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Part Manufacturer Description PDF & SAMPLES
CS181002-CQZ Cirrus Logic 32-bit Microprocessor IC; Package/Case:144-LQFP; Leaded Process Compatible:No; MIPS:120; Peak Reflow Compatible (260 C):No
CS181022-CQZ Cirrus Logic 32-bit Microprocessor IC; Package/Case:144-LQFP; Leaded Process Compatible:No; MIPS:120; Peak Reflow Compatible (260 C):No
CS181012-CQZ Cirrus Logic 32-bit Microprocessor IC; Package/Case:144-LQFP; Leaded Process Compatible:No; MIPS:120; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
CS496112-CQZ Cirrus Logic 32-Bit AUDIO DSP IC; Package/Case:144-LQFP; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
CS496122-CQZ Cirrus Logic 32-Bit AUDIO DSP IC; Package/Case:144-LQFP; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
CS496102-CQZ Cirrus Logic 32-Bit AUDIO DSP IC; Package/Case:144-LQFP; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No

"67A" 6pin package

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Voltage Connectors 6-Pin, Subminiature Rectangular Connectors . . . . . . . . . . . . . . . . . . . . . Tyco Electronics
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Abstract: Industrial HC(S)08 SNAP Microcontroller MCB58 Features ü ü ü ü ü ü ü ü The MCB58 offers a complete, easy to use hardware/software package for low-cost, low-power industrial designs. The Metrowerks CodeWarrior C-compiler and assembler, running on Win98/ NT/2000/XP, is used to create programs for the MCB58. These programs are then downloaded and debugged in the MCB58 flash , Connections: q 3-pin screw terminal for power q 2 DB9s for COM1 and COM2 q 6-pin debug port (Requires BDM Micro/sys
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5-30VDC PC/104 98/NT/2000/XP MPC116 MPC132 MPC148
Abstract: InGaP AMPLIFIER Package: QFN, 6-pin, 5.59mm x 6.23mm x 0.85mm Vcc Features RFPA5026 ï , Resistance Package  Active Bias Vbias On-Chip Output Power Detector  RFOUT RFIN , reworkable and thermally enhanced surface-mount DFN package. Ordering Information RFPA5026SQ RFPA5026SR , is not connected internal to the package. Buss it to pin 5 as shown on the app circuit to achieve the , technical support, contact RFMD at or . 15 of 16 RFPA5026 Proposed Package Drawing RF Micro Devices
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RFPA5026-EVB1 RFPA5026-EVB2 0805-HQ-5N6XJBB DS120110
Abstract: 7-38 bCHBM là TEMPERATURE RANGE D D O m Sti 67Ã" â  PACKAGE 16-Pin 1 6-Pin 20-Pin 20 -
OCR Scan
L4811 ML4810 ML4811 ML4810/11 FB3480 GDD415S
Abstract: CHARACTERISTICS Specified Operating Range P, U, N Package Thermal Resistance, θJA P 8-Pin DIP U SO-8 N SOT23 , A80 Pin Orientation/Package Marking PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE PACKAGE DRAWING NUMBER(1) OPA680P OPA680U " OPA680N " 8-Pin Plastic DIP SO-8 Surface-Mount " 6-Pin SOT23-6 " 006 182 " 332 " SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING , '"3dB bandwidth of 80MHz. 8-Pin DIP 8-Pin SO-8 6-Pin SOT23-6 DEM-OPA68xP DEM-OPA68xU DEM-OPA6xxN Texas Instruments
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OPA680 220MH 400MH
Abstract: marking codes fairchild SUPERSOT CD3M1 ) package and is specified over the -40°C to +85°C extended temperature range. The MAX1870A evaluation kit , ) Package Ordering Information PART TEMP RANGE PIN-PACKAGE MAX1870AETJ -40°C to +85°C 32 Thin QFN MAX1870AETJ+ -40°C to +85°C +Denotes lead-free package. 32 Thin QFN Typical Maxim Integrated Products
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MAX1870AEVKIT Step-up 12V to 19V 5A Step-up 12V to 19V 1.5A MO220 T2855-1 T2855-3 T2855-6
Abstract: ) package and is specified over the -40°C to +85°C extended temperature range. The MAX1870A evaluation kit , (5mm x 5mm) Package Ordering Information PART TEMP RANGE PIN-PACKAGE MAX1870AETJ -40°C to +85°C 32 Thin QFN MAX1870AETJ+ -40°C to +85°C +Denotes lead-free package. 32 Thin QFN Maxim Integrated Products
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SCHEMATIC DIAGRAM adapter 12v 5A NICD charger 18V datasheet SCHEMATIC DIAGRAM adapter 12v 2a
Abstract: ) package and is specified over the -40°C to +85°C extended temperature range. The MAX1870A evaluation , 32-Pin Thin QFN (5mm x 5mm) Package Ordering Information PART TEMP RANGE PIN-PACKAGE MAX1870AETJ -40°C to +85°C 32 Thin QFN MAX1870AETJ+ -40°C to +85°C +Denotes lead-free package Maxim Integrated Products
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Abstract: ) package and is specified over the -40°C to +85°C extended temperature range. The MAX1870A evaluation kit , (5mm x 5mm) Package Ordering Information PART TEMP RANGE PIN-PACKAGE MAX1870AETJ -40°C Maxim Integrated Products
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5M-1994 SPP-012
Abstract: , Flat lead, 5-pin Super-Mini, 5-pin Chip-Scale Package, Transfer Molded, 6-Pin, D-Type Extreme , MOSFETs · Package Options 4-4 Low-VDSS, High-Speed MOSFETs , Improvement by Thermally Enhanced Package and New Process Technology ­ MOSBD (MOSFET with SBD) · High-Speed , package and are suitable for use in lithium-ion secondary battery protection circuits in various portable , DC-DC converters TO-220SM(W) Series (VDSS = 40 V to 150 V) The TO-220SM package, which uses Cu Toshiba
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TPCA*8064 TK12A10K3 SSM3J328 TK50E06K3A TPCA8077 TJ11A10M3 BCE0082B
Abstract: lead, 5-pin Super-Mini, 5-pin Chip-Scale Package, Transfer Molded, 6-Pin, D-Type Extreme , Trench MOSFETs â'¢ Package Options 4-4 Low-VDSS, High-Speed MOSFETs , Improvement by Thermally Enhanced Package and New Process Technology â'" MOSBD (MOSFET with SBD) â , to 30 V) The LGA and STP Series are housed in an ultra-small and thin package and are suitable for , devices ● DC-DC converters TO-220SM(W) Series (VDSS = 40 V to 150 V) The TO-220SM package, which Toshiba
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TPC8116 BCE0082A
Abstract: Compliant · 50kHz-500kHz frequency range · Surface mount A · UL94 V-0 package materials · J-STD-020C reflow , . 0.63 2.54 5.40 7.20 8.30 6.35 10.80 7.10 12.60 3.44 DIP Package 10.16 6.35 12.70 SMD Package For , . DIP Package 580-786014C 580-786013C 580-786012C 580-786018C 580-786011C 580-7860116C 580-786019C , 580-786151C 580-7861516C 580-786159C SMD Package 580-786014MC 580-786012MC 580-786018MC 580-786011MC , 3.71 3.69 3.67 3.59 5Vin 5Vout 2006000Vdc 3.71 3.69 3.67 3.59 Output Voltage * SMD Package For -
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SP-320-24 circuit diagram omron rs 2410 stancor p 8363 step down transformer pfc500-1024f circuit diagram SP-500-24 service manual mean well dr-4524 123-5004/M-GR 123-5006/M-GR 123-5114/M-GR 123-5116/M-GR Q26AWG R26AWG
Abstract: lead, 5-pin Super-Mini, 5-pin Chip-Scale Package, Transfer Molded, 6-Pin, D-Type Extreme , . 19 · Roadmap for Trench MOSFETs · Package Options 4-4 Low-VDSS, High-Speed MOSFETs , Improvement by Thermally Enhanced Package and New Process Technology ­ MOSBD (MOSFET with SBD) · High-Speed , package and are suitable for use in lithium-ion secondary battery protection circuits in various portable , DC-DC converters TO-220SM(W) Series (VDSS = 40 V to 150 V) The TO-220SM package, which uses Cu Toshiba
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5252 F 1009 4-pin TPC 8028 TK8A50D equivalent tk6a65d equivalent TPCA8030-H toshiba laptop charging CIRCUIT diagram
Abstract: 19-2712; Rev 0; 1/03 KIT ATION EVALU ABLE AVAIL Small, High-Efficiency, Five-Channel Digital Still Camera Power Supply o Up to 1MHz Operating Frequency o 1ÂuA Shutdown Mode o Internal Soft-Start Control o Overload Protection o Compact 32-Pin, 5mm x 5mm Thin QFN Package Ordering , available in a space-saving 32-pin thin QFN package. o Step-Down DC-to-DC Converter Operate from , soldered to the PC board to achieve package thermal and mechanical ratings. The exposed pad is Intel
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SE7320VP2 ide SLIMLINE 50-pin Marvell 8686 scsi ultra320 atmel Marvell 8686 datasheets 22 pin sata sca-2 40 pin to sata SR2400 C78845-001
Abstract: GMT Fuse Positions Maximum Panel Ampacity 15A per G58 Panel 6-Pin Jack for Power / Alarm -
OCR Scan
Abstract: Panel 6-Pin Jack for Power / Alarm Cable Set per 848665147 Figure 7-14: H569-434 G58 (ED83143 -
OCR Scan
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