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"Dallas Semiconductor" TOP MARKING

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Date: November 25, 1996 Subject: PRODUCT CHANGE NOTICE ­ K62502 K62502 Description: Marking Format ­ Delay Lines Description of Change: The format of the top side marking for the 8 and 14 pin , after the part number on the 8 pin Gull Wing part. See the attached page for sample marking layouts , Status: There is no change to the product other than marking, so the qualification status is unchanged , Marking New Marking G Package ­ 14 pin Gull Wing DALLAS DSXXXXG­nnn yywwRR DALLAS DSXXXX­nnn ... Original
datasheet

2 pages,
7.63 Kb

dallas marking K6250 dALLAS MARKING CODE "Dallas Semiconductor" TOP MARKING TEXT
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Abstract: determined from the top side marking. The previous revision marking was "A1", and parts with the new passivation scheme will be marked as revision level "A2". The revision level marking is immediately after the ... Original
datasheet

2 pages,
6.89 Kb

scheme DALLAS TOP MARKING DS1000 DS1000M DS1000M-500 DS1000S DS1005 PECVD K428 dALLAS MARKING CODE 6K MARKING CODE "Dallas Semiconductor" TOP MARKING marking code 214 TEXT
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Abstract: flip chip/UCSP by its marking; the reliability of wafer-level packaged parts; and finding applicable , reliability reports, evaluation kits). The top right of the QuickView gives access to the Part Number Table , conventional marking that is common with plastic packages. The smallest UCSPs (4 bumps) have just enough space , . Page 4 of 8 Figure 4. Flip chip and UCSP marking templates. The Topmark Coding for UCSPs is , Semiconductor flip chips and UCSPs. The laser marking is very small and requires a magnifying glass to read it ... Maxim Integrated Products
Original
datasheet

8 pages,
117.02 Kb

DS2432 DS2502 DS2761 DS1845 DS1804 DS2431 "Dallas Semiconductor" TOP MARKING ANALOG DEVICES ASSEMBLY DATE CODE 0.3mm pitch csp package wlp garrou topmark national semiconductor pb-free marking dALLAS MARKING CODE maxim assembly of code Maxim date code DS2431 philip IC marking maxim TOP MARKING Pb95Sn5 maxim CODE TOP MARKING TEXT
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Abstract: ). The top DS1275 DS1275'sTXout uses this negative charge reservoir when it is in a marking state. The , line is at a negative level (marking). Since most asynchronous communication over an RS-232 RS-232 connection typically remains in a marking state when data is not being sent, the DS1275 DS1275 will not consume system power , uses the RXin line for swinging to negative levels. The RXin line must be in a marking or idle state to , 2 uA when TXout is marking . Of course, when TXout is spacing, Vdrv will draw substantially more ... OCR Scan
datasheet

7 pages,
489.13 Kb

SN75154 r3k marking DS127S marking asa DS1275S DS1275 TEXT
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Abstract: -state buffers) I/O PORTS 6 4 2 0 TIBPAL16L8 TIBPAL16L8' C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J OR W PACKAGE (TOP , PACKAGE M SUFFIX . . . FK PACKAGE (TOP VIEW) I I I VCC 3 2 description These programmable array , ® CIRCUITS TIBPAL16R4 TIBPAL16R4' C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J OR W PACKAGE (TOP VIEW) TIBPAL16R4 TIBPAL16R4' C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE (TOP VIEW) I I CLK VCC 3 2 10 11 TIBPAL16R6 TIBPAL16R6' C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J OR W PACKAGE (TOP VIEW) TIBPAL16R6 TIBPAL16R6' C SUFFIX . ... Texas Instruments
Original
datasheet

27 pages,
640.13 Kb

TIBPAL16L8-25C TIBPAL16R4-25C TIBPAL16R6-25C TIBPAL16R8-25C TIBPAL16L8-30M TIBPAL16R4-30M TIBPAL16R6-30M TIBPAL16R8-30M SRPS059A TEXT
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Abstract: Voltage at 500 mA (3.3-V Option) PW (TSSOP) PACKAGE (TOP VIEW) 1 20 19 18 17 16 15 14 13 12 11 D ±2% , Thermal-Overload Protection Internal Overvoltage Protection KTP (PowerFLEXE/TO-252*) PACKAGE (TOP VIEW) TJ = 25 , resistive connection to ground and should be grounded or electrically isolated. KC (TO-220) PACKAGE (TOP VIEW) KCS (TO-220) PACKAGE (TOP VIEW) GND OUTPUT GND INPUT GND OUTPUT GND INPUT , TLV2217-33 TLV2217-33 2217-33 TOP-SIDE MARKING 2217-18 TLV2217-18 TLV2217-18 TLV2217-25 TLV2217-25 2217-25 *Complies to TO ... Texas Instruments
Original
datasheet

16 pages,
1013.61 Kb

TLV2217 SLVS067L TEXT
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Abstract: : Traceability Marking Location Change ­ SOICs Errata Description: There is an error in PCN B71801 B71801 ­ A number , location of the lot traceability marking for certain SOICs is being changed. The abbreviated lot number brand on the "Belly" or bottom of the device is being moved to the top of the device. There will be no change to the format or interpretation to this marking. See attached pages for a complete list of all , . Qualification Status: There is no change to the product other than marking, so the qualification status is ... Original
datasheet

2 pages,
7.89 Kb

B718 DS1232N DS1205U DS1229 DS1666 PRODUCT CHANGE NOTICE DS2011D DS2013 DS2013D "Dallas Semiconductor" TOP MARKING ds1359 ds1213 dallas ds2501 DS1272 DS2501 ds2501 Datasheet dallas ds2501 Datasheet DS1267A dallas ds1213 ds1232l datasheet DS1223 TEXT
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Abstract: generated upon release and will be held in reset output low for typically 150ms. 2 TOP VIEW SOT , device. PART MARKING CODES "A," "B," and "C" represent the device type. 810 . . . . DS1810 DS1810 811 . ... Maxim Integrated Products
Original
datasheet

5 pages,
202.9 Kb

TOP marking RST 150MS DS1810 DS1811 DS1812 DS1813 DS1813-10 DS1813-15 DS1813-5 DS1815 DS1816 "Dallas Semiconductor" TOP MARKING maxim TOP MARKING TEXT
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Abstract: (TOP VIEW) DGTL GND DGTL VDD COMP REF ANLG VDD1 A OUT ANLG VDD2 DGTL VDD ANLG GND 1 18 , (TOP VIEW) D0 (LSB) D1 D2 D3 D4 D5 D6 D7 (MSB) CLK DGTL GND DGTL VDD COMP REF ANLG VDD1 A OUT NC ANLG VDD2 DGTL VDD ANLG GND J PACKAGE (TOP VIEW) 20 2 19 3 18 4 , 7 14 8 13 9 12 10 11 FK PACKAGE (TOP VIEW) NC D0 (LSB) D1 D2 D3 D4 , Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking ... Texas Instruments
Original
datasheet

15 pages,
770.62 Kb

TLC5602C TLC5602M SLAS023D TEXT
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Abstract: IA0 IA1 YA IB0 IB1 YB PW PACKAGE (TOP VIEW) VCC 1 16 NC S IA0 IA1 YA IB0 , YA IB0 IB1 YB GND RGY PACKAGE (TOP VIEW) S D OR DBQ PACKAGE (TOP VIEW) D 11 IC0 , reel TS5L100PW TS5L100PW Tape and reel TS5L100PWR TS5L100PWR TOP-SIDE MARKING TG100 TG100 TS5L100 TS5L100 TG100 TG100 TG100 TG100 , MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TS5L100D TS5L100D ACTIVE , . (4) There may be additional marking, which relates to the logo, the lot trace code information, or ... Texas Instruments
Original
datasheet

26 pages,
849.78 Kb

TS5L100 SCDS163A TEXT
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Archived Files

Abstract Saved from Date Saved File Size Type Download
DEFINITE COMPENSATING AUT BELIEVABLE ADJUST PRODUCING HIGHEST PRECISION SUPPLY GROUND TOP MEANS MEANT BAND
/datasheets/files/linear/lview3/parts-v1.edb
Linear 08/10/1998 5000.33 Kb EDB parts-v1.edb
SUPPLY GROUND TOP MEANS MEANT BAND THIS 600MV 600MV PROVIDE SHEET EMPIRICIST FASTEST OVERLOADING GENERAL
/datasheets/files/linear/lview4/parts.edb
Linear 15/02/2000 7168.02 Kb EDB parts.edb
DEFINITE COMPENSATING AUT BELIEVABLE ADJUST PRODUCING HIGHEST PRECISION SUPPLY GROUND TOP MEANS MEANT BAND
/datasheets/files/linear/lview3/parts.ebd
Linear 08/10/1998 5000.33 Kb EBD parts.ebd
DEFINITE COMPENSATING AUT BELIEVABLE ADJUST PRODUCING HIGHEST PRECISION SUPPLY GROUND TOP MEANS MEANT BAND
/datasheets/files/linear/lview3/parts.edb
Linear 21/01/1999 5379.43 Kb EDB parts.edb
No abstract text available
/datasheets/files/stmicroelectronics/st62oncd/htm/faq/st6faq.txt
STMicroelectronics 12/10/1998 255.18 Kb TXT st6faq.txt
No abstract text available
/datasheets/files/stmicroelectronics/stonline/products/support/mcu8/st6/st6faq.txt
STMicroelectronics 12/10/1998 255.18 Kb TXT st6faq.txt
No abstract text available
/download/90212243-999460ZC/dbookold.zip ()
Xilinx 07/09/1996 10340.01 Kb ZIP dbookold.zip
No abstract text available
/download/15375042-70832ZC/tini1.11.zip ()
Dallas 01/05/2003 4625.5 Kb ZIP tini1.11.zip
No abstract text available
/download/55429351-72918ZC/bsp_linux_2.6.11_board_support_package.zip ()
Digital Logic 18/06/2007 954.19 Kb ZIP bsp_linux_2.6.11_board_support_package.zip
No abstract text available
/download/49104857-995987ZC/xapp542.zip ()
Xilinx 11/11/2004 9180.01 Kb ZIP xapp542.zip