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"D J Z" LCC

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Abstract: D,T,S LCC C LDCC J DIP D,S,T LCC C LDCC J DIP K,S,T LCC C,Z LDCC J DIP D,P,S,T LCC C LDCC J DIP D,P,S,T LCC C LDCC J DIP D,T LCC C LDCC J,L DIP D,T LCC C LDCC J,L DIP D,T LCC C LDCC J,L DIP D,P,Y LCC C,Z LDCC J DIP K,S,T DIP D,P,Y LCC C,Z LDCC J , DIP D LCC C LDCC J DIP D LCC C DIP D LCC C LDCC J DIP D LCC C LDCC L,J DIP D LCC C LDCC L DIP D,P,T LCC C LDCC J,L DIP D,P,T LCC C LDCC L,J DIP D,P,T LCC C ... WaferScale Integration
Original
datasheet

3 pages,
29.34 Kb

57C49 27C210L 57C291C 57c291 57C010 57C71C 57C191B 27C010L 57C51B WSI 57C291B WSI 57C43c 57C45 57C291B 57C43B Magic*PRO III magicpro III 57C64F WSI 57C191C 57C256f 57C49B TEXT
datasheet frame
Abstract: , D4 ), S O J (J 4 ), SOIC (S 4 ) TOP VIEW See Selection Guide Page for LCC j t p M eans , -Pin 300 mil DIP, SOIC, SOJ - 24-Pin Rectangular LCC (300 x 400 mils) - 28-Pin Square LCC (450 x 450 mils , nanoseconds are available, The P4C116 P4C116 is also available in 24-pin rectangular and 28-pin square LCC , A, C 2 a2 c 3 23 c 4 J A10 22 3 a 9 21 H WE c 5 20 3 OË 5 C 6 Ag C 7 , M BIT ■ 47 . P4C116 P4C116 j * - MAXIMUM RATINGS*1 â ... OCR Scan
datasheet

7 pages,
152.87 Kb

P4C116 TEXT
datasheet frame
Abstract: . P Plastic DIP S Plastic SOIC J Plastic SOJ D Ceramic DIP L Ceramic LCC (300 x 400 mils) 24 Id , Pinout (JEDEC Approved) - 24-Pin 300 mil DIP, SOIC, SOJ - 24-Pin Rectangular LCC (300 x 400 mils) - 28-Pin Square LCC (450 x 450 mils) -DESCRIPTION The , oper ate from a single 5V±10% tolerance power supply. Cur rent drain is typically 10 |j A from a 2.0V , densities. The P4C116 P4C116 is also available In 24-pin rectangular and 28-pin square LCC packages ... OCR Scan
datasheet

7 pages,
208.79 Kb

P4C116 TEXT
datasheet frame
Abstract: Surface Mount Package Options • Ceramic DIP, 400 mils Wide, No. 101 • 28 Pad Ceramic LCC, No 76 â , Recommended DC Operating Conditions - r U j Absolute Maximum Ratings* Vollage on any pin relative to V S S , Junction Temperature, T J . 175°C Sym VIL -0.3 - , Max Unit LCC Address Lines Data Lines CSOJ, DIP Cl 6 12 PF CD/Q 8 14 , ) : I AVEL T ^ .* J . i TELEH : 7 m f TEHAX TAVEH ... OCR Scan
datasheet

6 pages,
175.59 Kb

TEXT
datasheet frame
Abstract: 8M Hz System Clock) 24J vcc 23J X1 S J X2 aT] ASYNC CSYNC [7 RDY1 READY 2Ô| EF1 t . %j>: v 19] F /C is] ose 1 7 ] RES ,« * E [T CLK50 CLK50 Q Ô START [ÎT Òn d 16 , -Lin e or 2 8 Pad Square LCC Package Options • Single 5V Power Supply . -5 5 ° C t o + , 1- 1_ L. ! . 1 4 J< L 3 J> 1 2 J* 1 l_l l_ J u s. 1 ! i2& L . J *2& > »27* R i a ! s , Î f i r i ! NC NC j j ] . \ [1 ST For static system designs, separate signals are ... OCR Scan
datasheet

2 pages,
71.85 Kb

TEXT
datasheet frame
Abstract: Approved) ­ 24-Pin 300 mil DIP, SOIC, SOJ ­ 24-Pin Solder Seal Flat Pack ­ 24-Pin Rectangular LCC (300 x 400 mils) ­ 28-Pin Square LCC (450 x 450 mils) ­ 32-Pin Rectangular LCC (450 x 550 mils) ­ 40-Pin Square LCC (480 x 480 mils) Low Power Operation Output Enable Control Function Single 5V±10% Power , SOIC packages, a solder seal flatpack and 4 different LCC packages (24, 28, 32, and 40 pin). DIP (P4, C4), SOJ (J4), SOIC (S4) SOLDER SEAL FLAT PACK (FS-1) SIMILAR LCC configurations at end of ... Pyramid Semiconductor
Original
datasheet

14 pages,
235.39 Kb

P4C116L P4C116 25L40 P4C116/P4C116L TEXT
datasheet frame
Abstract: -Pin Rectangular LCC (300 x 400 mils) – 28-Pin Square LCC (450 x 450 mils) – 32-Pin Rectangular LCC (450 x 550 mils) – 40-Pin Square LCC (480 x 480 mils) Low Power Operation Output Enable Control , LCC packages (24, 28, 32, and 40 pin). DIP (P4, C4), SOJ (J4), SOIC (S4) SOLDER SEAL FLAT PACK (FS-1) SIMILAR LCC configurations at end of datasheet 1 P4C116/P4C116L P4C116/P4C116L MAXIMUM RATINGS(1) Symbol , P4C116/P4C116L P4C116/P4C116L LCC PIN CONFIGURATIONS 24-Pin LCC (L8) 28-Pin LCC (L5-1) 32-Pin LCC (L6) 40 ... Pyramid Semiconductor
Original
datasheet

13 pages,
330.31 Kb

P4C116/P4C116L TEXT
datasheet frame
Abstract: DIP, SOIC, SOJ ­ 24-Pin Solder Seal Flat Pack ­ 24-Pin Rectangular LCC (300 x 400 mils) ­ 28-Pin Square LCC (450 x 450 mils) ­ 32-Pin Rectangular LCC (450 x 550 mils) ­ 40-Pin Square LCC (480 x 480 mils , mil DIP, SOJ and SOIC packages, a solder seal flatpack and 4 different LCC packages (24, 28, 32, and , ) SOLDER SEAL FLAT PACK (FS-1) SIMILAR LCC configurations at end of datasheet 1 P4C116/P4C116L P4C116/P4C116L , series with DOUT to match 166 (Thevenin Resistance). 6 P4C116/P4C116L P4C116/P4C116L LCC PIN CONFIGURATIONS ... Pyramid Semiconductor
Original
datasheet

13 pages,
274.58 Kb

P4C116/P4C116L P4C116 TEXT
datasheet frame
Abstract: resistance from junction to case is denoted by JC , and defined by JC = ( T j ­ T c ) / P d ; here, T c , temperature and maximum power dissipation can be calculated using the same equation in different forms: T j , operation. P d = ( T j ­ T a ) / JA . Values for JA are available for most packages. However, JC and , denoted by JA , and defined by JA = ( T j ­ T a ) / P d , where: · T j is the junction temperature of , JLDCC 68 46/38/32 36/27/19 35/26/20 JLDCC 84 47/37/32 33/26/22 30/26/18 LCC 28 ... Original
datasheet

6 pages,
31.1 Kb

TQFP 132 PACKAGE Package 48 LCC CQFP 240 PQFP-128 MQUAD CPGA tqfp 64 thermal resistance tqfp 44 thermal resistance TEXT
datasheet frame
Abstract: ?B78B; 37I> J?=>J 7D: , LEBJe` >SWLV2 0>; C7Ne 7BBEM78B 7BBEM78B; LEBJ7=; ?D J>; u+{} vs0s ?I 9E?B EL;H:H?L; LEBJ7=;c ?J ?I J>; ?DIJ7DJ7D;EKI C7Ne LEBJ7=; M>?9> J>; H;B7O 9E?B 9EKB: ;D:KH; ?D 7 L;HO I>EHJ J?C;e oCI C7Ne 0;CF , ] .z sC8?;DJ J;CF;H7JKH; dkg JE ol 0;HC?D7J?ED ,ut 1D?J M;?=>J sFFHENe hjel= uEDIJHK9J?ED 37I> J?=>Jc xBKN FHEESWLV2 h` 0>; :7J7 I>EMD 78EL; 7H; ?D?J?7B L7BK;Ie i` a {D:;N ?I ... Original
datasheet

3 pages,
54.37 Kb

A67A C7NE TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
of the "J" indicates the type of packaging used in the product. The table below lists all the ) FQ Plastic Low Profile Quad Flatpack (LQFP) 48-Pin LQFP (FQ, FQP) J Ceramic Dual-in-Line (300 & 600 mil widths) 8-Pin Ceramic DIP (J) 14-Pin Ceramic DIP (J) 16-Pin Ceramic DIP (J) 18-Pin Ceramic DIP (J) 20-Pin Ceramic DIP (J) 24-Pin Ceramic DIP (J) 28-Pin Ceramic DIP (J) L Ceramic
/datasheets/files/texas-instruments/data/wwwti~1.com/toc_fi~1/unitrode.htm
Texas Instruments 20/01/2000 16.16 Kb HTM unitrode.htm
location of the "J" indicates the type of packaging used in the product. The table below lists all the LQFP (FQ, FQP) J Ceramic Dual-in-Line (300 & 600 mil widths) 8-Pin Ceramic DIP (J) 14-Pin Ceramic DIP (J) 16-Pin Ceramic DIP (J) 18-Pin Ceramic DIP (J) 20-Pin Ceramic DIP (J) 24-Pin Ceramic DIP (J) 28-Pin Ceramic DIP (J) L Ceramic
/datasheets/files/unitrode/catalog/package/packindx.htm
Unitrode 30/06/1998 14.39 Kb HTM packindx.htm
of the "J" indicates the type of packaging used in the product. The table below lists all the ) FQ Plastic Low Profile Quad Flatpack (LQFP) 48-Pin LQFP (FQ, FQP) J Ceramic Dual-in-Line (300 & 600 mil widths) 8-Pin Ceramic DIP (J) 14-Pin Ceramic DIP (J) 16-Pin Ceramic DIP (J) 18-Pin Ceramic DIP (J) 20-Pin Ceramic DIP (J) 24-Pin Ceramic DIP (J) 28-Pin Ceramic DIP (J) L Ceramic
/datasheets/files/texas-instruments/data/www.ti.com/toc_files/unitrode.htm
Texas Instruments 21/01/2000 16.16 Kb HTM unitrode.htm
P DISS Power Dissipation 150 W T J Junction Temperature +200 5 C T STG Storage Temperature - 65 to - 80pF Arco 405 Trimmer Capacitor C8, C11 : 1 m F LCC Chip Capacitor C9 : 100 m F 63V Electrolytic C12 : 10mF LCC CPM13B CPM13B L1 : 1 1/2 Turns, 0.7mm Enameled Wire 4.5mm I.D. L2 : 21mm 50 W Line L3 : Length COLLECTOR LOAD IMPEDANCE Z CL Z IN IMPEDANCE DATA Z IN Z CL FREQ. Z IN ( W ) Z CL ( W ) 170 MHz 0.6 + j 0.7 5.9 + j 3.5 200 MHz 0.55 + j 0.8 5.0 + j 3.0 230 MHz 0.5 + j 0.9 4.2 + j 2.8 SD1459 SD1459 4/5 PACKAGE
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/2811-v1.htm
STMicroelectronics 02/04/1999 4.59 Kb HTM 2811-v1.htm
Emitter-Base Voltage 4.0 V I C Device Current 16 A P DISS Power Dissipation 150 W T J Junction : 24 - 200pF Arco 425 Trimmer Capacitor C7 : 10 - 80pF Arco 405 Trimmer Capacitor C8, C11 : 1 m F LCC Chip Capacitor C9 : 100 m F 63V Electrolytic C12 : 10mF LCC CPM13B CPM13B L1 : 1 1/2 Turns, 0.7mm Enameled DATA Z IN Z CL FREQ. Z IN ( W ) Z CL ( W ) 170 MHz 0.6 + j 0.7 5.9 + j 3.5 200 MHz 0.55 + j 0.8 5.0 + j 3.0 230 MHz 0.5 + j 0.9 4.2 + j 2.8 SD1459 SD1459 4/5 PACKAGE MECHANICAL DATA Ref.
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/2811-v3.htm
STMicroelectronics 25/05/2000 6.39 Kb HTM 2811-v3.htm
P DISS Power Dissipation 150 W T J Junction Temperature +200 5 C T STG Storage Temperature - 65 to - 80pF Arco 405 Trimmer Capacitor C8, C11 : 1 m F LCC Chip Capacitor C9 : 100 m F 63V Electrolytic C12 : 10mF LCC CPM13B CPM13B L1 : 1 1/2 Turns, 0.7mm Enameled Wire 4.5mm I.D. L2 : 21mm 50 W Line L3 : Length COLLECTOR LOAD IMPEDANCE Z CL Z IN IMPEDANCE DATA Z IN Z CL FREQ. Z IN ( W ) Z CL ( W ) 170 MHz 0.6 + j 0.7 5.9 + j 3.5 200 MHz 0.55 + j 0.8 5.0 + j 3.0 230 MHz 0.5 + j 0.9 4.2 + j 2.8 SD1459 SD1459 4/5 PACKAGE
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/2811-v2.htm
STMicroelectronics 14/06/1999 4.55 Kb HTM 2811-v2.htm
Current 16 A P DISS Power Dissipation 150 W T J Junction Temperature +200 5 C T STG Storage Temperature - - 80pF Arco 405 Trimmer Capacitor C8, C11 : 1 m F LCC Chip Capacitor C9 : 100 m F 63V Electrolytic C12 : 10mF LCC CPM13B CPM13B L1 : 1 1/2 Turns, 0.7mm Enameled Wire 4.5mm I.D. L2 : 21mm 50 W Line L3 : Length COLLECTOR LOAD IMPEDANCE Z CL Z IN IMPEDANCE DATA Z IN Z CL FREQ. Z IN ( W ) Z CL ( W ) 170 MHz 0.6 + j 0.7 5.9 + j 3.5 200 MHz 0.55 + j 0.8 5.0 + j 3.0 230 MHz 0.5 + j 0.9 4.2 + j 2.8 SD1459 SD1459 4/5 PACKAGE
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/2811.htm
STMicroelectronics 20/10/2000 6.65 Kb HTM 2811.htm
) J CERDIP Dual-In-Line K SOT (8 Leads) L LCC (Leadless Ceramic F 22, 256 G 24 H 44 I 28 J 32 K 5, 68 L 40 M 7
/datasheets/files/maxim/0000/numsys.htm
Maxim 04/04/2001 18.51 Kb HTM numsys.htm
No abstract text available
/datasheets/files/duracell/data/d357hs.dsc
Duracell 01/12/1997 99.3 Kb DSC d357hs.dsc
National Semiconductor, The Sight And Sound Of Information, Welcomes You Package Name Package Codes Metal Leaded Chip Carrier, J Bend AA MQUAD AW, MO MicroSMD Leadless Chip Carrier (LCC) EA, E Leaded Hermetic Quad Packages EL HA, H CDIP JA, J Metal Can, Steel TO-3 KA, K, KC, KS
/datasheets/files/national/packageids.html
National 25/09/2003 14.45 Kb HTML packageids.html