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STELLARIS-3P-QUADR-RTXC-RTOS Texas Instruments RTXC Quadros RTOS
STELLARIS-3P-QUADR-RTXCUSB-STACK Texas Instruments RTXCusb Software
STELLARIS-3P-QUADR-RTXC-VISUAL Texas Instruments Quadros VisualRTXC
600F9R1BT250XT American Technical Ceramics Corp CAPACITOR, CERAMIC, MULTILAYER, 250V, C0G, 0.0000091uF, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT
600S390FT250XT American Technical Ceramics Corp CAPACITOR, CERAMIC, 250V, C0G, 0.000039uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT
600S1R2CT250XT American Technical Ceramics Corp CAPACITOR, CERAMIC, 250V, C0G, 0.0000012uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT

"84-PIN" CERAMIC QUAD FLAT PACK TEXAS INSTRUMENTS pipeline

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Instruments Packaging ­ 141-Pin Ceramic Grid Array (GFA Suffix) ­ 132-Lead Ceramic Quad Flat Package (HFG Suffix) ­ 132-Lead Plastic Quad Flat Package (PQ Suffix) ÉÉ ÉÉ ÉÉ ÉÉ 132 1 HFG PACKAGE (TOP VIEW , -ns cycle time 40 ns cycle time 40 ns cycle time 30 ns cycle time PACKAGE Pin grid array Quad flat package Pin grid array Quad flat package Plastic Quad flat package When ordering use DESC P/N , unconnected. I = input, O = output, Z = high-impedance Quad flat pack only POST OFFICE BOX 1443 · Texas Instruments
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block diagram of TMS320C5X starter kit TMS320 DSP kit circuit diagram PLU processor TMS320C5x architecture diagram SMJ320C50/SMQ320C50 SGUS020 MIL-PRF-38535 141-P 132-L SPRA439
Abstract: Implanted CMOS (EPIC) Technology Fabricated by Texas Instruments Packaging ­ 141-Pin Ceramic Grid Array (GFA Suffix) ­ 132-Lead Ceramic Quad Flat Package (HFG Suffix) ­ 132-Lead Plastic Quad Flat Package , High-Impedance Quad flat pack only POST OFFICE BOX 1443 · HOUSTON, TEXAS 77251­1443 9 SMJ320C50 , 30-ns cycle time ±5% Quad flat package SMJ320C50GFAM50 40 ns cycle time ±5% Pin , , and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto Texas Instruments
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SMJ320C50GFAM66 SMJ320C50HFGM50 SMJ320C50HFGM66 SMQ320C50PQM66 SGUS020B
Abstract: Implanted CMOS (EPICTM) 0.72-um Technology Fabricated by Texas Instruments Packaging ­ 141-Pin Ceramic Grid Array (GFA Suffix) ­ 132-Lead Ceramic Quad Flat Package (HFG Suffix) ­ 132-Lead Plastic Quad , Quad flat pack only POST OFFICE BOX 1443 · HOUSTON, TEXAS 77251­1443 9 SMJ320C50/SMQ320C50 , time ±5% Quad flat package SMJ320C50GFAM50 40 ns cycle time ±5% Pin grid array , of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data Texas Instruments
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Abstract: Implanted CMOS (EPICTM) 0.72-um Technology Fabricated by Texas Instruments Packaging ­ 141-Pin Ceramic Grid Array (GFA Suffix) ­ 132-Lead Ceramic Quad Flat Package (HFG Suffix) ­ 132-Lead Plastic Quad , Quad flat pack only POST OFFICE BOX 1443 · HOUSTON, TEXAS 77251­1443 9 SMJ320C50/SMQ320C50 , time ±5% Quad flat package SMJ320C50GFAM50 40 ns cycle time ±5% Pin grid array , of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data Texas Instruments
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TRANSISTOR ASY 77
Abstract: Performance Implanted CMOS (EPIC ) Technology by Texas Instruments (TI ) Two- and Three-Operand Instructions , Operations 32-Bit Barrel Shifter One 32-Bit Data Bus (24-Bit Address) Packaging ­ 132-Lead Ceramic Quad Flatpack With Nonconductive Tie-Bar (HFG Suffix) ­ 141-Pin Ceramic Staggered Pin Grid- Array Package (GFA , DSPs from Texas Instruments. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and Texas Instruments
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cpga weight SMJ320C31 SMJ320LC31 SMQ320LC31 SGUS026F SMJ320C31-60 SMJ320C31-50
Abstract: Implanted CMOS (EPICTM) 0.72-um Technology Fabricated by Texas Instruments Packaging ­ 141-Pin Ceramic Grid Array (GFA Suffix) ­ 132-Lead Ceramic Quad Flat Package (HFG Suffix) ­ 132-Lead Plastic Quad , Quad flat pack only POST OFFICE BOX 1443 · HOUSTON, TEXAS 77251­1443 9 SMJ320C50/SMQ320C50 , time ±5% Quad flat package SMJ320C50GFAM50 40 ns cycle time ±5% Pin grid array , of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data Texas Instruments
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Abstract: Scan Five Packaging Options ­ 100-Pin Quad Flat Package (PJ Suffix) ­ 100-Pin Thin Quad Flat Package (PZ Suffix) ­ 128-Pin Thin Quad Flat Package (PBK Suffix) ­ 132-Pin Quad Flat Package (PQ Suffix) ­ 144-Pin Thin Quad Flat Package (PGE Suffix) Low Power Dissipation and Power-Down Modes: ­ 47 mA (2.35 , ) description The TMS320C5x generation of the Texas Instruments (TITM ) TMS320 digital signal processors (DSPs , concerning availability, standard warranty, and use in critical applications of Texas Instruments Texas Instruments
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PZ S-PQFP-G100 Package footprint BSDL tms320 texas TMS320C5X PROCESSOR TMS320C5x dsp TMS320C5x dsp block diagram TMS320C5X starter kit TMS320C5 TMS320LC5 SPRS030A 100-P 128-P 132-P
Abstract: Instruments Packaging ­ 141-Pin Ceramic Grid Array (GFA Suffix) ­ 132-Lead Ceramic Quad Flat Package (HFG Suffix) ­ 132-Lead Plastic Quad Flat Package (PQ Suffix) ÉÉ ÉÉ ÉÉ ÉÉ 132 1 HFG PACKAGE (TOP VIEW , -ns cycle time 40 ns cycle time 40 ns cycle time 30 ns cycle time PACKAGE Pin grid array Quad flat package Pin grid array Quad flat package Plastic Quad flat package When ordering use DESC P/N , unconnected. I = input, O = output, Z = high-impedance Quad flat pack only POST OFFICE BOX 1443 · Texas Instruments
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TMDS00510 TMDS00510PP TMDS00510WS TMDS3080002 XDS510 TMDS3200051
Abstract: Instruments Packaging ­ 141-Pin Ceramic Grid Array (GFA Suffix) ­ 132-Lead Ceramic Quad Flat Package (HFG Suffix) ­ 132-Lead Plastic Quad Flat Package (PQ Suffix) ÉÉ ÉÉ ÉÉ ÉÉ 132 1 HFG PACKAGE (TOP VIEW , -ns cycle time 40 ns cycle time 40 ns cycle time 30 ns cycle time PACKAGE Pin grid array Quad flat package Pin grid array Quad flat package Plastic Quad flat package When ordering use DESC P/N , unconnected. I = input, O = output, Z = high-impedance Quad flat pack only POST OFFICE BOX 1443 · Texas Instruments
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SM320C50GFAM50 SM320C50GFAM66 SM320C50HFGM50 SM320C50HFGM66 TMS320C5X SSYA008
Abstract: Quad Flat Pack (PQFP) FE = Ceramic Quad Flat Pack (CQFP) RC = Pin Grid Array (PGA), Gold Lead Finish , - 0 36 180 SPAK030FEXXC = Ceramic Quad Flat Pack (CQFP) MPQ = Minimum Package Quantity = Pin , Ceramic Quad Flat Pack (CQFP) = Thin Quad Flat Pack (TQFP) = Plastic Pin Grid Array C C C Temp , Rev 179-Lead RC 25,33, 40 - 184-Lead FE 25, 33, 40 - = Ceramic Quad Flat Pack (CQFP) = Pin , , 25 = Plastic Quad Flat Pack (PQFP) = Plastic Pin Grid Array Rev - - Order Quantity For Motorola
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XC68307 toshiba Motherboards laptop layout MC68230P XC68834 B47K PPC860 MOS11 MOS13 BR729/D
Abstract: .23 4.1 4.2 160 PIN QUAD FLAT PACK (QFP) PACKAGE , at 80 MHz, 3.3 volts â'¢ 256 tap decimate by 4 â'¢ 160 pin quad flat pack package â , match test. Texas Instruments Incorporated -i- This document contains information which may be , .42 Texas Instruments Incorporated - iii - This document contains information which may be , Figure 1. GC2011A Block Diagram Texas Instruments Incorporated -1- This document contains Texas Instruments
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SLWS129A
Abstract: .23 4.1 4.2 160 PIN QUAD FLAT PACK (QFP) PACKAGE , pin quad flat pack package · 160 pin ball grid array package · 1.1 for control , match test. Texas Instruments Incorporated -i- This document contains information which may be , .42 Texas Instruments Incorporated - iii - This document contains information which may be , MODE -SINGLE 512 BY 8 BIT MODE Figure 1. GC2011A Block Diagram Texas Instruments Incorporated Texas Instruments
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FIR 3D41 GC2011 Graychip GC2011 Data sheet 00D8 20D8 61A8
Abstract: .23 4.1 4.2 160 PIN QUAD FLAT PACK (QFP) PACKAGE , pin quad flat pack package · 160 pin ball grid array package · 1.1 for control , match test. Texas Instruments Incorporated -i- This document contains information which may be , .42 Texas Instruments Incorporated - iii - This document contains information which may be , MODE -SINGLE 512 BY 8 BIT MODE Figure 1. GC2011A Block Diagram Texas Instruments Incorporated Texas Instruments
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3D41 diode Graychip a4ea ae02 marking Graychip GC2011A
Abstract: .23 160 PIN QUAD FLAT PACK (QFP) PACKAGE , interface output, and diagnostics Built in diagnostics 1.6 Watt at 80 MHz, 3.3 volts 160 pin quad flat pack , 2000 Texas Instruments Incorporated -i- This document contains information which may be , .42 Texas Instruments Incorporated - iii - This document contains information which may be , in the GC2011 compatible mode. See Section 6.10 for details. Texas Instruments Incorporated -2- Texas Instruments
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Abstract: .23 4.1 4.2 160 PIN QUAD FLAT PACK (QFP) PACKAGE , at 80 MHz, 3.3 volts â'¢ 256 tap decimate by 4 â'¢ 160 pin quad flat pack package â , match test. Texas Instruments Incorporated -i- This document contains information which may be , .42 Texas Instruments Incorporated - iii - This document contains information which may be , Figure 1. GC2011A Block Diagram Texas Instruments Incorporated -1- This document contains Texas Instruments
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ISO/TS16949
Abstract: .23 160 PIN QUAD FLAT PACK (QFP) PACKAGE , interface output, and diagnostics Built in diagnostics 1.6 Watt at 80 MHz, 3.3 volts 160 pin quad flat pack , 2000 Texas Instruments Incorporated -i- This document contains information which may be , .42 Texas Instruments Incorporated - iii - This document contains information which may be , in the GC2011 compatible mode. See Section 6.10 for details. Texas Instruments Incorporated -2- Texas Instruments
Original
Abstract: .23 4.1 4.2 160 PIN QUAD FLAT PACK (QFP) PACKAGE , pin quad flat pack package · 160 pin ball grid array package · 1.1 for control , match test. Texas Instruments Incorporated -i- This document contains information which may be , .42 Texas Instruments Incorporated - iii - This document contains information which may be , MODE -SINGLE 512 BY 8 BIT MODE Figure 1. GC2011A Block Diagram Texas Instruments Incorporated Texas Instruments
Original
Abstract: .23 4.1 4.2 160 PIN QUAD FLAT PACK (QFP) PACKAGE , pin quad flat pack package · 160 pin ball grid array package · 1.1 for control , match test. Texas Instruments Incorporated -i- This document contains information which may be , .42 Texas Instruments Incorporated - iii - This document contains information which may be , MODE -SINGLE 512 BY 8 BIT MODE Figure 1. GC2011A Block Diagram Texas Instruments Incorporated Texas Instruments
Original
Abstract: .23 160 PIN QUAD FLAT PACK (QFP) PACKAGE , interface output, and diagnostics Built in diagnostics 1.6 Watt at 80 MHz, 3.3 volts 160 pin quad flat pack , 2000 Texas Instruments Incorporated -i- This document contains information which may be , .42 Texas Instruments Incorporated - iii - This document contains information which may be , in the GC2011 compatible mode. See Section 6.10 for details. Texas Instruments Incorporated -2- Texas Instruments
Original
Abstract: .23 160 PIN QUAD FLAT PACK (QFP) PACKAGE , interface output, and diagnostics Built in diagnostics 1.6 Watt at 80 MHz, 3.3 volts 160 pin quad flat pack , 2000 Texas Instruments Incorporated -i- This document contains information which may be , .42 Texas Instruments Incorporated - iii - This document contains information which may be , in the GC2011 compatible mode. See Section 6.10 for details. Texas Instruments Incorporated -2- Texas Instruments
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