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ICL7667CBA Intersil Corporation Dual Power MOSFET Driver; PDIP8, SOIC8; Temp Range: 0° to 70°
ICL7667CBAZA Intersil Corporation Dual Power MOSFET Driver; PDIP8, SOIC8; Temp Range: 0° to 70°
ICL7667CPA Intersil Corporation Dual Power MOSFET Driver; PDIP8, SOIC8; Temp Range: 0° to 70°
ICL7667CBAZA-T Intersil Corporation Dual Power MOSFET Driver; PDIP8, SOIC8; Temp Range: 0° to 70°
ICL7667CBA-T Intersil Corporation Dual Power MOSFET Driver; PDIP8, SOIC8; Temp Range: 0° to 70°
ICL7667CPAZ Intersil Corporation Dual Power MOSFET Driver; PDIP8, SOIC8; Temp Range: 0° to 70°

"CHAPTER 1 Introduction to Power Semiconductors"

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: 2 of 10 AN 104010 NXP Semiconductors UCEV10x - Quick Introduction Sheet 1. General , Semiconductors UCEV10x - Quick Introduction Sheet Fig 1. Content of UCEV10x demo kit 104010 , smart label IC's. AN 104010 NXP Semiconductors UCEV10x - Quick Introduction Sheet Revision , /or to develop own applications. This quick introduction sheet gives an overview about the added , demo kit includes following items (see Fig 1): · UHF long range reader LRU 2000 · Power Supply · NXP Semiconductors
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UCEV101 UCEV102 UCEV103 UCODE gen2 UCODE EPC 1.19 UCODE EPC G2 902-928MHZ UCODE HSL UCEV10
Abstract: CodeWarrior & SDK Training Getting Started Introduction to 568xx Tools (Part 1 / 2 ) Why use SDK , Introduction to 568xx Development Tools: Exercises Exercise 1 How do I use the debugger? 56800 or 56800E Training CodeWarrior & SDK Training Introduction to 568xx Development Tools: Exercises Exercises 1 & 2 , Motorola 56800 and 56800E DSPs. Step 1: Gather the Material You will need four things to get started in your exploration of 56800/56800E DSPs: 1. Evaluation Module (EVM) Board Log on to the Motorola SPS Motorola
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DSP56800 DSP56800E 56800 56800 core 568xx Training 3C 800E 56800/800E
Abstract: making it easier to select and use power semiconductors. CHAPTER 1 forms an introduction to power , semiconductors in terms of power dissipation and junction temperature limits. Part of this chapter is devoted to , Thermal Management Power Semiconductor Applications Philips Semiconductors CHAPTER 7 , with the thermal characteristics of power semiconductors and are able to calculate power dissipation , Power Semiconductor Applications Philips Semiconductors 3. Move horizontally to the left into Philips Semiconductors
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static induction Thyristor TELEVISION EHT TRANSFORMERS 201 Static Induction Thyristor Power Semiconductor Applications 50w smps inverter varistor 10c 471
Abstract: . . . . . iii Chapter 1 - Package overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . , July 1997 ii Philips Semiconductors Discrete Semiconductor Packages Preface To meet these , . INTRODUCTION Philips Semiconductors is one of the worldâ'™s leading suppliers of discretes. Our range , important. How this book is organized We organized this databook into the following chapters: Chapter 1 , , as well as a guide to package selection and availability. Chapter 2 contains outline dimensional -
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Abstract: making it easier to select and use power semiconductors. CHAPTER 1 forms an introduction to power , Philips Semiconductors Table of Contents CHAPTER 1 Introduction to Power Semiconductors General 3 , semiconductors in terms of power dissipation and junction temperature limits. Part of this chapter is devoted to , Supplies Using Power Semiconductors in Switched Mode Topologies 2.1.1 An Introduction to Switched Mode , Lighting Power Semiconductor Applications Philips Semiconductors CHAPTER 8 Lighting Philips Semiconductors
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current fed push pull topology 40w ELECTRONIC choke BALLAST DIAGRAM advantages of push pull inverter philips transistor 40 w self oscillating ballast 50/60H
Abstract: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Chapter 1 - Package overview. . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 2 Cross-reference from JEDEC to , . . .1 - 22 Cross-reference from EIAJ to SOD/SOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 - 22 Chapter 2 - Package outlines . . . . . . . , . . . . . . . .2 - 1 Chapter 3 - Handling precautions . . . . . . . . . . . . . . . . . . . . . . . Philips Semiconductors
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Philips Semiconductors Selection Guide
Abstract: Revision History (Based on Hard Copy). - First Edition(V1.0) : June 2001 · Chapter 1 : Introduction(V1.0) · Chapter 2 : DC Electrical Characteristics(V1.1) · Chapter 3 : Internal Macrocells(V2.1) · Chapter 4 : Input/Output Cells(V2.1) · Chapter 5 : Compiled Macrocells(V3.1) · Chapter 6 : PLL , needed for an automatic chip design. There are seven chapters in this databook: Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter 6 Appendix A Appendix B Appendix C Appendix D Introduction Samsung Electronics
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STD130 AO222 MX2D2 OA2111 AO211 standard cell library PLL2073X
Abstract: Revision History (Based on Hard Copy). - First Edition(V1.0) : June 2001 · Chapter 1 : Introduction(V1.0) · Chapter 2 : DC Electrical Characteristics(V1.1) · Chapter 3 : Internal Macrocells(V2.1) · Chapter 4 : Input/Output Cells(V2.1) · Chapter 5 : Compiled Macrocells(V1.1) · Chapter 6 : PLL , design. There are seven chapters in this databook: Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter 6 Appendix A Appendix B Appendix C Appendix D Introduction Electrical Samsung Electronics
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IX 3354 ND2D2 STD131
Abstract: Revision History (Based on Hard Copy). - First Edition(V1.0) : June 2001 · Chapter 1 : Introduction(V1.0) · Chapter 2 : DC Electrical Characteristics(V1.1) · Chapter 3 : Internal Macrocells(V2.1) · Chapter 4 : Input/Output Cells(V2.1) · Chapter 5 : Compiled Macrocells(V2.1) · Chapter 6 : PLL , needed for an automatic chip design. There are seven chapters in this databook: Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter 6 Appendix A Appendix B Appendix C Appendix D Introduction Samsung Electronics
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AO22 samsung 019 STDL130 PLL2099X
Abstract: Section 1.4 JN-UG-3093 v1.2 © NXP Laboratories UK 2013 7 Chapter 1 Introduction to the , .2 © NXP Laboratories UK 2013 9 Chapter 1 Introduction to the Evaluation Kit Figure 4 , -3093 v1.2 © NXP Laboratories UK 2013 13 Chapter 1 Introduction to the Evaluation Kit Figure , Laboratories UK 2013 15 Chapter 1 Introduction to the Evaluation Kit Caution: When using an external , Chapter 1 Introduction to the Evaluation Kit ï'¡ Colour LED module containing 3 miniature LEDs: ï NXP Semiconductors
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JN516 DR1159 DR1174 DR1175 DR1199
Abstract: . Introduction 2 Chapter 1: Resistive DC current measurement 3 Chapter 2: Zetex ZXCT product , ISSUE 4 - FEBRUARY 2004 AN39 - 1 SEMICONDUCTORS Application Note 39 Introduction Current , 2004 SEMICONDUCTORS AN39 - 2 Application Note 39 Chapter 1: Resistive DC current , chapter provides a very basic introduction to anisotropic magnetoresistive (AMR) sensors for those users , can be critical here. Examples include: 1) Switching power supplies with current limiting Zetex Semiconductors
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CONVENTIONAL ZENER DIODE 4V7 4.7k pot Galvanic Skin Response Sensor ZMC05 ZXCT1030 INA125 D-81673
Abstract: Philips Semiconductors Power transformers for the frequency range of 30 - 80 MHz CONTENTS 1 ABSTRACT 2 SUMMARY 3 INTRODUCTION 4 CHOICE OF CORE MATERIAL 5 POWER HANDLING , Semiconductors Power transformers for the frequency range of 30 - 80 MHz 1 Technical Publication ECO7703 , handling capability of 120 W. 3 INTRODUCTION In Ref.1 information was given on the design of power , core temperature. As it is a realistic target to keep the core losses below 1% of the power handled by Philips Semiconductors
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Data Handbook MA01 philips toroid 4c6 ECO6907 4c6 philips 4c6 toroids Wideband Power Transformers SCA57
Abstract: for more additional information chapter Introduction. Here are some remarks how to program your own , USB-AUDIO CODEC Technical Report DML2K001 Table of contents 1. Introduction 5 2. Hardware , Media Lab UDA1325H / N107 USB-AUDIO CODEC 1. Technical Report DML2K001 Introduction This , USB-CODECs. You will find details where to get these documents in chapter 5 - References. Since we report , / contract to use one of the internal maps in their own applications. 5 Philips Semiconductors, Inc Philips Semiconductors
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DML98012 UDA1335H TDK ZJYS-4 PROFESSIONAL AUDIO LIMITER SCHEMATICS ZJY-M4A tdk zjy-M4A ZJYS-4 tdk ZJYS-4 Datasheet UDA1325 DML98011 DML98021 DML98022
Abstract: ) data tables - power packages 6 - 25 Philips Semiconductors IC Packages Thermal design considerations Chapter 6 INTRODUCTION FACTORS AFFECTING Rth(j-a) The ability to describe the thermal , CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 , respect to the ambient temperature (Tamb) can be determined at a given power dissipation (Pd) of the , to ambient (K/W) power dissipated (W) ambient temperature (°C) It's important to note that a Philips Semiconductors
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QFP PACKAGE thermal resistance SO14-150 SOT411 MBK360 MBK355 SOT110 TSSOP48 MBK375 MBK377 TSSOP56 VSO40 MBK379
Abstract: Semiconductors marks the packing materials according to ISO 11469 using the recycling symbols shown in Figs 1 to , information SURFACE-MOUNT POWER TRANSISTORS IN PLASTIC PACKAGE REFERENCE D2-PAK - - D-PAK TO-247 Note 1. All , CHAPTER 7 ENVIRONMENTAL INFORMATION page Introduction Explanation of the tables General safety , environment to the absolute minimum. Products supplied by Philips Semiconductors today offer no hazard to the , packing quantity. For more detailed information on packing, refer to Chapter 6 Packing Methods. Metal Philips Semiconductors
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AgCu28 Transistors smd mark code SnAg25Sb10 SOT195 sot172a sot128 SC70-3 SC-59 SC70-5 SC70-6 SC-75 SC-74
Abstract: '¢ phtalates (1) The lists refer to processes used for manufacturing products mentioned in this chapter. For , information Chapter 7 POWER TRANSISTORS IN PLASTIC PACKAGE REFERENCE PACKAGE CODE(1) MASS (g , CHAPTER 7 ENVIRONMENTAL INFORMATION page Introduction 7-2 Explanation of the tables , Chapter 7 INTRODUCTION Nowadays, everyone must accept responsibility for keeping the environment , the absolute minimum. Products supplied by Philips Semiconductors today offer no hazard to the Philips Semiconductors
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Abstract: reasonable to assume that the health of the user may be endangered. ROSA Table of Contents Chapter Chapter Chapter Chapter Chapter 1 Introduction , introduction to ROSA and its possible applications. The second chapter provides an overview of the operation , .47 Siemens AG Semiconductors Version 5.1 Confidential 10/06/1998 3 ROSA 1 , communication with a data rate up to 2.5 Mbyte/s Siemens AG Semiconductors Version 5.1 Confidential Infineon Technologies
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acia 6850 BEATLES LET IT BE beatles pdf files MultiMediaCard System Specification rosa siemens confidential D-81541
Abstract: CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and , design Chapter 4 INTRODUCTION Soldering There are two basic forms of electronic component , below 400 °C, it may only remain in contact for up to 5 s. 4-2 Philips Semiconductors Discrete , . Stencil apertures that are too small result in irregular dots on the lands (Fig.2, examples 1 to 3). If , step stencils, a rubber squeegee has to be used. The footprints given in this chapter were designed Philips Semiconductors
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SOD87 footprint SMD footprint design Soldering guidelines sod110 land SOD110 footprint MSB956 MSB958
Abstract: chapters in this databook: Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter 6 , rights of Samsung or others. Samsung reserves the right to make changes in its products or product specification to improve function or design at any time, without notice. SEC and STDM110 are trademarks of , 82-31-209-6500, 6501 (Hot Line) FAX 82-31-209-4920 http://www.samsungelectronics.com/semiconductors/ asic , Introduction This databook contains information about STDM110 0.25um 2.5V standard cell library for pure Logic Samsung Electronics
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dl2d LD1A samsung 413 FD6S SCG3 Samsung ASIC PLL2013X
Abstract: CHAPTER 6 PACKING METHODS page Introduction Glossary of terms Packing methods in exploded view , Discrete Semiconductor Packages Packing Methods INTRODUCTION This chapter contains a survey of some of , , of course, applies to all products, not just semiconductors. The second is to act as a delivery , to looking at ways in which materials can be recycled. In these respects, Philips Semiconductors has , even further along this route. For more information on environmental issues, refer to Chapter 7 Philips Semiconductors
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sot446 MSC090 sot482a MSC092 MSD055 MSD069 MSD068 MSD067 MSC084
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