ds2501 Datasheet ds2501 Datasheet DS222 DS229 DS232A DS233A DS275 DS276
Abstract: generated upon release and will be held in reset output low for typically 150ms. 2 TOP VIEW SOT , device. PART MARKING CODES "A," "B," and "C" represent the device type. 810 . . . . DS1810 811 . Maxim Integrated Products
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DS1813 DS1811 DS1812 DS1815 DS1816 DS1813-5 DS1813-15 DS1813-10 DS1817
Abstract: (TOP VIEW) DGTL GND DGTL VDD COMP REF ANLG VDD1 A OUT ANLG VDD2 DGTL VDD ANLG GND 1 18 , (TOP VIEW) D0 (LSB) D1 D2 D3 D4 D5 D6 D7 (MSB) CLK DGTL GND DGTL VDD COMP REF ANLG VDD1 A OUT NC ANLG VDD2 DGTL VDD ANLG GND J PACKAGE (TOP VIEW) 20 2 19 3 18 4 , 7 14 8 13 9 12 10 11 FK PACKAGE (TOP VIEW) NC D0 (LSB) D1 D2 D3 D4 , Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking Texas Instruments
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TLC5602C TLC5602M SLAS023D MB40778 TLC5602 ISO/TS16949
Abstract: IA0 IA1 YA IB0 IB1 YB PW PACKAGE (TOP VIEW) VCC 1 16 NC S IA0 IA1 YA IB0 , YA IB0 IB1 YB GND RGY PACKAGE (TOP VIEW) S D OR DBQ PACKAGE (TOP VIEW) D 11 IC0 , reel TS5L100PW Tape and reel TS5L100PWR TOP-SIDE MARKING TG100 TS5L100 TG100 TG100 , MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TS5L100D ACTIVE , . (4) There may be additional marking, which relates to the logo, the lot trace code information, or Texas Instruments
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SCDS163A A114-B
Abstract: Switching on Data I/O Ports D, DGV, OR PW PACKAGE (TOP VIEW) 3 12 4 11 5 10 6 9 7 8 VCC 4OE 4A 4B 3OE 3A 3B VCC 13 DBQ PACKAGE (TOP VIEW) 1 1A 1B 2OE , JESD 78, Class II RGY PACKAGE (TOP VIEW) 1OE 1 D GND 1OE 1A 1B 2OE 2A 2B GND , TOP-SIDE MARKING Tape and reel SN74CBTLV3126RGYR Tube SN74CBTLV3126D Tape and reel , Marking (4/5) 74CBTLV3126DBQRE4 ACTIVE SSOP DBQ 16 74CBTLV3126DBQRG4 ACTIVE SSOP Texas Instruments
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SN74CBTLV3126 SCDS038I 126-T
Abstract: 9 VCC 4A 4Y 4Z G 3Z 3Y 3A FK PACKAGE (TOP VIEW) 1A NC VCC 4A 3 2 1 , 1A 1Y 1Z G 2Z 2Y 2A GND 3A D J OR W PACKAGE (TOP VIEW) Meets Standard EIA , . ORDERING INFORMATIONâ'¡ PACKAGE§ TA ORDERABLE PART NUMBER TOP-SIDE MARKING LCCC â'" FK , Finish (2) MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) 5962-9076503Q2A , be additional marking, which relates to the logo, the lot trace code information, or the Texas Instruments
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SN55LBC172 SGLS084C RS-485 EIA-485
Abstract: Power Consumption . . . 1.5 mA Max (Output Disabled) J OR W PACKAGE (TOP VIEW) 1A 1Y 1Z G 2Z 2Y 2A , inherent robustness. FK PACKAGE (TOP VIEW) 3 2 1 1Z G NC 2Z 2Y VCC 4A 20 19 18 4Y 17 4Z , SNJ55LBC172W TOP-SIDE MARKING SNJ55LBC172FK SNJ55LBC172J SNJ55LBC172W Package drawings, standard packing , (°C) -55 to 125 Device Marking (4/5) Samples ACTIVE TBD N / A for Pkg Type , standard classifications, and peak solder temperature. There may be additional marking, which relates to Texas Instruments
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Abstract: Input Levels and PW Packages) D, DB, DGV, OR PW PACKAGE (TOP VIEW) 3 12 4 11 5 10 , 7 8 3B 14 2 1OE 1 GND 1OE 1A 1B 2OE 2A 2B GND DBQ PACKAGE (TOP VIEW) RGY PACKAGE (TOP VIEW) 1 16 2 15 3 14 4 13 5 12 6 11 7 , INFORMATION ORDERABLE PART NUMBER PACKAGEâ'  TA QFN â' RGY TOP-SIDE MARKING Tape and reel , Device Marking (4/5) CBT3125 SN74CBT3125DBLE OBSOLETE SSOP DB 14 TBD Call TI Texas Instruments
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SN74CBT3125 SCDS021I 125-T SN74CBT3125RGYR SN74CBT3125D SN74CBT3125DR
Abstract: 1 SN54LVTH574 . . . FK PACKAGE (TOP VIEW) SN74LVTH574 . . . RGY PACKAGE (TOP VIEW) SN54LVTH574 . . . J OR W PACKAGE SN74LVTH574 . . . DB, DW, NS, OR PW PACKAGE (TOP VIEW) OE 1D 2D 3D , INFORMATION ORDERABLE PART NUMBER PACKAGEâ'  TA QFN â' RGY TOP-SIDE MARKING Tape and reel , (TOP VIEW) 1 2 3 terminal assignments 4 1 2 3 4 A A 1D OE VCC , ) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-9583201Q2A ACTIVE LCCC FK 20 Texas Instruments
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SCBS688G A114-A A115-A
Abstract: 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 SN54LVTH240 . . . FK PACKAGE (TOP VIEW) 2Y4 1A1 1OE VCC , 2Y1 GND SN74LVTH240 . . . RGY PACKAGE (TOP VIEW) 1OE SN54LVTH240 . . . J OR W PACKAGE SN74LVTH240 . . . DB, DW, NS, OR PW PACKAGE (TOP VIEW) D 2Y1 GND 2A1 1Y4 2A2 D D VCC D , TOP-SIDE MARKING Tape and reel SN74LVTH240RGYR Tube SN74LVTH240DW Tape and reel , conflict. SN74LVTH240 . . . GQN OR ZQN PACKAGE (TOP VIEW) 1 2 3 terminal assignments 4 1 Texas Instruments
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SCBS679K
Abstract: (A114-A) - 200-V Machine Model (A115-A) SN54ABT245B . . . FK PACKAGE (TOP VIEW) VCC DIR A2 A1 , MARKING A1 A2 A3 A4 A5 A6 A7 A8 2 3 4 5 6 7 8 A3 A4 A5 A6 A7 4 5 6 7 8 3 2 1 20 19 18 17 16 , , DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW) SN74ABT245B . . . RGY PACKAGE (TOP VIEW) 1 , . SN74ABT245B . . . GQN OR ZQN PACKAGE (TOP VIEW) 1 A B C D E 2 3 4 A B C D E terminal assignments 1 A1 A3 , MSL Peak Temp (3) Op Temp (°C) -55 to 125 Device Marking (4/5) Samples ACTIVE TBD Texas Instruments
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SN54ABT245A SCBS081L SN74ABT245BN SN74ABT245BRGYR SN74ABT245BDW
Abstract: 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 SN54LVTH240 . . . FK PACKAGE (TOP VIEW) 2Y4 1A1 1OE VCC , 2Y1 GND SN74LVTH240 . . . RGY PACKAGE (TOP VIEW) 1OE SN54LVTH240 . . . J OR W PACKAGE SN74LVTH240 . . . DB, DW, NS, OR PW PACKAGE (TOP VIEW) D 2Y1 GND 2A1 1Y4 2A2 D D VCC D , TOP-SIDE MARKING Tape and reel SN74LVTH240RGYR Tube SN74LVTH240DW Tape and reel , conflict. SN74LVTH240 . . . GQN OR ZQN PACKAGE (TOP VIEW) 1 2 3 terminal assignments 4 1 Texas Instruments
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Abstract: SCBS687H â' MAY 1997 â' REVISED SEPTEMBER 2003 SN74LVTH573 . . . RGY PACKAGE (TOP VIEW) 20 1 , 2D 3D 4D 5D 6D 7D 8D SN54LVTH573 . . . FK PACKAGE (TOP VIEW) 20 2D 1D OE VCC 1 , PACKAGE (TOP VIEW) 8D GND LE 8Q 7Q D D VCC D D Need for External Pullup/Pulldown , TOP-SIDE MARKING Tape and reel SOIC â' DW SN74LVTH573RGYR LXH573 Tube SN74LVTH573DW , , which prevents driver conflict. SN74LVTH573 . . . GQN OR ZQN PACKAGE (TOP VIEW) 1 2 3 Texas Instruments
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Abstract: -V Machine Model (A115-A) SN54LVTH240 . . . FK PACKAGE (TOP VIEW) 2Y4 1A1 1OE VCC 1OE 1OE 1A1 2Y4 , SN74LVTH240 . . . DB, DW, NS, OR PW PACKAGE (TOP VIEW) SN74LVTH240 . . . RGY PACKAGE (TOP VIEW) GND , parameters. POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 2Y1 GND 2A1 1Y4 2A2 TOP-SIDE MARKING 1 , , which prevents driver conflict. SN74LVTH240 . . . GQN OR ZQN PACKAGE (TOP VIEW) 1 A B C D E 2 3 4 A B C , (°C) -55 to 125 Device Marking (4/5) Samples ACTIVE TBD N / A for Pkg Type Texas Instruments
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