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Part Manufacturer Description PDF & SAMPLES
CS42L73-CRZR Cirrus Logic Consumer Circuit, PBGA65, 5 X 5 MM, FBGA-65
CS42L73-CRZ Cirrus Logic Consumer Circuit, PBGA65, 5 X 5 MM, FBGA-65
CS61884-IB Cirrus Logic PCM Transceiver, 1-Func, CEPT PCM-30/E-1, CMOS, PBGA160, FBGA-160
LT1991HM#TRPBF Linear Technology IC OP-AMP, 285 uV OFFSET-MAX, 0.56 MHz BAND WIDTH, PDSO10, LEAD FREE, PLASTIC, MSOP-10, Operational Amplifier
LT1991HM#TR Linear Technology IC OP-AMP, 285 uV OFFSET-MAX, 0.56 MHz BAND WIDTH, PDSO10, PLASTIC, MSOP-10, Operational Amplifier
LT1991HM Linear Technology IC OP-AMP, 285 uV OFFSET-MAX, 0.56 MHz BAND WIDTH, PDSO10, PLASTIC, MSOP-10, Operational Amplifier

"285 fbga"

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: applications. General Purpose V850ES/Jx3 62 DMIPS (v2.1) Max Freq: Voltage: Pins: Flash: RAM: 32MHz 2.85 - , -bit Low Voltage Detect Group 2.85 - 3.6 2.85 - 3.6 2.85 - 3.6 2.85 - 3.6 2.85 - 3.6 2.85 - 3.6 2.85 - 3.6 2.85 - 3.6 2.2 - 3.6 2.2 - 3.6 2.2 - 3.6 2.2 - 3.6 2.2 - 3.6 2.2 - 3.6 2.2 - 3.6 2.2 - 3.6 2.2 - , LQFP WQFN LQFP WQFN LQFP LQFP FBGA LQFP FBGA LQFP FBGA LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP FBGA FBGA FBGA FBGA UPD70F3739GC-UEU-AX 32 V850ES/JG3 Renesas Technology
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renesas v850 uPD70F3745gj upd70f3805 UPD70F3793GC-UEU-AX upd70f38 UPD70F3742GC V850ES V850ES/J 384KB 1024KB 512KB 0411/4K/CPRN/BCD/SP
Abstract: , enabling the development of high value-added products. !C PACKAGES CSP(Chip Size Package) The FBGA , digital assistants (PDAs), portable phones, camcorders and digital cameras. FBGA(commonly known as C SP , mounted using conventional mounter. Can be mix mounted with SO P and QFP. · Structure of Sharp CSP(FBGA , Conventional package (QFP) C SP (FBGA) Reduction ratio QFP176-P-2424 (0.5 mm pin-pitch) FBGA160-P-1212 (0.8 mm , ) 11.3 x 26.3 x ( 2 .8 ) 13.2x28.2 x :2.85. 4.4 x 5.0 x (1.55) 6.0 x 7.8 x (1.15) 6.3 x 13.5 x (1.55 -
OCR Scan
fbga 12 x 12 thermal resistance
Abstract: NP351 Series (Open Top) Fine Ball Grid Array (FBGA) Part Number (Details) NP351 - 120 14 - * - , contact Yamaichi for further information u Open top type sockets for FBGA packages u Self contacting , -22405 NP351-285* NP351-30413-* NP351-34031-* NP351-52009 NP351-651* 60 64 80 108 112 121 128 144 144 152 160 169 175 176 176 181 192 196 201 224 285 304 340 520 651 0.8 0.8 , (FBGA) Applicable Dimensions (Reference Only) NP351-16914 (Base Socket for Grids 8 x 8 to 13 x 13 Yamaichi Electronics
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NP351-12845- 65113 FBGA 1760 NP351-17635- NP351-28508 NP351-06040 NP351-06444- NP351-08033- NP351-10820- NP351-11215- NP351-12014-
Abstract: - 12 2 LVI, CLM, DMA, CRC 2.0 to 3.6 100-LQFP (14 x 14) 121-FBGA (8 x 8) 2.85 to 3.6 , (IECUBE) 161-FBGA (10 x 10) V850E/IG4 Emulation board - In-circuit emulator, - , 9 2 LVI, CLM, DMA 2.85 to 3.6 100-LQFP (14 x 14) QB-MINI2 (MINICUBE2) 100-QFP (14 x , - - - - - - 16 2 LVI, CLM, DMA 2.85 to 3.6 144-LQFP (20 x 20) 20 , -LQFP (10 x 10) 64-FBGA (5 x 5) 64-WQFN (9 x 9) 66 16/18 6 - - 1 1 16-bit x 7 - -
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PD70F3378 PD70F3793 PD70F3368 PD70F3380 MINICUBE PD70F3731 64-LQFP 80-TQFP PD70F3704 V850ES/HG2 PD70F3706 PD70F3707
Abstract: film. Features O ther com ponents IC PACKAGES CSP (Chip Size Package) CSP The FBGA , (PDAs), cellular phones, camcorders and digital cameras. FBGA (Commonly known as CSP) Features , -pin (Package size; 16 mm x 16 mm. Pin pitch; 0.8 mm) Structure of SHARP CSP(FBGA) S tack ed P ackag e S , ) (2.85) (1.0) (1.55) (1.15) (1.55) (1.28) (2.8) (2.8) SOP 1.27(50) 11.4 (450) 13.3 (525) r , 80 100 100 120 128 144 176 48 100 28 32 32 3 6 (3 2 )'® " 48 48 48 48 FBGA (CSP) Pin pitch -
OCR Scan
Abstract: (MINICUBE2) 100-LQFP (14 x 20) 3 16/16 QB-V850MINI (MINICUBE) 3 161-FBGA (10 x 10) 1 , 2.85 3.6 144-LQFP (20 x 20) 1 2 1 8 1 LVI, CLM, DMA, CRC 2.2 3.6 80 , -LQFP (14 x 14) 100-LQFP (14 x 20) 1 2 3 1 12 2 LVI, CLM, DMA, CRC 2.85 3.6 100-LQFP (14 x 14) 1 2 4 1 16 2 LVI, CLM, DMA, CRC 2.85 3.6 144-LQFP (20 x 20) 2 2 12 2 LVI, CLM, DMA, CRC, USB2.0 2.85 3.6 100-LQFP (14 x 14) 40 u PD70F3741 NEC
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PD70F3232 PD70F3366 PD70F3350 CD 5888 PD70F3724 PD70F3717 V850ES/K V850E/I ID850 ID850-QB RX850 RX850V4
Abstract: (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead , 17.8 4.3 EP3C16 F256 28.5 25.1 23.2 21.7 9.1 EP3C16 2 Package U256 , FBGA 8.7 30.2 26.1 23.6 21.7 144 TQFP 9.9 29.8 28.3 26.9 24.9 208 PQFP 5.4 30.2 28.8 26.9 21.7 256 FBGA 7.1 27 23 20.5 18.5 , 17.8 16 FBGA 4.2 21 17 14.8 13.1 484 FBGA 3.3 19.4 15.4 13.3 Altera
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EP3C25 EP3C10 pin information ep3c10 100 PIN PQFP ALTERA DIMENSION EP3c55 EP3C40 PIN INFORMATION FOR EP3C55 U256 EP1C20 EP1C12
Abstract: Direction of Feed a) SOP CSOP SSOP TSSOP BCC, QFP LQFP FBGA, SCSP FLGA , , , , , , , EF type , 2.85 2.35 2.0 16.0 6.5 5.4 5.5 8.0 2.1 1.7 2.0 12.0 8.5 10.6 , 2.85 2.05 44.0 FPT-80P-M06 19.5 25.6 20.2 24.0 3.4 2.85 2.05 44.0 FPT-100P-M06 19.5 25.6 20.2 24.0 3.4 2.85 2.05 44.0 FPT-32P-M21 9.5 , 9.10 7.5 12.0 1.75 1.55 16.0 QFP LQFP FBGA 1.05 (continued) 481 -
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FPT-8P-M01 FPT-8P-M02 FPT-16P-M06 FPT-28P-M01 FPT-28P-M17 LGA-80 BGA-80P-M01 LGA-28 lcc 910 175 M05 FPT-14P-M04 FPT-16P-M03 FPT-20P-M01
Abstract: devices available in Ball-Grid Array (BGA), FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra , F484 EP3C40 25.1 28.8 U484 EP3C25 28.5 U256 19.8 16.3 14.6 13.2 4.8 , 26.7 24.7 PQFP 4.3 27.2 24.7 22.1 17.8 FBGA 8.8 28.7 24.5 22.3 20.5 240 PQFP 4.0 26.0 23.4 20.8 17.1 FBGA 6.6 24.3 20.2 18.1 , Count 144 Device FBGA 6.1 23.0 19.8 17.7 16.1 DS-CYTHRML-3.0 Altera Altera
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E144 EP2C35-F484 F256 M164
Abstract: (JFG) pin table clean up and added FBGA package (JFG) added FBGA package for 285 device (JFG , EMI 290mV 1V ( 1.2V) PLL 56 TSSOP DS90CR285SLC 64 0.8mm BGA (FBGA , ( 4 ) (FBGA 20 ) 260 (VCC) 220 (TA) ( 25 ) DS90CR285MTD , (FBGA) I/O No. TxIN I 28 TTL TxOUT O 4 LVDS TxOUT - O , I 4 TTL http://www.national.com 12 DS90CR285 SLC64A (FBGA) GND National Semiconductor
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DS90CR286 DS90CR286ASLC MTD56 DS90CR286MTD 231MB TIA/EIA-644
Abstract: : RoHS: Spansion, Inc. Akihisa Haraguchi (akihisa.haraguchi@spansion.com) FBGA (one live die, no , : RoHS: Spansion, Inc. Akihisa Haraguchi (akihisa.haraguchi@spansion.com) FBGA (one live die, no , (akihisa.haraguchi@spansion.com) FBGA (one live die, no spacer die), FBA 048, Pb-free Solder Balls 6.15 mm x 8.15 mm Weight , Haraguchi (akihisa.haraguchi@spansion.com) FBGA (one live die, no spacer die), FBA 048, SnPb Solder Balls , : Dimension: RoHS: Spansion, Inc. Akihisa Haraguchi (akihisa.haraguchi@spansion.com) FBGA (one live Spansion
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EME-G600 Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 sumitomo g770 Ablestik ablebond 3230 epoxy JIG-101 2002/95/EC
Abstract: THE JEDEC REGISTERED OUTLINE MO-246 UNLESS OTHERWISE SPECIFIED TITLE 285-FBGA Samsung Electronics
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ADS25317 0X13 5M-1994 285-FBGA-13 JS-07012-O
Abstract: 161-pin FBGA F1 1.13 mm 10×10 mm 0.65 mm PD70F3454 3 2 2010.11 2 , 100-pin LQFP2 GF 1.4 mm 14×20 mm 0.65 mm 64-pin FBGA F1 0.91 mm 5×5 mm 0.5 mm V850ES/Jx3 80-pin LQFP GC 1.4 mm 14×14 mm 0.65 mm 121-pin FBGA F1 1.21 mm 8×8 mm 0.65 mm , 0.5 mm 64-pin WQFN K8 0.75 mm 9×9 mm 0.5 mm 113-pin FBGA F1 0.91 mm 8×8 mm 0.65 mm 4. 64 K RAM 5. uPD70F3824 3 2 2010.11 304-pin FBGA F1 1.11 mm 19×19 mm 0.8 mm Renesas Electronics
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uPD70F3766 uPD70F35 uPD70F3793 uPD70F3453 QB-V850ESJG3U-TB uPD70F3740 V850E R01CL0006JJ0200 V850ES/HE3 V850ES/HG3 V850ES/HJ3 V850ES/HF3
Abstract: 176 pins (QFP & FBGA) · Memory size: ROM: ROMless to 512 KB RAM: 4 to 200 KB 150 MHz @ 323 MIPS , · Package: 64 to 208 pins (QFP & FBGA) V850ES CPU Low-end lineup Low-end lineup 50 MHz @ , size: ROM: ROMless to 1024 KB RAM: 4 to 124 KB · Package: 40 to 144 pins (QFN & QFP & FBGA , products All Flash products 103 MIPS @ 50 MHz, 2.85 to 3.6 V operation (A/D converter, USB controller: 3.0 to 3.6 V) 98 MIPS @ 48 MHz, 2.85 to 3.6 V operation (A/D converter, USB controller: 3.0 Renesas Technology
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uPD63763 PD720150 cosmo 3010 datasheet CEB-V850ES/FJ3 V850 Fx3 instruction set SP850 R01CL0003EJ0100 U15412EJ9V0PF00
Abstract: I18N a44e : WFP W : WAFER Y : FBGA 2 : FCBGA 4 : TEBGA 6 : PBGA 5~6. Application Category 0n : General , Microcontroller Code Information(3/3) Last Updated : August 2009 S3XXXXXXXX - XXXX - XXXXXX 1 2 - FBGA A , 4 5 6 7 8 B : 424 E : 208 H : 285 L : 400 O : 272 R : 73 V : 112 Z : 88 4 Samsung Electronics
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ARM10 HT80C51 fBGA package tray 12 x 19 FCCSP SecuCalm 22N28 cortex my SC-200 SC-100 SC-300
Abstract: I18N 1Z89 R : TSSOP S : SOP U : WFP W : WAFER Y : FBGA 2 : FCBGA 4 : TEBGA 6 : PBGA B : LGA D : DIP , FBGA A : 337 D : 160 G : 121 K : 504 N : 169 Q : 289 U : 461 Y : 380 3 : 228 6 : 330 9 : 137 3 4 5 6 7 8 B : 424 E : 208 H : 285 L : 400 O : 272 R : 73 V : 112 Z : 88 Samsung Electronics
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SecuCalm16
Abstract: I18N H285 : WFP W : WAFER Y : FBGA 2 : FCBGA 4 : TEBGA 6 : PBGA 5~6. Application Category 0n : General , FBGA A : 337 D : 160 G : 121 K : 504 N : 169 Q : 289 U : 461 Y : 380 3 : 228 6 : 330 9 : 137 3 4 5 6 7 8 B : 424 E : 208 H : 285 L : 400 O : 272 R : 73 V : 112 Z : 88 Samsung Electronics
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Abstract: VCCIB6 U9 VCCIB6 V9 VCCIB7 D1 v2.7 3-11 Axcelerator Family FPGAs 256-Pin FBGA , G H J K L M N P R T Figure 3-3 · 256-Pin FBGA (Bottom View) Note For Package , /package/index.html. 3 -1 2 v2.7 Axcelerator Family FPGAs 256-Pin FBGA 256-Pin FBGA AX125 Function 256-Pin FBGA Bank 0 AX125 Function Pin Number AX125 Function Pin Number , K4 Bank 4 v2.7 3-13 Axcelerator Family FPGAs 256-Pin FBGA 256-Pin FBGA 256 Actel
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729-Pin AG18 Axcelerator FPGAs FBGA 896 IO126PB3F11 180-P IO32NB3F3 IO59NB5F5 IO59PB5F5 IO00NB0F0 IO32PB3F3
Abstract: EE-1312 )] (1.0mm TBGA) (1.27mm TBGA) (32/48 FBGA) (60/90 FBGA) [PBGA()] [PBGA()] (119/153 PBGA) 1997.05 , 285, 490 × 290, 550 × 350, 550 × 450 (mil) QFN E × D QTP D2 E × D 300 × 300, 350 × 350, ., 1150 × 1150 (mil) 350 × 285, ., 650 × 450 (mil) 35, 48, 70 (mm) E × D 14 × 14, 16 × 16, ., 36 × NEC
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SC47D ED7304 UPD4011BG UPD4011 48 pin ic qfj ED-7419 ED-7407 M7A98 C10535J IEC/SC47D ED7300 ED7301
Abstract: Axcelerator Family FPGAs 256-Pin FBGA A1 Ball Pad Corner 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T Figure 3-3 · 256-Pin FBGA (Bottom View) 3 -1 2 v2.3 Axcelerator Family FPGAs 256-Pin FBGA 256-Pin FBGA AX125 Function 256-Pin FBGA Bank 0 AX125 Function Pin Number AX125 Function Pin Number IO21PB2F2 , K4 Bank 4 v2.3 3-13 Axcelerator Family FPGAs 256-Pin FBGA 256-Pin FBGA 256 -
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CCGA 624 CCGA AD 149 AE9 FBGA 63 IO00PB0F0 IO34NB3F3 IO02NB0F0 IO34PB3F3 IO60NB6F6 IO02PB0F0
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