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"Chip card module"

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Abstract: CHIP CARD MODULES Contactless Chip Card Module Specification MOA2 Product Specification , Product Specification Revision 3.0 Contactless Chip Card Module Specification ­ MOA2 Contents 1 , .3 1.1 1.2 2 Definition of a Chip Card Module. 3 Use of the Chip Card Module , Contactless Chip Card Module Specification ­ MOA2 1 GENERAL INFORMATION 1.1 Definition of a Chip Card ... Philips Semiconductors
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datasheet

15 pages,
1162.99 Kb

PLLMC-05 contactless Functional Specification INCOMING MATERIAL INSPECTION procedure "Chip card module" SNW-FQ-611 pllmc transponder chip philips SOT500AA1 MOA2 TEXT
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Abstract: of the Infineon CoM design is the independence of Chip/Module combinations and card antennas. The target is that customers can use different Chip/Module combinations from Infineon with a single card , Product Brief Coil on Module (CoM) – Infineon’s Innovative Chip Package Technology Major , between the card antenna and the module. It improves the robustness of dual interface (DIF) payment , antennas, one on the module and one on the inlay in the card. These antennas connect electromagnetically ... Infineon Technologies
Original
datasheet

2 pages,
869.92 Kb

TEXT
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Abstract: , Contactless Chip Card Module Specification,. This contains information independent of the IC. · , Specification Product Delivery Option Descriptions General Wafer Specification Contact Chip Card Module Specification ADDENDUM Product 1 ADDENDUM Product 1 Contact Chip Card Module Specification Wafer , Contactless Chip Card Module Specification Dual Interface Chip Card Module Specification ADDENDUM Product 1 Contactless Chip Card Module Specification ADDENDUM Product 1 Dual Interface Chip Card ... Philips Semiconductors
Original
datasheet

1 pages,
68.75 Kb

smart card -contactless mifare smart card chip card "Chip card module" mifare card contactless General Wafer Specification TEXT
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Abstract: thermo-mechanical integrity of the solder interconnections between the chip carrier module and the organic , between the PowerPC 970 module and the G5 system processor card. The G5 system uses an aggressive power , between the PowerPC 970 module and G5 system processor card, improving the mechanical integrity of the , thermo-mechanical integrity of the interconnections between the processor module and the processor card. The , ) interconnections (Fig. 1.1). The BGA module is soldered to an organic processor card at Apple's manufacturing ... Original
datasheet

6 pages,
445.1 Kb

underfill SMT 100C reflow temperature bga underfill bga thermal cycling reliability original Coffin-Manson Equation PowerPC 970 MULTIPLE EFFECT EVAPORATOR BGA Solder Ball compressive force BGA heatsink compressive force TEXT
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Abstract: production of high-quality contactless chip cards for the card manufacturer. The MCC2 module allows the , 's thinnest wire-bond IC package for contactless chip cards With a maximum module thickness of 330 um and , offers chip card manufacturers free choice of card technology. The package supplied as endless tape can , connection technologies and common antenna types in contactless chip cards. The module allows a lamination , contactless chip cards equaling about three times the thickness of a hair. Our module is optimized for the ... Siemens
Original
datasheet

2 pages,
7.99 Kb

semiconductors MCC2 MCC1 INLAY MODULE ANTENNA CARDS contactless Siemens Semiconductors MCC2 Package siemens MCC2 Package TEXT
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Abstract: Product Overview Security & Chip Card ICs Enter the World of SECURE SOLUTIONS Chi incl. p C , telephone card applications will offer both versatility and convenience. Infineon Technologies' new chip , MultiMediaCardTM p. 22 s Chip Card IC Pull-Out p. 23 numerous sectors. It will be used in areas as , Infineon security and chip card IC tional security certifications. The first to present , , unique needs and situation and finds chip and card producer can be checked Today's chipcard readers ... Infineon Technologies
Original
datasheet

24 pages,
636.49 Kb

gsm coding for 8051 microcontroller automatic teller machine MCC2 Package siemens MIFARE SAM 44CxxS proton world trusted platform module logic circuit SRF55V10S SAMPLE CODE FOR MIFARE PLUS srf55v10 SLE 6636 Eurochip SLE 6636 C SAM module mifare SLF9000 SLE7736 SLE 4404 automatic toll tax project TEXT
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Abstract: Using the E5 PCMCIA HostSide Interface with Intersil PRISM 802.11 Chip Set July 2001 AN-41 AN-41 Abstract This document provides a technical overview of Triscend's PCMCIA host-side CSL module and the PRISM 802.11 chip set. The document describes a reference design for interfacing Triscend's E5 CSoC to the PRISM 802.11 chip set using the PCMCIA CSL module. The document assumes that the designer is , PCMCIA card is inserted. The application ignores the PCMCIA module until a card is inserted. Once a ... Triscend
Original
datasheet

9 pages,
83.44 Kb

TRISCEND Intersil prism 802.11 APP500-0041-001 AN-41 PCMCIA 802.11 PC card PCA15 TEXT
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Abstract: low melting point eutectic Sn-Pb solder. As a result, during module rework from a card, only the , the columns attached to the module. In contrast, for wire CCGA modules, both the substrate and card side fillets melt during module rework, and a large number of columns are left on the card. mold , a vast majority of the columns stay attached to the module during card assembly rework. This doped , Placement | Reflow | Wash A new module is joined to the card rework site after site dress. The ... Original
datasheet

7 pages,
4624.42 Kb

solder joint 810E ccga IBM cte table epoxy cte table flip chip substrate N100 IBM supports ccga ceramic rework IBM ccga 67F4333 APD-SCC-201 CCGA LGA voiding TEXT
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Abstract: . An additional interrupt capability of the I/O module allows parallel operation of chip card and , Security & Chip Card ICs SLE 66C80S 66C80S 16-bit Security Controller in 0.6 um CMOS Technology 32 , , Security & Chip Card ICs, Tel : +49 89 234-80000 Fax +49 89 234-81000 E-Mail , -bit arithmetic · Additional powerful instructions optimized for chip card applications · Dedicated , DFA) · CRC - Module · Non standard dedicated Smart Card CPU - Core Supported Standards · ISO ... Infineon Technologies
Original
datasheet

6 pages,
30.71 Kb

66C80S GSM module Interface with 8051 TEXT
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Abstract: Security & Chip Card ICs SLE 66CL160S 66CL160S 16-Bit High Security Dual Interface Controller in 0.6 um , : Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Tel +49 - (0)89 234-80000 Fax +49 , chip card and terminal. To minimize the overall power consumption, the chip card controller can be set , 66CL160S 66CL160S fulfils the requirements for both contact-based and contactless chip card applications , standard 8051 processor Enhanced 16-bit arithmetic Additional powerful instructions optimized for chip ... Infineon Technologies
Original
datasheet

8 pages,
210.73 Kb

Triple DES circuits proximity card 8051 opcode GSM module Interface with 8051 66CL160S TEXT
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