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Catalog Datasheet | MFG & Type | Document Tags |

Abstract: (OFC) and a twisted balanced geometry with an aluminium mylar screening foil in a compact figure 8 , size Available 1.0m pair Protective PVC Outer Jacket Twisted Balanced Geometry 99.999% Oxygen , dielectric and 99.999% Oxygen Free Copper (OFC). The twisted balanced geometry provides excellent immunity , Dielectric Twisted Balanced Geometry Precision Audio Interconnects PA G E 7 QUNEX 4S In our , 99.999% Oxygen Free Copper (SPOFC) twisted in a quad balanced format. This geometry, together with a ... | QED Audio Products Original |
7 pages, |
medical copper alloy SR75 medical ultra micro coaxial cable QED QUNEX SILVER SPIRAL TEXT |

Abstract: different core geometry, depending on the data changed in the Transformer screen. This geometry change may , . Therefore, it is best to "lock down" the core geometry (Figure 7). Figure 4, The Transformer design , the Transformer screen. Figure 7 , You can lock a particular core geometry in order to experiment , the "Lock Geometry" option is checked. Since we have changed the core geometry, we must first check , the residual flux of the core material. Throughout the off-time of the transistor, inductor current ... | Intusoft Original |
6 pages, |
transformer core optimization 5V DC planar transformer Forward Transformer Design planar transformer pcb pulse "CORE geometry" qn222 pulse transformer calculation LT1243 MP58121 ELECTRICAL CALCULATION FOR TRANSFORMER spice TRANSFORMER simulation spice model of power TRANSFORMER qn2222- qn2222 QN2222A TEXT |

Abstract: Overview Although the processor dissipates the maximum amount of heat of the Core Logic components , required for cooling the Core logic components. The recommended low-cost solution in the ATX and micro-ATX , the Core Logic components. 4 Thermal Requirements The primary function of the Low Profile Fan Duct is to cool the Core Logic components while not negatively impacting the cooling of the remainder , Core Logic components. The primary requirement of the Low Profile Fan Duct is that the thermal ... | Intel Original |
4 pages, |
c2800 transistor siemens sirius 3r iso 11469 intel fan QMFZ2 ABS plastics TEXT |

Abstract: telcom-like geometry makes them compatible with many fiber based components like fiber gratings and combiners , · High brightness single mode core High birefringence (Yb1200-6/125DC-PM) High cladding absorption Low photodarkening Telcom-like geometry Good spliceability to HI1060 HI1060 single mode fibers (Yb1200 6/125DC 6/125DC) and , 0.6 Â± 0.2 0.15 Â± 0.01 0.15 Â± 0.01 Core Numerical Aperture Birefringence > 2.0E-04 0E-04 Geometrical and Mechanical Core Concentricity Error Âum < 1.0 < 1.0 Cladding Diameter ... | nLight Original |
2 pages, |
TEXT |

Abstract: . Their telcom-like geometry makes them compatible with low-cost pump diodes and standard single mode , short application lengths Low nonlinear effects Low photodarkening Telcom-like geometry Good , Core Absorption at 976 nm (nominal) Cladding Absorption at 920 nm Âum 4.4 Â± 0.8 dB/m (1200) dB/m (280) Core Numerical Aperture (nominal) 0.2 Cut-off Wavelength Geometrical and Mechanical nm 1010 Â± 70 Core Concentricity Error Âum < 0.7 Cladding Diameter ... | nLight Original |
2 pages, |
TEXT |

Abstract: core type. 317 is for coated and 318 for uncoated ring cores. The six digits following thereafter encode the geometry (dimensions) of the core whereas the ferrite material is described by the last three digits. Core type number and material codes can be found in table 1, the geometry code in table 3. For example a coated core with geometry R10/6/4 R10/6/4 of material grade K6000 K6000 can be ordered with code 317 100 604 , 1.0 4 7 10 30 Typennummer (siehe Abschnitt Bestellnummern)/core type number (see section ... | Kaschke Components Original |
4 pages, |
K8000 k1000 K15000 K4000 Kaschke 15/00 K12000 K5500 K10000 K6000 BR 8050 kaschke CORES kaschke ferrite material kaschke Transformer kaschke Transformer kaschke 15/00 kaschke ferrite material K6000 Transformer kaschke 063 TEXT |

Abstract: Geometry 30M Polygons/s 37M Polygons/s Power Consumption (est.) Core Size 6-7 mm2 (excluding , MIPS64 MIPS64 20Kc Processor Core TM Breakthrough 64-bit Performance for Revolutionary SOC Designs The drop-in MIPS64 MIPS64 20KcTM processor core delivers unprecedented integer, floating-point, and 3D , INNOVATION The exceptional integer and floating-point performance of the MIPS64 MIPS64 20Kc core greatly , technologies. · The MIPS-3DTM enhanced floating-point unit achieves 3D geometry processing performance of 37 ... | MIPS Technologies Original |
2 pages, |
R20K prefetch "data history table" MIPS32 IEEE754 TSMC 0.18um MIPS64 MIPS Technologies MIPS64 20Kc TEXT |

Abstract: · Good beam quality through low numerical aperture core Good efficiency Suitable for both 980 nm and 1480 nm pumping Pump combiner available for the 20/125 geometry Applications ï· ï· ï· ï , 40 Â± 3 Core Numerical Aperture (nominal) Geometrical and Mechanical Core Diameter Core , Geometry Âum Octagonal Octagonal Coating Diameter Âum 245 Â± 15 350 Â± 15 Low Index ... | nLight Original |
2 pages, |
TEXT |

Abstract: combination of high cladding absorption and single mode core makes them ideal for compact fiber based power , · ï· ï· ï· ï· ï· ï· High brightness single mode core High pump absorption Large, low NA core Low non-linear effects High birefringence (Yb1200-10/125DC-PM) Highly polarized output for frequency conversion (Yb120010/125DC-PM) Low photodarkening Telcom-like geometry Multimode , Â± 0.4 1.8 Â± 0.4 0.08 Â± 0.01 0.08 Â± 0.01 Core Numerical Aperture Birefringence ... | nLight Original |
2 pages, |
TEXT |

Abstract: Time-to-Market Easy Core Integration into LatticeECP2 and LatticeXP2TM FPGAs Field-Proven IP , Core from Third Parties Applications Include: · Industrial and automated control · Automotive , controller. UltiEBB 2D Graphics Accelerator Advanced BITBLT core providing ROP and alpha blending operations. UltiVIDIN Video Input Advanced video input/frame grabber core. UltiADDA FPGA based A , SPI slave core providing AMBA bus access to external host. UltiI2C_M I2C master controller ... | Lattice Semiconductor Original |
2 pages, |
bt.656 to RGB LCD display M25P32 AMBA APB spi monochromatic lcd ITU656 3.2 tft color touch lcd display module tft 800x480 amba bus architecture lcd alpha Flat Panel Display Controller cvbs video frame grabber spi controller with apb interface lcd color graphic LCD screen installation diagram of ip camera TEXT |

Abstract | Saved from | Date Saved | File Size | Type | Download |

the selections of core geometry, ferrite material, and flux density. The effects of power losses
/datasheets/files/texas-instruments/data/wwwti~1.com/sc/docs/psheets/abstract/apps/slua053.htm |
Texas Instruments | 18/01/2000 | 7.4 Kb | HTM | slua053.htm |

the selections of core geometry, ferrite material, and flux density. The effects of power losses
/datasheets/files/texas-instruments/data/www.ti.com/sc/docs/psheets/abstract/apps/slua053.htm |
Texas Instruments | 19/01/2000 | 7.4 Kb | HTM | slua053.htm |

sheets for each core geometry. * Notice that only the geometric values change once a material is * Library of magnetic core model parameters * Copyright OrCAD * each core. *- * * The with 20 turns *|K1 L1 .9999 K528T500 K528T500_3C8 ; Ferroxcube torroid core *|.model K528T500 K528T500_3C8 CORE K3B7 CORE(Ms=364.8K A=45.01 C=.396 K=26.98) *$ .model K3B9 CORE(Ms=341.3K A=44.36 C=.3054 K=38
/datasheets/files/spicemodels/misc/spice_model_cd/mixed part list/spice-models-collection/magnetic.lib |
Spice Models | 29/07/2012 | 9.93 Kb | LIB | magnetic.lib |

Hipot Secondary to Any Other Winding 1500V for 1sec Core Geometry EFD20 EFD20 Core Material High-frequency ferrite of Dcl allows for the recycling of the energy stored in the transformer core by returning transformer core is delivered to the load. Flyback converters tend to cost less for lower-power transformer-core saturation due to insufficient core reset. In general, the following condition must be
/datasheets/files/maxim/0003/a198.htm |
Maxim | 04/04/2001 | 42.51 Kb | HTM | a198.htm |

number of turns, air gap length, ferrite core geometry, size and type for the speci - fied power level. Effective core area = 211 mm 2 Ferrite material is 3C85 or equivalent Np = 59T Ns = 5T The ETD geometry low-line input voltage (88V) A eff is the effective cross-sectional area of the core B max is the maximum allowable flux density of the core The air gap is determined by referring to the mag - netic core manufacturer's AL vs. air gap curves. The air gap needed for the specified inductance, turns and core type is
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/4046-v2.htm |
STMicroelectronics | 14/06/1999 | 39.65 Kb | HTM | 4046-v2.htm |

number of turns, air gap length, ferrite core geometry, size and type for the speci - fied power level. Effective core area = 211 mm 2 Ferrite material is 3C85 or equivalent Np = 59T Ns = 5T The ETD geometry low-line input voltage (88V) A eff is the effective cross-sectional area of the core B max is the maximum allowable flux density of the core The air gap is determined by referring to the mag - netic core manufacturer's AL vs. air gap curves. The air gap needed for the specified inductance, turns and core type is
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/4046-v1.htm |
STMicroelectronics | 02/04/1999 | 39.69 Kb | HTM | 4046-v1.htm |

selected. Core geometry selection is connected to the requirements of the specific application in t erms of a lower current sense resistor v alue (for a given I out ), lower core losses and a lower output efficiency. These materials provide low core losses (ferrite in particular), so that the design can be concen wire that fits the selected core. Anyway the best solution, whenever possible, is to use an the magnetic core, will be: I L3pk = I tot3 + 3.3 V ( V in max - 3.3 ) 2 V f sw V L 3p V V in max +
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/4540-v2.htm |
STMicroelectronics | 14/06/1999 | 55.86 Kb | HTM | 4540-v2.htm |

selected. Core geometry selection is connected to the requirements of the specific application in t erms of a lower current sense resistor v alue (for a given I out ), lower core losses and a lower output efficiency. These materials provide low core losses (ferrite in particular), so that the design can be concen wire that fits the selected core. Anyway the best solution, whenever possible, is to use an the magnetic core, will be: I L3pk = I tot3 + 3.3 V ( V in max - 3.3 ) 2 V f sw V L 3p V V in max +
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/4540-v1.htm |
STMicroelectronics | 02/04/1999 | 55.9 Kb | HTM | 4540-v1.htm |

step is to define the number of turns, air gap length, ferrite core geometry, size and type for the input voltage (88V) A eff is the effective cross-sectional area of the core B max is the maximum allowable flux density of the core The air gap is determined by referring to the mag - netic core manufacturer's AL vs. air gap curves. The air gap needed for the specified inductance, turns and core type is found to be 2.8mm in the center post. To approximate the minimum core size needed for the conversion
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/4046-v3.htm |
STMicroelectronics | 25/05/2000 | 41.66 Kb | HTM | 4046-v3.htm |

number of turns, air gap length, ferrite core geometry, size and type for the speci - fied power level. Effective core area = 211 mm 2 Ferrite material is 3C85 or equivalent Np = 59T Ns = 5T The ETD geometry low-line input voltage (88V) A eff is the effective cross-sectional area of the core B max is the maximum allowable flux density of the core The air gap is determined by referring to the mag - netic core manufacturer's AL vs. air gap curves. The air gap needed for the specified inductance, turns and core type is
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/4046.htm |
STMicroelectronics | 20/10/2000 | 44.33 Kb | HTM | 4046.htm |