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Part Manufacturer Description PDF & SAMPLES
CDB35L00 Cirrus Logic DEVELOPMENT BOARD FOR CS35L0X
CDB42L73 Cirrus Logic EVAL BD PORTABLE SMARTPHON CODEC
CRDSB30WX2 Cirrus Logic REF BD SPEAKERBAR MSA/DSP PARTS
CS496122-CQZR Cirrus Logic IC DSP 32BIT 16CH SER IO 144LQFP
CDB4354 Cirrus Logic CS4354 Evaluation Board 5V DAC 2VRMS LINEDVR
CK49X-497024 Cirrus Logic 32BIT 600M 128PIN QFPDSP EVL KIT

"Associated Components Technology" transformer* m

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: 79 NEW PRODUCT SURFACE MOUNT LOW PROFILE AUDIO TRANSFORMER SERIES SEF SPECIFICATIONS FEATURES - PART NUMBER Super compact size Good for high speed modems Meets FCC requirements Can , SEF-3 600 900 1.5 SEF-1CT 600CT 600CT 1.4 SEF-2CT > 100 M @ 500 VDC 60dB , SCHEMATIC 4 5 Associated Components Technology Phone 800 / 234-2645 Fax 714 / 265-4810 Associated Components Technology Associated Components Technology
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audio transformer 600 surface mount
Abstract: 83 NEW PRODUCT SURFACE MOUNT HIGH SPEED PULSE TRANSFORMER SERIES STP FEATURES - Excellent effective power transmission Fast rise time High ET constant assures transmission capacity , Packaging 2.54 7 max -45°C to +105°C 100 M min (100 VDC ) 500 VDC min ±100PPM / °C Max 50 mA , 500 500 500 500 500 500 Associated Components Technology Phone 800 / 234-2645 Fax 714 , C A A A B B B B Associated Components Technology Associated Components Technology
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STP-40 STP-80 STP-100-2 STP-40CT STP-20CT STP-100-2CT 1002CT STP-120-3CT-1 hall IC 945 stp 6 pin
Abstract: need for a package, interconnect board plus discrete components complicated the assembly of the hybrid , connections, and firing in a reducing atmosphere which limited the range of co-firable film components which , film components are formed themselves from refractory mixed metal oxides which require oxidizing , components such as resistors, capacitors and inductors. This ability to be processed in an oxidizing , Semi IC's & MCM-D THIN/THICK FILMS HTCC INTERCONNECT PACKAGE COMPONENTS LOW TEMPERATURE National Semiconductor
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SRF 1063 JESD-A101 W. HUGHES TEST POINTS Passive filters used in wireless lans capacitor huang analog telecommunications 1992 car
Abstract: , interconnect board plus discrete components complicated the assembly of the hybrid microcircuit and increased , reducing atmosphere which limited the range of co-firable film components which could be included. The , * * requires processing in a non-oxidizing atmosphere The best film components are formed themselves from , a variety of in situ film components such as resistors, capacitors and inductors. This ability to be , COMPONENTS LOW TEMPERATURE COFIRED TECHNOLOGY Figure 1 Comparison of MCM technologies Low-Temperature National Semiconductor
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htcc 102 capacitor Hughes Microelectronics
Abstract: HYPER-XMTTM HXTH01260 BRIDGE CONVERTER TRANSFORMER · · · · · · Designed for Bridge , transformer primary. External circuit connections must provide appropriate isolation for these terminals , HXTH01260 BRIDGE CONVERTER TRANSFORMER ELECTRICAL SPECIFICATIONS (@ +25ºC): DCR: Primary (1-6) = 0.055 Max Secondary (S-F) = 0.70 m Max OCL: Primary (1-6) = 1.5mH Min @ 150kHz SRF: 500 kHz Min LEAKAGE , commercializing 4.5 advanced technology for electromagnetic components. The company's technology is relied Tabtronics
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155uH hxth HXTH01260R 400VDC
Abstract: Requires Stable Signal Conditioning Components. Thermistorsand -100°Cto w5%/°C for ± 0.1 °C Standard  , output requires stable signal conditioning components and makes system accuracy difficult to achieve , make "end-to-end" system accuracies better than 0.5°C difficult to achieve. 0 2.5 E 5 § 7.5 < m 10 , Application Note 28 R2 R3 100ÃÏ 255k FULL-SCALE TRIM 1% Vin K LT1025 Vo GND R- 1 X ? m "R4 -^A . M , can serve as part of a filter. Effects of the added components on overall accuracy should be evaluated -
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33K100 74c74 Omega k type thermocouple range 33K-100 A7s TRANSISTOR Non-Linear Circuits Handbook AN28-20
Abstract: 1 Total Cost of Ownership using Solid State Relays co m By: Doug Sherman, Field Sales , Engineer/Marketing Director Crydom, Inc. nt co m po ne Power switching solutions are , m 2 s. co Fig. 1 - Product life cycle showing important costs for switching solutions lin e co m po ne nt Fig. 1 shows three costs associated with a switching solution , m Rather than focusing only on initial cost, the approach presented here is more toward Crydom
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Abstract: .11 Table 1. Implementation of Software Components , TNETD2000P chipset. Figure 2. Internal PCI ADSL Adapter Block Diagram Interleave Memory External M , C Receiver & Input Filter Transformer Over Voltage Protection RJ -11 Line Driver , where various software components are implemented. Table 1. Implementation of Software Components , processor. Microsoft provides the PPP protocol stack components. On host processor. Microsoft provides the Texas Instruments
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schematic adsl modem board adsl splitter dslam circuit diagram adsl splitter circuit diagram schematic diagram of phone adapter ADSL Modem circuit diagram TNETD2011 SPAA006A TNETD2000PTM
Abstract: information, see page 22. TAPE AND REEL PACKAGING )(). SURFACE MOUNT DEVICE /Tl S M D ¡J|. 0 , :609-429-7800 · Fax:609-429-6814 E-Mail: sales@ em ct.com · W e b Site: w w w .EM C T .co m NEW PRODUCTS , MOUNT BALUN A 50ft to 25Q transformer (balun), our unique surface mount balun is specifically designed , cable. To protect temperature sensitive components from heat generated by the load, it may be mounted in a remote heat sink. The cable load replaces other expensive components normally used in these -
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PCA54XX
Abstract: drive to VMOS devices Q1 and Q2, which chop Q3's output into T1, a step-up transformer. In this design , rails while simultaneously supplying current gain. E 600 lu ( 3 550 oc 500 m o 450 < v 400 , . Substituting higher power devices for Q1 and Q2 along with a larger transformer allows more output power , transformer cannot pass DC polarity information. Obtaining bipolar output from a transformer based voltage , LTC1043 section gates oscillator pulses to the appropriate SCR trigger transformer at the output. For -
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1000v to 2000v vac inverter circuit 12bh7a 12V DC to 120V AC full bridge inverter 74C04 scr controlled servo amplifier transformer inverter ips 12v
Abstract: HYPER-XMTTM HXTF00140 FORWARD CONVERTER TRANSFORMER · · · · · · · Designed for forward , specific applications. HYPER-XMTTM HXTF00140 FORWARD CONVERTER TRANSFORMER ELECTRICAL SPECIFICATIONS (@ +25°C): DCR: Primary (1 ­ 2) = 0.070 Max Secondary (3 ­ 4) = 0.50 m Max OCL: Primary = 70 , advanced technology for electromagnetic components. 0.352 1.55 97.11 The company's technology , customers. Tabtronics has 25 years experience in direct manufacture of electromagnetic components, and Tabtronics
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HXTF00140R max 9694
Abstract: Equipment Rooms `o' Separation: Liquid Oil Fill Transformers `q' Separation: Semi-Solid Sand Fill Instrumentation `m' Separation: Solid Encapsulation Instrumentation `n' , given explosive gas atmosphere." Thus, a circuit must contain safety components that prevent spark or , responsibility of the circuit designer to incorporate these protective components into the design while still , agency certification if it contains passive components, does not generate or store significant energy Linear Technology
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LT4356 IEC-79 IEC60079-11 IRLR2906 IEC79-11 INTRINSIC SAFE CIRCUIT LT4356 DC1018
Abstract: MIC 20.000MHZ Command Payload FCS MSDU MHR 2 MAC Sublayer 1 4 or 10 2 k m n Sequence , Sleep and Wake-up modes. The 100 kHz internal oscillator requires no external components and Microchip Technology
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MRF24J40 DS39776 MPLAB ICE suppression cap x2 8203 PICC-18 PIC32 ox230 DS39776C DS39776C-
Abstract: 2 k m n Sequence Number Adressing Fields Superframe Specification GTS , Oscillator The 100 kHz internal oscillator requires no external components and provides one of two Sleep Microchip Technology
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Abstract: as15-s NC7S7125PSX DS39776A Command Payload MSDU MFR 2 MAC Sublayer 1 4 or 10 2 k m n Frame Control , internal oscillator requires no external components and provides one of two Sleep clock (SLPCLK Microchip Technology
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DS39776B MRF24J40/ML NC7SZ125P5X rf beacon AES-128 DS39776B-page DS39776B-
Abstract: transformer 5.2.3 Supply via two transformers Connection of several servo drives to form a drive , components. The "General safety instructions" and "Special safety instructions for AX5000" sections are also , AX5000 series are designed for installation as components in electrical systems or machines and may be operated only as integrated system or machine components. WARNING Caution ­ Risk of injury , liability All the components are supplied in particular hardware and software configurations appropriate BECKHOFF
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AX5103 AX5901 AX5201-AX5206 AX5911 AX5106 AX5203 AX-5000-0000-0200
Abstract: on-chip transformers at 2.4 GHz [8]. Another interesting low-voltage example is the 2.4-GHz power device , on-chip passive components such as inductors, capacitors and varactors are required for RF IC , increasing the bias current or by using higher-Q components in the LC resonator circuit. Note, however , wide range of high-Q passive components will be critical to achieving low power dissipation in RF and , also the simulation of interconnect wires, transmission lines, transformers, and packages IBM
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microwave transceiver microwave transceiver 3.5 GHz loop gain of Colpitts VCO design 5ghz 0.18 um CMOS Spiral Inductor technology loop gain of Colpitts VCO design 4 ghz Drive Base BJT
Abstract: transformers. Although other floating drive schemes are available, this drive technique is most common when , hightech field. Not surprisingly, the price pressure on highvolume semiconductors components is , Density (m W cm 2) 2 6 RDS(on) Aactive 8 Trench 0 1980 '82 '84 '86 '88 , air conditioning, this device performance advantage translates into fewer components and into the , inductance can cause voltage spikes to be reflected back onto the primary (battery) side of the transformer Temic Semiconductors
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car airbag trench mosfet firing circuit 62726 squib Si4410
Abstract: APPLICATIONS · Sw itches/Relays/M U X's - Autom atic Test Equipment - Ultrasound - Harness Reduction - Fiber , CIRCUITS * Complementary transistors, with m atching P-channel and N-channel, both for low voltage signal , contain all these components. With H IV IC technology, the electrode drive and control can be accomplished , dramatically re duce the number of components and printed circuit boards, resulting in increased speed, reduced , expensive hybrid circuitry with numerous external components. H IV IC technology permits the integration of -
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rad hard h-bridge dc motor
Abstract: Inductors SMD pulse transformers for LAN applications March 11, 2010 TDK-EPC, a group company of TDK Corporation, has developed a series of TDK pulse transformers in SMD design for LAN use. The new product enables customers to employ automated placement of all components on the circuit board and using , an insertion loss of not more than 1.5 dB, the new ALT4532-001T series of pulse transformers , transformer is used in combination with a common-mode filter to eliminate differential noise. Together, their TDK-EPC
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TDK Pulse Transformers TDK TRANSFORMER TDK noise FILTER tdk transformer design smd PULSE TRANSFORMER EPC TRANSFORMER 100BASE-TX
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