Direct from the Manufacturer

Part Manufacturer Description PDF & SAMPLES
X9520B20I-B Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20
X9520B20I-A Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20
HSP50216KI Intersil Corporation TELECOM, CELLULAR, BASEBAND CIRCUIT, PBGA196, 12 x 12, BGA-196
DRA622CIZKKRQ1 Texas Instruments 640-BGA
DRA622CIZKKQ1 Texas Instruments 640-BGA
LMH6504MM/NOPB Texas Instruments Wideband, Low Power, Variable Gain Amplifier 8-VSSOP -40 to 85

"0.4mm" bga "ball collapse" height

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: TMS320 DSP Number 89 DESIGNER'S NOTEBOOK TMS320C6x Manufacturing with the BGA Package , ? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller size, greater , into account when building a board. For reliable operation with a BGA package, ensure that the device , device and the board, there is generally a lower stress concentration on the BGA solder joint, which , When mounting a BGA device, it is recommended that flux be used, as it aids the wetting of the solder Texas Instruments
TMS320C6201 AN1231 BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm tms320 solder reflow 0.4mm pitch BGA routing TMS320C6
Abstract: TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital , . 10 TMS320C6x Manufacturing with the BGA Package Abstract This document describes how to , DSP is manufactured in the BGA package due to its smaller size, greater pitch, higher manufacturing , . TMS320C6x Manufacturing with the BGA Package 7 SPRA429 Product Support World Wide Web Our World , business day. 8 TMS320C6x Manufacturing with the BGA Package SPRA429 Design Problem How do I Texas Instruments
TMS320C6x 0.35mm BGA BGA NSMD ball BGA 0.35mm pitch
Abstract: trend (customer requirement) QFP 0.5 mm pitch BGA (ball grid array) 1.27 mm ball pitch QFP 0.4 , Soldering difficulties Bare chip (flip chip) · PWB/ASSY cost up Fine pitch BGA (0.5, 0.8, 1.0 mm ball pitch) QFP-0.5 BGA Package size QFP-0.4 CSP Bare chip (bump) Pin count Figure , paste Short loop X'fer mode BGA unique process Ball attach IR reflow 0.30 mm DIA , BGA pad through the internal layers of the board, as shown in Figure 9. By working vertically and Texas Instruments
SPRAA99 65X65 nFBGA 12x12 bga thermal resistance TEXAS INSTRUMENTS, Mold Compound, CSP SN 29733 385Z
Abstract: array (BGA) chip carrier to extend IBM's comprehensive interconnect offering into the high performance , attach reliability, but the BGA interconnect is not as reliable. Other organics offer good , industry standard full array FCA and eutectic BGA surface mount technology (SMT) card mounting. It has , characteristics can be achieved in a package with low BGA interconnect stress and low die attach stress through , bonded thermal enhancement lid, up to 8 decoupling capacitors, and full-array of solder balls (BGA -
cga 624 ibm semi
Abstract: height from the PCB. As the thermal cycle reliability of BGA components is directly related to standoff , guarantee quality of both the process and the resulting joint. In contrast, BGA packages, when attached to , successfully implement BGA packages into the surface mount assembly process. amkor anam Page 2 2.0 BGA Solder Joint Reliability In all packaging, it is not good enough to simply create an , concept of reliability. As with most SMT packaging, the weakest link in cycling BGA assemblies is the Amkor Anam
BGA PACKAGE thermal profile BGA reflow guide BGA and QFP Package pitch 0.4mm BGA pcb warpage* in smt reflow pcb warpage
Abstract: Count Range 49 7x7 Package Thickness Nominal (mm) 56 7x8 Bump Height Nominal (mm , paste block height. 1. Solder Paste Reflow And Cleaning 5. 2. 3. 4. · Micro SMDxt , is similar to the one used for most BGA and CSP packages. Additional solder paste is required to be National Semiconductor
AN-1412 ALIVH JESD22-B111 national semiconductor pb-free marking B111 gold embrittlement
Abstract: STD-020. 3. These Intersil Pb-free WLCSP and BGA packaged products employ special Pb-free material , compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free WLCSP and BGA , defined pad design per Intersil Tech Brief www.intersil.com/data/tb/tb451.pdf 7. Ball height and post saw Intersil
PSE25201B-2R2MS 1239AS-H-2R2M PSE25201B TFM201610 TFM201610A2R2M PSE25201 ISL9113 FN8313 SPP-010
Abstract: ABTE16245 app abstract din 7167 g1d5 002 01 uua-145- 972-644-5780, or visit the TI home page at http://www.ti.com MicroStar BGA, MicroSTAR Jr., OEC, TI-OPC Texas Instruments
msi 7267 MOTHERBOARD SERVICE MANUAL ttl cookbook msi ms 7267 MOTHERBOARD CIRCUIT diagram PCF 799 crystal oscillator 8MHz 4 pins smd diode MARKING F5 44C MO-153 S-PQFP-G52 MS-022 GDFP1-F48 GDFP1-F56