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"CORE geometry"

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Abstract: (OFC) and a twisted balanced geometry with an aluminium mylar screening foil in a compact figure 8 , size Available 1.0m pair Protective PVC Outer Jacket Twisted Balanced Geometry 99.999% Oxygen , dielectric and 99.999% Oxygen Free Copper (OFC). The twisted balanced geometry provides excellent immunity , Dielectric Twisted Balanced Geometry Precision Audio Interconnects PA G E 7 QUNEX 4S In our , 99.999% Oxygen Free Copper (SPOFC) twisted in a quad balanced format. This geometry, together with a QED Audio Products
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QED QUNEX SILVER SPIRAL medical ultra micro coaxial cable SR75 medical copper alloy
Abstract: different core geometry, depending on the data changed in the Transformer screen. This geometry change may , . Therefore, it is best to "lock down" the core geometry (Figure 7). Figure 4, The Transformer design , the Transformer screen. Figure 7 , You can lock a particular core geometry in order to experiment , the "Lock Geometry" option is checked. Since we have changed the core geometry, we must first check , the residual flux of the core material. Throughout the off-time of the transistor, inductor current Intusoft
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LT1243 QN2222A qn2222 qn2222- spice model of power TRANSFORMER spice TRANSFORMER simulation ELECTRICAL CALCULATION FOR TRANSFORMER SSR8045 DN4150
Abstract: Overview Although the processor dissipates the maximum amount of heat of the Core Logic components , required for cooling the Core logic components. The recommended low-cost solution in the ATX and micro-ATX , the Core Logic components. 4 Thermal Requirements The primary function of the Low Profile Fan Duct is to cool the Core Logic components while not negatively impacting the cooling of the remainder , Core Logic components. The primary requirement of the Low Profile Fan Duct is that the thermal Intel
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QMFZ2 ABS plastics intel fan iso 11469 siemens sirius 3r c2800 transistor C2800
Abstract: telcom-like geometry makes them compatible with many fiber based components like fiber gratings and combiners , '· High brightness single mode core High birefringence (Yb1200-6/125DC-PM) High cladding absorption Low photodarkening Telcom-like geometry Good spliceability to HI1060 single mode fibers (Yb1200 6/125DC) and , 0.6 ± 0.2 0.15 ± 0.01 0.15 ± 0.01 Core Numerical Aperture Birefringence > 2.0E-04 Geometrical and Mechanical Core Concentricity Error Âum < 1.0 < 1.0 Cladding Diameter nLight
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1200-6/125DC 1200-6/125DC-PM 12006/125DC-PM
Abstract: . Their telcom-like geometry makes them compatible with low-cost pump diodes and standard single mode , short application lengths Low nonlinear effects Low photodarkening Telcom-like geometry Good , Core Absorption at 976 nm (nominal) Cladding Absorption at 920 nm Âum 4.4 ± 0.8 dB/m (1200) dB/m (280) Core Numerical Aperture (nominal) 0.2 Cut-off Wavelength Geometrical and Mechanical nm 1010 ± 70 Core Concentricity Error Âum < 0.7 Cladding Diameter nLight
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Abstract: core type. 317 is for coated and 318 for uncoated ring cores. The six digits following thereafter encode the geometry (dimensions) of the core whereas the ferrite material is described by the last three digits. Core type number and material codes can be found in table 1, the geometry code in table 3. For example a coated core with geometry R10/6/4 of material grade K6000 can be ordered with code 317 100 604 , 1.0 4 7 10 30 Typennummer (siehe Abschnitt Bestellnummern)/core type number (see section Kaschke Components
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K4000 K5500 K8000 K10000 K12000 K15000 Transformer kaschke 063 kaschke ferrite material K6000 Transformer kaschke 15/00 Transformer kaschke kaschke kaschke ferrite material
Abstract: Geometry 30M Polygons/s 37M Polygons/s Power Consumption (est.) Core Size 6-7 mm2 (excluding , MIPS64 20Kc Processor Core TM Breakthrough 64-bit Performance for Revolutionary SOC Designs The drop-in MIPS64 20KcTM processor core delivers unprecedented integer, floating-point, and 3D , INNOVATION The exceptional integer and floating-point performance of the MIPS64 20Kc core greatly , technologies. · The MIPS-3DTM enhanced floating-point unit achieves 3D geometry processing performance of 37 MIPS Technologies
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MIPS32 MIPS64 20Kc MIPS Technologies TSMC 0.18um IEEE754 prefetch "data history table" MIPS64TM R20KTM 0600/2K/R
Abstract: '· Good beam quality through low numerical aperture core Good efficiency Suitable for both 980 nm and 1480 nm pumping Pump combiner available for the 20/125 geometry Applications ï'· ï'· ï'· ï , 40 ± 3 Core Numerical Aperture (nominal) Geometrical and Mechanical Core Diameter Core , Geometry Âum Octagonal Octagonal Coating Diameter Âum 245 ± 15 350 ± 15 Low Index nLight
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60-20/125DC 6040/250DC 60-40/250DC
Abstract: combination of high cladding absorption and single mode core makes them ideal for compact fiber based power , '· ï'· ï'· ï'· ï'· ï'· ï'· High brightness single mode core High pump absorption Large, low NA core Low non-linear effects High birefringence (Yb1200-10/125DC-PM) Highly polarized output for frequency conversion (Yb120010/125DC-PM) Low photodarkening Telcom-like geometry Multimode , ± 0.4 1.8 ± 0.4 0.08 ± 0.01 0.08 ± 0.01 Core Numerical Aperture Birefringence nLight
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1200-10/125DC 1200-10/125DC-PM 120010/125DC-PM 4E-04
Abstract: Time-to-Market Easy Core Integration into LatticeECP2 and LatticeXP2TM FPGAs Field-Proven IP , Core from Third Parties Applications Include: · Industrial and automated control · Automotive , controller. UltiEBB 2D Graphics Accelerator Advanced BITBLT core providing ROP and alpha blending operations. UltiVIDIN Video Input Advanced video input/frame grabber core. UltiADDA FPGA based A , SPI slave core providing AMBA bus access to external host. UltiI2C_M I2C master controller Lattice Semiconductor
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ITU656 M25P32 installation diagram of ip camera graphic LCD screen lcd color spi controller with apb interface cvbs video frame grabber Flat Panel Display Controller LFE2-50E-LCDPRO-EVN LFE2-50E 5FN484C I0203
Abstract: Time-to-Market Easy Core Integration into LatticeECP2 and LatticeXP2TM FPGAs Field-Proven IP , Core from Third Parties Applications Include: · Industrial and automated control · Automotive , controller. UltiEBB 2D Graphics Accelerator Advanced BITBLT core providing ROP and alpha blending operations. UltiVIDIN Video Input Advanced video input/frame grabber core. UltiADDA FPGA based A , SPI slave core providing AMBA bus access to external host. UltiI2C_M I2C master controller Lattice Semiconductor
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7 inch 800x480 LCD panel touch lcd digital 7 inch TFT LCD WVGA QVGA GRAPHICS LCD DISPLAY rgb led video colour display
Abstract: Interactions Between Ohmmeters and Core Circuits . .2 2 Leakage Current . . . . . . . . . . . . . . . . . . . , 2.2 Leakage Current and Geometry . . . . . . . . . . . . . . .4 2.3 Leakage Current and Process . . . , . . . . . . . . . . . . . . . . . . . . . . . . .7 Interactions Between Ohmmeters and Core , representative. 1 Interactions Between Ohmmeters and Core Circuits As stated previously, testing for , processes. It is particularly challenging with respect to the VDD (processor core) power plane due to the Freescale Semiconductor
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AN3372 application of ohmmeter ohmmeter 90-nm CMOS fet Low Resistance Ohmmeter Circuit MPC7445
Abstract: Thermally Stable Operating Temperature ­40º C to +75º C Highly Durable Telcordia GR-326-CORE Compliant , Telcordia GR-63-CORE (°C) Storage Temperature Telcordia GR-910-CORE (°C) SC -40 to +75 -40 to +75 FC Meets environmental criteria specified in Telcordia standard GR-326-CORE. Designed to meet Telcordia requirements ENDFACE GEOMETRY FOR PC POLISH ORDERING INFORMATION SPECIFICATIONS FIBER , 25 Storm Products
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GR-326-CORE GR-63-CORE GR-910-CORE 10-Q-65 Telcordia 326 upc 1182 Telcordia 326-CORE 3773 10-T-55
Abstract: . Depending on the core geometry, magnetic fields may radiate from the inductive device. Such fields are , been modified in order to substitute a bobbin core by a fully gapped IIC. This component is designed , component in the circuit, a bobbin core (Coiltronics UP4B-2R2), the IIC shows some distinct advantages with , core converters, distributed power systems and portable electronics. Gapped versions allow a very , with other materials/configurations (e.g. 3E6 for common-mode choke). The geometry of the Ferroxcube
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BAV70 multi gap inductor core design 18122R105K9BB0D ceramic capacitor, .1uF 50v ferroxcube bobbin 12062R104K9BB0D multi gap inductor core 12062R471K9BB0D 12062R105K7BB0D IRF7807 IRF7805 STPS340U BAT64
Abstract: and micro-ATX system is to provide a fan duct that blows external air onto the processor core , The primary function of the fan duct is to enhance the heat dissipation of the processor core , component temperature specifications. 2 4.3 Fan Position In order to properly cool the core , position with respect to the ATX and micro-ATX motherboard datums. 5 Geometry Requirements The geometry requirements of the fan duct system must allow for assembly of system-level components including Intel
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duct board
Abstract: factor CE device. In addition, Marvellâ'™s latest video SoC integrates 14K (1.5GHz) DMIPs Quad Core A53 , 8 core 51 GFLOP Graphics Processing Unit (GPU) (Vivante GC7000XS) further underscoring Marvellâ'™s , tessellation and geometry shaders that support new gaming features in Android L AEP (Android Extension Pack). , 5.0/NAND Flash Smart Card x 1 32K I/D L1 Cache Quad ARM Core A53 SPI x 1 SDIO 3.0 x 2 UART , FEATURES AND BENEFITS SPECIAL FEATURES BENEFITS â'¢â'¢ Up to 14000 DMIPs Quad Core ARM CA53 CPU MARVELL
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88DE3218 88DE3218-01
Abstract: B 0, 6 k 3 = - u0 Core Coil former Geometry This equation shows the , and Power Transformers TT/PR Cores b) The geometry can be taken into account by a core , capacities accordingly. d) The geometry term is related to the core shape and size. However, note that the , 3 / 2 e N The factor li/l e is the closer to 1, the less the core section varies along the magnetic path (homogeneous core shape). For TT/PR cores without hole the factors are as follows: TT/PR 14 Siemens Matsushita Components
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N30 transformer core N26 core transformer siemens siferrit N27 t38 transformer siemens siferrit N87 siemens N30 B65730-J-R26 B65735-J-R26 B65730-J-R30 B65735-J-R30 B65730-J-R65 B65735-J-R65
Abstract: windings of copper wire harbor electromagnetic leakage fields that cause eddy currents, high core losses , . Other approaches include building the transformer around a larger core or designing an inductive component with a smaller core to prevent leakage. An innovative solution based on ferrite polymer composite , difficult to terminate, depending on wire and pin geometry. The insulation of the copper wire can be , high-current applications and avoids skin effect problems. The foil geometry allows the winding area to be used Siemens Matsushita Components
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E20 ferrite core E20 CORE size eddy current eddy current measurements ferrite composite
Abstract: parts: Polish geometry: Dimensions Fiber/Cable 9/125/900 9/125/900/1800/3600 ca. 35 8.9 PR M I L , MULTIMODE (PC) Type designation: External parts: Polish geometry: Dimensions Fiber/Cable 50/125/900 50/125 , SINGLE MODE (APC) Type designation: External parts: Polish geometry: Dimensions Fiber/Cable 9/125/900 9 , DIAMOND two component ferrule Ø 1,25 mm Active Core Alignment minimizes fiber core offset ( , MU SIMPLEX SINGLE MODE (PC) Type designation: External parts: Polish geometry: Dimensions Fiber Diamond SA
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24 core multi mode optical fibre cable E-2000 F-3000
Abstract: MU-S8.66 / MU-DS8.66 MU DUPLEX SINGLE MODE (PC) Type designation: External parts: Polish geometry , parts: Polish geometry: Dimensions Fiber/Cable 50/125/900 50/125/900/1800/3600 MU-DM0.6 Plastic , : External parts: Polish geometry: Dimensions Fiber/Cable 9/125/900 9/125/900/1800/3600 MU-DS8.6 Plastic , assembled quick fixing clip 9.7 15 DIAMOND two component ferrule Ø 1,25 mm Active Core Alignment minimizes fiber core offset ( Diamond SA
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