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"Chip card module"

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Abstract: CHIP CARD MODULES Contactless Chip Card Module Specification MOA2 Product Specification , Product Specification Revision 3.0 Contactless Chip Card Module Specification ­ MOA2 Contents 1 , .3 1.1 1.2 2 Definition of a Chip Card Module. 3 Use of the Chip Card Module , Contactless Chip Card Module Specification ­ MOA2 1 GENERAL INFORMATION 1.1 Definition of a Chip Card Philips Semiconductors
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MOA2 SOT500AA1 transponder chip philips pllmc SNW-FQ-611 INCOMING MATERIAL INSPECTION procedure SCA74
Abstract: of the Infineon CoM design is the independence of Chip/Module combinations and card antennas. The target is that customers can use different Chip/Module combinations from Infineon with a single card , Product Brief Coil on Module (CoM) â'" Infineonâ'™s Innovative Chip Package Technology Major , between the card antenna and the module. It improves the robustness of dual interface (DIF) payment , antennas, one on the module and one on the inlay in the card. These antennas connect electromagnetically Infineon Technologies
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Abstract: , Contactless Chip Card Module Specification,. This contains information independent of the IC. · , Specification Product Delivery Option Descriptions General Wafer Specification Contact Chip Card Module Specification ADDENDUM Product 1 ADDENDUM Product 1 Contact Chip Card Module Specification Wafer , Contactless Chip Card Module Specification Dual Interface Chip Card Module Specification ADDENDUM Product 1 Contactless Chip Card Module Specification ADDENDUM Product 1 Dual Interface Chip Card Philips Semiconductors
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General Wafer Specification contactless mifare card chip card mifare smart card smart card -contactless
Abstract: thermo-mechanical integrity of the solder interconnections between the chip carrier module and the organic , between the PowerPC 970 module and the G5 system processor card. The G5 system uses an aggressive power , between the PowerPC 970 module and G5 system processor card, improving the mechanical integrity of the , thermo-mechanical integrity of the interconnections between the processor module and the processor card. The , ) interconnections (Fig. 1.1). The BGA module is soldered to an organic processor card at Apple's manufacturing -
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BGA heatsink compressive force BGA Solder Ball compressive force MULTIPLE EFFECT EVAPORATOR PowerPC 970 original Coffin-Manson Equation bga thermal cycling reliability
Abstract: production of high-quality contactless chip cards for the card manufacturer. The MCC2 module allows the , 's thinnest wire-bond IC package for contactless chip cards With a maximum module thickness of 330 um and , offers chip card manufacturers free choice of card technology. The package supplied as endless tape can , connection technologies and common antenna types in contactless chip cards. The module allows a lamination , contactless chip cards equaling about three times the thickness of a hair. Our module is optimized for the Siemens
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MCC2 Package MCC2 Package siemens Siemens Semiconductors INLAY MODULE ANTENNA CARDS MCC1 MCC2 D-81617
Abstract: Product Overview Security & Chip Card ICs Enter the World of SECURE SOLUTIONS Chi incl. p C , telephone card applications will offer both versatility and convenience. Infineon Technologies' new chip , MultiMediaCardTM p. 22 s Chip Card IC Pull-Out p. 23 numerous sectors. It will be used in areas as , Infineon security and chip card IC tional security certifications. The first to present , , unique needs and situation and finds chip and card producer can be checked Today's chipcard readers Infineon Technologies
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automatic toll tax project SLE 4404 SLE7736 SLF9000 SAM module mifare SLE 6636 C B191-H7516-G7-X-7600
Abstract: Using the E5 PCMCIA HostSide Interface with Intersil PRISM 802.11 Chip Set July 2001 AN-41 Abstract This document provides a technical overview of Triscend's PCMCIA host-side CSL module and the PRISM 802.11 chip set. The document describes a reference design for interfacing Triscend's E5 CSoC to the PRISM 802.11 chip set using the PCMCIA CSL module. The document assumes that the designer is , PCMCIA card is inserted. The application ignores the PCMCIA module until a card is inserted. Once a Triscend
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PCA15 PCMCIA 802.11 PC card APP500-0041-001 Intersil prism 802.11 TRISCEND GNDIOIS16 04-JUL-2001 23-JUL-2001
Abstract: low melting point eutectic Sn-Pb solder. As a result, during module rework from a card, only the , the columns attached to the module. In contrast, for wire CCGA modules, both the substrate and card side fillets melt during module rework, and a large number of columns are left on the card. mold , a vast majority of the columns stay attached to the module during card assembly rework. This doped , Placement | Reflow | Wash A new module is joined to the card rework site after site dress. The -
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67F4333 APD-SCC-201 LGA voiding CCGA IBM ccga ceramic rework F52977
Abstract: . An additional interrupt capability of the I/O module allows parallel operation of chip card and , Security & Chip Card ICs SLE 66C80S 16-bit Security Controller in 0.6 um CMOS Technology 32 , , Security & Chip Card ICs, Tel : +49 89 234-80000 Fax +49 89 234-81000 E-Mail , -bit arithmetic · Additional powerful instructions optimized for chip card applications · Dedicated , DFA) · CRC - Module · Non standard dedicated Smart Card CPU - Core Supported Standards · ISO Infineon Technologies
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GSM module Interface with 8051 D-81541
Abstract: Security & Chip Card ICs SLE 66CL160S 16-Bit High Security Dual Interface Controller in 0.6 um , : Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Tel +49 - (0)89 234-80000 Fax +49 , chip card and terminal. To minimize the overall power consumption, the chip card controller can be set , 66CL160S fulfils the requirements for both contact-based and contactless chip card applications , standard 8051 processor Enhanced 16-bit arithmetic Additional powerful instructions optimized for chip Infineon Technologies
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8051 opcode proximity card Triple DES circuits 112-B 163-B SLE66CL160S
Abstract: CHIP CARD MODULES DATA SHEET ADDENDUM SL2 MOS20 Contactless Chip Card Module Specification , Specification Revision 3.0 2003 April 15 Contactless Chip Card Module CONTENTS 1 2 2.1 2.2 2.3 2.4 3 4 5 6 7 , Philips Semiconductors Product Specification Revision 3.0 2003 April 15 Contactless Chip Card Module , Revision 3.0 2003 April 15 Contactless Chip Card Module 2 2.1 SPECIFICATIONS Chip SL2 MOS20 , : refer to "Contactless Chip Card Module Specification" Notes 1. Stresses above those listed under Philips Semiconductors
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MOS2001DV ICS2001
Abstract: capability of the I/O module allows parallel operation of chip card and terminal. To minimize the overall power consumption, the chip card controller can be set into sleep mode. The random number generator (RNG , Security & Chip Card ICs SLE 66CL160S 16-Bit High Security Dual Interface Controller in 0.6 um , Munich, Germany, Security & Chip Card ICs, Tel +49 - (0)89 234-80000 Fax +49 - (0)89 234-81000 E-Mail , -bit arithmetic Additional powerful instructions optimized for chip card applications Dedicated, non-standard Infineon Technologies
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Abstract: publication date) PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 2.2. 2 CERAMIC LEADLESS CHIP , ) 2 2.2.2. PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 32 Ceramic Leadless Chip Carrier , 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND , INTEL CONFIDENTIAL (until publication date) PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 2.1 Intel
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Intel 1702 eprom 231369 Intel 2164 CERAMIC PIN GRID ARRAY CPGA lead frame 64 CERAMIC LEADLESS CHIP CARRIER LCC QFP 64 Cavity package
Abstract: Security & Chip Card ICs SLE 11C001S 16-bit Security Controller with 32-Kbyte ROM, 1280 bytes , : Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Tel +49 - (0)89 234-80000 Fax +49 , instructions optimized for chip card applications · Dedicated, non-standard architecture with execution time , minimize the overall power consumption, the chip card controller IC offers a sleep mode. As an important , 11C001S fulfills the requirements of many chip card applications, and is especially well suited for use Infineon Technologies
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SLE11C001S 66C160S 8051 instruction opcode 8051
Abstract: -Bit-CRC). An additional interrupt capability of the I/O module allows parallel operation of chip card and terminal. To minimize the overall power consumption, the chip card controller IC offers a sleep mode. As , Security & Chip Card ICs SLE 66CX160S 16-bit Security Controller in 0.6 um CMOS Technology 32 , : Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Tel : +49 89 234-80000 Fax +49 , Enhanced 16-bit arithmetic · Additional powerful instructions optimized for chip card applications · Infineon Technologies
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SMART Modular Technologies 66CX160SU
Abstract: module allows parallel operation of chip card and terminal. To minimize the overall power consumption , Security & Chip Card ICs SLE 66C20S 16-bit Security Controller in 0.6 um CMOS Technology 32 , , Security & Chip Card ICs, Tel : +49 89 234-80000 Fax +49 89 234-81000 E-Mail , -bit arithmetic · Additional powerful instructions optimized for chip card applications · Dedicated , ) · CRC - Module · Non standard dedicated Smart Card CPU ­ Core Supported Standards · ISO/IEC Infineon Technologies
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sim card controller ic
Abstract: antenna for different Chip/Module combinations Â"Â" High robustness, reliability and yield in card , operating system (Java Card 2.2.1), GlobalPlatform 2.1.1 compliant Â"Â" The latest VSDC and/or M/Chip , solution for Dual Interface Infineonâ'™s Coil on Module (CoM) technology for Dual Interface card , Card 2.2.1 Yes Yes Yes GlobalPlatform 2.1.1 Yes Yes Yes Package Flip Chip 6 , expertise to develop a family of advanced Java Card based payment solutions optimized for the EMV US Market Infineon Technologies
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Abstract: Security & Chip Card ICs SLE 66C160S 16-bit Security Controller in 0.6 um CMOS Technology 32 , , Germany, Security & Chip Card ICs, Tel : +49 89 234-80000 Fax +49 89 234-81000 E-Mail , -bit arithmetic · Additional powerful instructions optimized for chip card applications · Dedicated , (differential fault analysis ­ DFA) · CRC ­ Module · Non standard dedicated Smart Card CPU ­ Core , parallel operation of chip card and terminal. To minimize the overall power consumption, the chip card Infineon Technologies
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66C160SU
Abstract: . An additional interrupt capability of the I/O module allows parallel operation of chip card and terminal. To minimize the overall power consumption, the chip card controller can be set into sleep mode , Security & Chip Card ICs SLE 66CL160S Dual Interface 16-bit Security Controller with 32 , : Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Phone +49 89 234 - 80000 Fax +49 , Enhanced 16-bit arithmetic Additional powerful instructions optimized for chip card applications Infineon Technologies
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8051 programming in c and interface
Abstract: Security & Chip Card ICs SLE 22C05S 16-bit Security Controller with 8-Kbytes ROM, 128 Bytes RAM , : Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Tel +49 - (0)89 234-80000 Fax +49 , Enhanced 16-bit arithmetic Additional powerful instructions optimized for chip card applications , consumption, the chip card controller IC offers a sleep mode. Voltage Clock Reset 16-Bit CPU & ECO , requirements for all chip card applications, like loyalty, Metering, Membership Cards etc. The SLE 22C05S is a Infineon Technologies
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512-B
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