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Part Manufacturer Description PDF & SAMPLES
X9520B20I-B Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20
X9520B20I-A Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20
HSP50216KI Intersil Corporation TELECOM, CELLULAR, BASEBAND CIRCUIT, PBGA196, 12 x 12, BGA-196
DRA622CIZKKRQ1 Texas Instruments 640-BGA
DRA622CIZKKQ1 Texas Instruments 640-BGA
LMH6504MM/NOPB Texas Instruments Wideband, Low Power, Variable Gain Amplifier 8-VSSOP -40 to 85

"0.4mm" bga "ball collapse" height

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: TMS320 DSP Number 89 DESIGNER'S NOTEBOOK TMS320C6x Manufacturing with the BGA Package , ? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller size, greater , into account when building a board. For reliable operation with a BGA package, ensure that the device , device and the board, there is generally a lower stress concentration on the BGA solder joint, which , When mounting a BGA device, it is recommended that flux be used, as it aids the wetting of the solder Texas Instruments
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TMS320C6201 AN1231 BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm tms320 solder reflow 0.4mm pitch BGA routing TMS320C6
Abstract: TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital , . 10 TMS320C6x Manufacturing with the BGA Package Abstract This document describes how to , DSP is manufactured in the BGA package due to its smaller size, greater pitch, higher manufacturing , . TMS320C6x Manufacturing with the BGA Package 7 SPRA429 Product Support World Wide Web Our World , business day. 8 TMS320C6x Manufacturing with the BGA Package SPRA429 Design Problem How do I Texas Instruments
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TMS320C6x 0.35mm BGA BGA NSMD ball BGA 0.35mm pitch
Abstract: trend (customer requirement) QFP 0.5 mm pitch BGA (ball grid array) 1.27 mm ball pitch QFP 0.4 , Soldering difficulties Bare chip (flip chip) · PWB/ASSY cost up Fine pitch BGA (0.5, 0.8, 1.0 mm ball pitch) QFP-0.5 BGA Package size QFP-0.4 CSP Bare chip (bump) Pin count Figure , paste Short loop X'fer mode BGA unique process Ball attach IR reflow 0.30 mm DIA , BGA pad through the internal layers of the board, as shown in Figure 9. By working vertically and Texas Instruments
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SPRAA99 65X65 nFBGA 12x12 bga thermal resistance TEXAS INSTRUMENTS, Mold Compound, CSP SN 29733 385Z
Abstract: array (BGA) chip carrier to extend IBM's comprehensive interconnect offering into the high performance , attach reliability, but the BGA interconnect is not as reliable. Other organics offer good , industry standard full array FCA and eutectic BGA surface mount technology (SMT) card mounting. It has , characteristics can be achieved in a package with low BGA interconnect stress and low die attach stress through , bonded thermal enhancement lid, up to 8 decoupling capacitors, and full-array of solder balls (BGA -
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cga 624 ibm semi
Abstract: height from the PCB. As the thermal cycle reliability of BGA components is directly related to standoff , guarantee quality of both the process and the resulting joint. In contrast, BGA packages, when attached to , successfully implement BGA packages into the surface mount assembly process. amkor anam Page 2 2.0 BGA Solder Joint Reliability In all packaging, it is not good enough to simply create an , concept of reliability. As with most SMT packaging, the weakest link in cycling BGA assemblies is the Amkor Anam
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BGA PACKAGE thermal profile BGA reflow guide BGA and QFP Package pitch 0.4mm BGA pcb warpage* in smt reflow pcb warpage
Abstract: Count Range 49 7x7 Package Thickness Nominal (mm) 56 7x8 Bump Height Nominal (mm , paste block height. 1. Solder Paste Reflow And Cleaning 5. 2. 3. 4. · Micro SMDxt , is similar to the one used for most BGA and CSP packages. Additional solder paste is required to be National Semiconductor
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AN-1412 ALIVH JESD22-B111 national semiconductor pb-free marking B111 gold embrittlement
Abstract: STD-020. 3. These Intersil Pb-free WLCSP and BGA packaged products employ special Pb-free material , compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free WLCSP and BGA , defined pad design per Intersil Tech Brief www.intersil.com/data/tb/tb451.pdf 7. Ball height and post saw Intersil
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PSE25201B-2R2MS 1239AS-H-2R2M PSE25201B TFM201610 TFM201610A2R2M PSE25201 ISL9113 FN8313 SPP-010
Abstract: ABTE16245 app abstract din 7167 g1d5 002 01 uua-145- 972-644-5780, or visit the TI home page at http://www.ti.com MicroStar BGA, MicroSTAR Jr., OEC, TI-OPC Texas Instruments
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msi 7267 MOTHERBOARD SERVICE MANUAL ttl cookbook msi ms 7267 MOTHERBOARD CIRCUIT diagram PCF 799 crystal oscillator 8MHz 4 pins smd diode MARKING F5 44C MO-153 S-PQFP-G52 MS-022 GDFP1-F48 GDFP1-F56