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"10-pin plastic dip" amd

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Abstract: -pln Plastic DIP 24-pin Ceramic DIP 28-pln Plastic P LC C 24-pln Plastic DIP 24-pln Ceramic DIP 28-pln Plastic P LC C 24-pln Ceramic DIP Commercial Commercial Commercial Industrial Industrial , NQ26V12H-XX 28-pln Plastic DIP[2] 28-pln Ceramic DIP[2] 28-pin Plastic PLCC[2] Commercial Commercial , Temperature AMD/MMI AMD/MMI AMD/MMI AMD/MMI AMD/MMI AMD/MMI AMD/MMI PALCE20RA10Z-XXPC PALCE20RA1 , -pln Plastic DIP Ceramic DIP Plastic PLCC Ceramic DIP Commercial Commercial Commercial Military C -
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PALCE20RA10Z-XXJC PALCE20RA10Z-XXPI PALCE20RA1OZ-XXDI PALCE20RA10Z-XX PALCE20RA10Z-XXDM PQ20RA10Z-XX
Abstract:   AMD3 AMD Physical Dimensions PD3024 24-Pin (Slim) Plastic DIP 1.150 1.270 .240 .280 T ,   0257527 0032122 £ 1 AMD b2fl â  AMD3 Physical Dimensions PL 028 28-Pin Plastic ,   G E 5 7 5 2 7 0 0 3 2 1 2 3 Sb4 â  AMD3 AMD £ 1 PL 084 84-Pin Plastic Leaded Chip Carrier , « 84-Pin Plastic Leaded Chip Carrier (PL 084) SPEED OPTION -1 6 .1 6 MHz -25 - 25 MHz DEVICE , -16 1-117 ADVANCE ¡T I AMD INFORMATION PIN SUMMARY Pin Function Pin Name Type -
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79C940-16/25 79C945-16 79C940 10BASE-T 79C945 06566C
Abstract: 0 2 S 7 52 7 D D 3 2 12 1 7^1 AMD3 AMD E l Physical Dimensions PD3024 24-Pin (Slim) Plastic , 84-Pin Plastic Leaded Chip Carrier 5-7 ADV MICRO E l AMD (TELECOM) SRE J > m , Commercial (0 to +70°C) PACKAGE TYPE J . 84-Pin Plastic Leaded Chip Carrier (PL 084) SPEED OPTION - 1 , D 2 5 7 5 2 7 DOBlfibS 4T2 AMD3 AMD E l INFORMATION PIN SUMMARY (Continued) Pin Name , A M D 3 Physical Dimensions PD020 20-Pin Plastic DIP .045 .065 .090 .110 TOP VIEW -
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1x012 AM79C940 DD3165T 06751F BV8P1028 07644C 1X012
Abstract:   AMD3 AMD £1 PL 084 84-Pin Plastic Leaded Chip Carrier wered by ICminer.com Electronic-Library Service , J - 84-Pin Plastic Leaded Chip Carrier (PL 084) SPEED OPTION -16-16 MHz -25 - 25 MHz DEVICE NUMBER , ) 5^E ]> â  D257527 DOBlfibS 4T2 â  AMD3 ADVANCE INFORMATION AMD £1 PIN SUMMARY (Continued) Pin , Physical Dimensions PD020 20-Pin Plastic DIP .090 .110 TOP VIEW .014 .022 SIDE VIEW SL°. 7° .300 .325 / .008 ^^015 \ .330 .430 END VIEW 07552C CA 3 PD 020 12/18Ã91 cdc PD 048 48-Pin Plastic DIP 2.390 -
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AM7997 10BASE2 10BASE5 333D DD321 Ud32 DD32121 07089F-001 GE57527
Abstract: 75°C) C. PACKAGE TYPE P - 24-Pin (600-Mil) Plastic DIP (PD 024) D - 24-Pin (600-Mil) Ceramic DIP (CD 024) L = 32-Pin Rectangular Ceramic Leadless Chip Carrier (CLR032) J = 28-Pin Plastic Leaded Chip , -Mil) Plastic DIP (PD3024) D = 24-Pin (300-Mil) Ceramic DIP (CD3024) b. SPEED OPTION A = 35 ns Blank = 50 ns , through E. Test conditions are selected at AMD's option. _ PIN DESCRIPTION Ao-A« Address Input , »C t »i HC J i ii i»C 18 5 °a °*r O, : D13 013 â'¢Also available in a 300-mil DIP and a 24-pin -
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27S281 27S181A 27s181 AM27S181 AM27S181A 27S181 192-B BD006302
Abstract: AMD 80C287 80-Bit CMOS Math Coprocessor PACKAGE TYPE N - 44-pin Plastic Leaded Chip Carrier (PL 044) P - 40-pin Plastic DIP (PD 040) TEMPERATURE RANGE Blank - Commercial (Tc - 0°C to 70°C) Valid , AMD CONNECTION DIAGRAM Plastic DIP (PD 040) PLCC (PL 044) N/C N/C C c 1 â'¢ 2 40 39 N/C â¡ CKM , , logarithmic, exponential, and arithmetic Instructions to the 80C286 Instruction set AMD 80C287â"¢ 80 , 12-MHz speed grades â  Available In space-saving 44-pln PLCC as well as 40-pin DIP â  80 -
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amd processor based Circuit Diagram math coprocessor 11671A-002 80C287-10 AMD CPU ARITHMETIC COPROCESSOR 10-MH 12-MH 80C286-
Abstract: . 11671A-002 PIN DESCRIPTION BOS? Busy Status (Output; Active Low) A Low level indicates that the AMD , 80C287 -10 80-Bit CMOS Math Coprocessor PACKAGE TYPE N - 44-pin Plastic Leaded Chip Carrier (PL 044) P - 40-pin Plastic DIP (PD 040) TEMPERATURE RANGE Blank » Commercial (Tc - C C to 70 , AMD 80C287TM 80-Bit CMOS Math Coprocessor DISTINCTIVE CHARACTERISTICS High-performance CMOS process yields 10-MHz and 12-MHz speed grades Available In space-saving 44-pln PLCC as well as 40-pin DIP -
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D15-D0
Abstract: -Mil) Plastic DIP (PD 024) D - 24-Pin (600-Mil) Ceramic DIP (CD 024) L = 32-Pin Rectangular Ceramic Leadless Chip Carrier (CLR032) J = 28-Pin Plastic Leaded Chip Carrier (PL 028) b. SPEED OPTION A = 35 ns , -Mil) Plastic DIP (PD3024) D = 24-Pin (300-Mil) Ceramic DIP (CD3024) b. SPEED OPTION A = 35 ns Blank = 50 ns , conditions are selected at AMD's option. _ PIN DESCRIPTION Ao-A« Address Input* The 10-bit field , ti i»C is 5 °a °*r O, : D13 013 â'¢Also available in a 300-mil DIP and a 24-pin Flalpack. Pinout -
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AM27S181/BJA CERAMIC LEADLESS CHIP CARRIER LCC 24 27S281A 27S281/27S281A TC003441 TC003452
Abstract: Industrial (-40 to +85°C) c. PACKAGE TYPE P - 32-Pin Plastic DIP (PD 032) J - 32-Pin Rectangular Plastic , in plastic DIP and plastic leaded chip carrier (PLCC), and in DIE form Latch-up protected to 100mA , standard topside for plastic packaging. It is organized as 262,144 by 8 bits and is available in plastic DIP as well as plastic leaded chip carrier (PLCC) packages. ExpressROM Devices provide a board-ready , bus microprocessor system. AMD's CMOS process technology provides highspeed, low power, and high noise -
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15CS2 AM27X020 27X020 IN3064 KS000010
Abstract: 17 025752fl DDBH^BM 564 n AMD_ PHYSICAL DIMENSIONS PD 032 32-Pin Plastic DIP (measured in inches) .065 M1N PL 032 32-Pin Rectangular Plastic Leaded Chip Carrier (measured in inches) .020 .042 .050 MIN 16 Am27C010 I 0257553 0032T35 410 â  AMD PHYSICAL DIMENSIONS TS 032 32-Pin TSOP Standard , configuration. Am27C010 13 0257526 0032^21 AMD £1 PIN DESIGNATIONS A0-A16 = Address Inputs CE (E) = Chip , °C) PACKAGE TYPE P = 32-Pin Plastic DIP (PD 032) J = 32-Pin Rectangular Plastic Leaded Chip Carrier (PL 032 -
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27C010 amd socket 940 pinout BXA 4250 8050 lib AM27C010-120 apl 117 8M-5/94-0 10205E
Abstract: P - 24-Pin (300 mil) Plastic SKINNYDIP (PD3024) J » 28-Pin Plastic Leaded Chip Carrier (PL 028) D , PACKAGE TYPE NS - 24-Pin 300 mil Plastic SKINNYDIP (PD3024) FN = 28-Pin Plastic Leaded Chip Carrier (PL 028), JEDEC pinout NL - 28-Pin Plastic Leaded Chip Carrier (PL 028), non-JEDEC pinout JS = 24-Pin , PAL20R8 PAL20R6 PAL20R4 i-m PAL20RBB/A (Mil) AMD FUNCTIONAL DESCRIPTION Standard 24-Pin PAL , COM'L: -5/7/B/B-2/A, 10/2 MIL: -10/12/15/B/A a PAL20R8 Family 24-Pin TTL Programmable Array -
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PAL20L8 MMI PAL 20R4 MMI TOP MARKING mmi pal20l8 amd part marking 20L8 PAL20R8-5 PAL20R8A
Abstract: grades and is provided in 44-pin PLCC and 40-pin DIP packages. When coupled with the 80C286, the AMD , PACKAGE TYPE N - 44-pin Plastic Leaded Chip Carrier (PL 044) P > 40-pin Plastic DIP (PD 040) TEMPERATURE , ADVANCED I1ICR0 DEVICES MflE D G2S7SS5 QOmblfl 3 â  AMD1 Z-05 AMD 80C287â"¢ 80-Bit CMOS , process yields 10-MHz and 12-MHz speed grades â  Available in space-saving 44-pin PLCC as well as 40-pin , , exponential, and arithmetic instructions to the 80C286 Instruction set GENERAL DESCRIPTION The AMD 80C287 -
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cpu audi NPS-2 119S9A-007 D15-D0- T-49-12-05
Abstract: Am27C020 15 G25752Ã 0032152 STT CI AMD PHYSICAL DIMENSIONS* PD 032 32-Pin Plastic Dual-ln-Line , P = 32-Pin Plastic DIP (PD 032) J = 32-Pin Rectangular Plastic Leaded Chip Carrier (PL 032) E = 32-Pin , Am27C020 13 â¡ 25752fl â¡Ã32C15G 727 in AMD PHYSICAL DIMENSIONS* CDV032 32-Pin Ceramic DIP with UV , 0257526 0032151 Lb3 â  AMD ZI PHYSICAL DIMENSIONS* CLV032 32-Pin Rectangular Ceramic Leadless Chip , ".022 .015 .060 K .600 .625 .630 .700 16-038-SB PD 032 DA75 6-23-94 ae PL 032 32-Pin Plastic -
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27C020 SSC 9500 electra 171 KSS 8006 AMD 27C020 8M-7/94-0 11507E
Abstract: 4-51 AMD PD3028 28-Pin 300 mil Plastic SKINNYDIP (measured in inches) 1.375 1.400 .300 , Dimensions 4-53 AMD SO 024 24-Pin Plastic Gull-Wing Small Outline Package (measured in inches , .008 .018 16-000038H-3 CD3024 DF9 3-30-95 ae 4-47 AMD CFL024 24-Pin Ceramic Flatpack , 4-48 Physical Dimensions AMD CL 020 20-Pin Ceramic Leadless Chip Carrier (measured in inches , 16-0000038C-5 CL 020 DF46 3-30-95 ae 4-49 AMD CL 028 28-Pin Ceramic Leadless Chip Carrier Vantis
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D-F79 AMD pd 020 CERAMIC FLATPACK 20pin AMD pd 016 16-000038H 16-038-SQ
Abstract: to +70°C) I - Industrial (-40 to +85°C) c. P J X PACKAGE TYPE - 32-Pin Plastic DIP (PD 032) - 32-Pin Rectangular Plastic Leaded Chip Carrier (PL 032) - Die b. SPEED OPTION See Product , leadtime - Lower volume per code Available In plastic DIP and plastic leaded chip carrier (PLCC), and In , topside for plastic packaging. It is organ ized as 131,072 by 8 bits and is available in plastic DIP as well as plastic leaded chip carrier (PLCC) packages. ExpressROM Devices provide a board-ready memory -
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27X010
Abstract: . TEMPERATURE RANGE C - Commercial (0 to + 75°C) C. PACKAGE TYPE P - 24-Pin (600-Mil) Plastic DIP (PD 024 , (CLR032) J = 28-Pin Plastic Leaded Chip Carrier (PL 028) b. SPEED OPTION A = 35 ns Blank * 60 ns , (300-Mil) Plastic DIP (PD3024) D = 24-Pin (300-Mil) Ceramic DIP (CD3024) b. SPEED OPTION A = 35 ns , through E. Test conditions are selected at AMD's option. PIN DESCRIPTION A 0 -A 9 Address Inputs The , -mil DIP and a 24-pin Flatpack. Pinout identical to those listed here for the 600-mil DIP. "Also available -
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27S181/27S181A
Abstract: /DESCRIPTION AMD 80C287 80-Bit CMOS Math Coprocessor PACKAGE TYPE N - 44-pin Plastic Leaded Chip Carrier (PL 044) P - 40-pin Plastic DIP (PD 040) TEMPERATURE RANGE Blank - Commercial (Tc - 0°C to 70°C) Valid , Powered by ICminer.com Electronic-Library Service CopyRight 2003 a AMD CONNECTION DIAGRAM Plastic DIP (PD , orientation. PIN DESCRIPTION BUS? Busy Status (Output; Active Low) A Low level indicates that the AMD 80C287 , , exponential, and arithmetlc Instructions to the 80C286 Instruction set AMD 80C287â"¢ 80-Bit CMOS Math -
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U15-D
Abstract: Commercial (0 to +75°C) PACKAGE TYPE P = 20-Pin Plastic DIP (PD 020) D = 20-Pin Ceramic DIP (CD 020) L = 20-Pin Ceramic Leadless Chip Carrier (CL 020) J = 20-Pin Plastic Leaded Chip Carrier (PL 020) SPEED , 's option. Valid Combinations AM27S23 /BRA, /BSA, /B2A AM27S23A 4 Am27S23/Atn27S23A 4 AMD SI PIN , Publication* 13*12 Rw. A Amendment» Imum Date: Augu»t 1t*1_ AMD CONNECTION DIAGRAMS Top View DIPS* ao , ] Vcc ]A7 ]A6 1 as ]G2 ]S, ]07 ]Qa ]Qs ]Q4 15912A-002A Note: Pin 1 is marked for orientation -
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AMD Bipolar PROM programming AMD PCB design guide 256X8 prom AMD Pin Package 27S23/A 27S23A 048-B 27S23
Abstract: rectangular Plastic Leaded Chip Carrier. Notes: 1. JEDEC nomenclature is in parenthesis. 2. The 32-pin DIP to , ) I = Industrial (-40 to+85°C) d. c. PACKAGE TYPE P = 32-Pin Plastic DIP (PD 032) J = 32-Pin , current Programming voltage: 12.75 V Single +5 V power supply Compact 32-Pin DIP package requires no , avail able in windowed ceramic DIP and LCC packages, as well as plastic one-time programmable (OTP , ) controls, thus eliminating bus contention in a multiple bus microprocessor system. AMD's CMOS process -
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Abstract: . TEMPERATURE RANGE C » Commercial (0 to +70°C) I « Industrial (-40 to +85°C) c. PACKAGE TYPE P - 32-Pin Plastic DIP (PD 032) J - 32-Pin Rectangular Plastic Leaded Chip Carrier (PL 032) X - Die b. SPEED OPTION See , leadtime - Lower volume per code Available in plastic DIP and plastic leaded chip carrier (PLCC), and In , plastic packaging. It is organ ized as 262,144 by 8 bits and is available in plastic DIP as well as plastic leaded chip carrier (PLCC) packages. ExpressROM Devices provide a board-ready memory solution for -
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